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Method for preparing silicon carbide whisker direct-doping and in-situ growth cooperated toughened high-temperature resistant adhesive

A silicon carbide whisker and high-temperature-resistant glue technology, which is applied in the field of silicon carbide whisker direct mixing and in-situ growth synergistically toughened high-temperature-resistant glue, can solve problems such as application limitations, and achieve improved thermal cycle resistance and fracture resistance Toughness improvement, effect of bond strength and toughness improvement

Inactive Publication Date: 2019-01-18
CIVIL AVIATION UNIV OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The toughening and strengthening effect of in-situ growth of whiskers is significantly higher than that of direct whisker doping, but because it is only suitable for high-temperature environments with temperatures higher than 1000 ° C, its application is very limited
[0004] Based on the above analysis, it can be seen that the two toughening methods of whisker direct incorporation and whisker in-situ growth have their own advantages and limitations, but how to use the advantages of the two methods to achieve synergistic toughening has not been reported.

Method used

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  • Method for preparing silicon carbide whisker direct-doping and in-situ growth cooperated toughened high-temperature resistant adhesive
  • Method for preparing silicon carbide whisker direct-doping and in-situ growth cooperated toughened high-temperature resistant adhesive
  • Method for preparing silicon carbide whisker direct-doping and in-situ growth cooperated toughened high-temperature resistant adhesive

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The method for preparing silicon carbide whisker direct doping and in-situ growth synergistically toughened high-temperature-resistant glue provided in this example includes the following steps in order:

[0039] (1) Iron powder and copper powder are mixed with a mass ratio of 1:1, then put into a ball mill tank, and ball milled at a speed of 1800r / min for 1 hour to make a mixture 1, which is stored for later use;

[0040] (2) Mix carbon black powder and silicon powder at a molar ratio of 2:1 to make mixture 2, then put it into a ball mill jar, and then add the above-mentioned mixture 1. The mass fraction of the total amount is 7%, and then ball milled at a speed of 3000r / min for 2h, fully mixed evenly to make a mixture 3;

[0041] (3) Mix silicon powder, silicon dioxide powder and boron carbide powder at a mass ratio of 9.5:5:4 to make mixture 4, then put it into a ball mill jar, then add the above mixture 1, mixture 1 The mass fraction of the added amount accounting ...

Embodiment 2

[0049] The method for preparing silicon carbide whisker direct doping and in-situ growth synergistically toughened high-temperature-resistant glue provided in this example includes the following steps in order:

[0050] (1) Iron powder and copper powder are mixed with a mass ratio of 1:0.8, then put into a ball mill tank, and ball milled at a speed of 1500r / min for 2h to make a mixture 1, which is stored for later use;

[0051] (2) Mix carbon black powder and silicon powder at a molar ratio of 1:1 to make mixture 2, then put it into a ball mill jar, and then add the above-mentioned mixture 1, and the amount of mixture 1 accounts for 2 The mass fraction of the total amount is 3%, and then ball milled at a speed of 2000r / min for 1 hour, and mixed thoroughly to form a mixture 3;

[0052] (3) Mix silicon powder, silicon dioxide powder and boron carbide powder with a mass ratio of 9.2:4.8:3.7 to make mixture 4, then put it into a ball mill jar, then add the above mixture 1, mixture...

Embodiment 3

[0060] The method for preparing silicon carbide whisker direct doping and in-situ growth synergistically toughened high-temperature-resistant glue provided in this example includes the following steps in order:

[0061] (1) Iron powder and copper powder are mixed with a mass ratio of 1:1.2, then put into a ball mill jar, and ball milled for 1 hour at a speed of 2000r / min to make a mixture 1, which is stored for later use;

[0062] (2) Mix carbon black powder and silicon powder at a molar ratio of 1.5:1 to make mixture 2, then put it into a ball mill jar, then add the above-mentioned mixture 1, and the amount of mixture 1 accounts for the amount of mixture 2 The mass fraction of the total amount is 5%, and then ball milled at a speed of 2500r / min for 2 hours, and fully mixed evenly to make a mixture 3;

[0063] (3) Mix silicon powder, silicon dioxide powder and boron carbide powder with a mass ratio of 9.7:5.2:4.2 to make mixture 4, then put it into a ball mill jar, then add th...

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Abstract

The invention relates to a method for preparing a silicon carbide whisker direct-doping and in-situ growth cooperated toughened high-temperature resistant adhesive. According to the method, silicon carbide whiskers for direct doping are prepared in advance by taking carbon black and silicon powder as raw materials and taking ferrum and copper as catalysts; the adhesive is prepared through the steps of stirring, mixing and the like by taking phosphoric acid and aluminum hydroxide reactant liquor as an adhesive matrix, taking silicon powder, silicon dioxide powder and boron carbide powder as additives, taking ferrum powder and copper powder as a whisker growth catalyst and taking ready-made silicon carbide whiskers as a strengthening phase. The method has the effects that the high-temperature resistant adhesive has the characteristics of obvious fracture toughness, adhesive strength superior to that of the traditional aluminum phosphate high-temperature resistant adhesives, relative longthermal cycle service life and the like; through the direct doping of the silicon carbide whiskers, the adhesive strength and fracture toughness of the high-temperature resistant adhesive are improved in a full temperature treatment range; through the in-situ growth of the silicon carbide whiskers, the high-temperature resistant adhesive is toughened to the maximum after high-temperature treatment, and particularly, the fracture toughness is improved by about 100% after treatment at the temperature of 1,300 DEG C.

Description

technical field [0001] The invention belongs to the technical field of adhesive material preparation, and in particular relates to a method for preparing a high-temperature-resistant adhesive that is synergistically mixed with silicon carbide whiskers and grown in situ. Background technique [0002] As a kind of inorganic adhesive, aluminum phosphate high temperature resistant adhesive has the advantages of high temperature resistance, low temperature curing, small curing shrinkage, thermal shock resistance, good blendability and plasticity, short production cycle, low cost, and simple molding process. , so it is a very good sealing and repairing adhesive material. Its most prominent feature is "low temperature curing without post-treatment, high and low temperature universal", and is widely used in the fields of fire resistance and heat insulation involving high temperature. However, such high-temperature-resistant adhesives exhibit low bond strength and high brittleness af...

Claims

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Application Information

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IPC IPC(8): C04B28/34
CPCC04B28/342C04B2111/763C04B14/4693C04B14/323C04B14/06
Inventor 王明超周晓猛罗星娜廖云龙王哲
Owner CIVIL AVIATION UNIV OF CHINA