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Ultraviolet light/heating double-curing adhesive

A dual-curing and adhesive technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of low bonding strength of LCP and inability to achieve fast deep curing

Inactive Publication Date: 2019-01-18
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the existing UV-curable adhesive cannot realize rapid deep-layer curing and has low bonding strength to LCP, and to provide a UV / heating dual-cure adhesive that is better bonded to LCP

Method used

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  • Ultraviolet light/heating double-curing adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Add 50 parts of 830LVP epoxy resin into the reaction kettle and heat it up to 120°C, with a stirring speed of 150r / min; add 10 parts of liquid crystal epoxy resin YS-400H under this temperature and stirring conditions and continue stirring for 90 minutes; wait until it is evenly stirred After cooling down to 95°C, add 10 parts of M521 core-shell rubber toughened particles, continue to stir and react for 120 minutes under the condition of 100r / min, stop heating and cool to room temperature, add 20 parts of acrylate SR833 and 10 parts of CN704, 1 part of TPO, 0.5 parts of dibenzoyl peroxide, 20 parts of FXR-1020 and high-speed stirring for 2 hours, after the glue is stirred evenly, add 3 parts of fumed silicon R202, and stir for 3 hours at a temperature of 25 ° C, a vacuum of -0.1 MPa, and a high speed to obtain finished product.

Embodiment 2

[0030] Add 40 parts of Epikote828 and 15 parts of chelating type EP-49-10P2 epoxy resin into the reaction kettle and heat it up to 150°C with a stirring speed of 200r / min; add 15 parts of liquid crystal ring under this temperature and stirring conditions Continue to stir the oxygen resin SE-500 for 70 minutes; after stirring evenly, cool down to 95°C and add 10 parts of M711 core-shell rubber toughening particles, continue to stir and react for 120 minutes under the condition of 150r / min, stop heating and cool to room temperature, then add 10 parts DMAA, 15 parts of CN966NS, 1 part of 184, 0.5 part of peroxydicarbonate bis(4-tert-butylcyclohexyl), 30 parts of EH-5057P high-speed stirring for 2 hours, after the glue is stirred evenly, add 8 parts of fumed silicon R8200 , at a temperature of 25°C, a vacuum of -0.1MPa, and high-speed stirring for 3 hours to obtain the finished product.

Embodiment 3

[0032] Add 40 parts of YD-114F and 10 parts of EP-49-10N epoxy resin into the reaction kettle and heat it up to 120°C with a stirring speed of 150r / min; add 5 parts of liquid crystal epoxy resin under this temperature and stirring conditions Resin SE-650 continues to stir for 90 minutes; after stirring evenly, cool down to 95°C and add 10 parts of M732 core-shell rubber toughened particles, continue stirring and reacting for 120 minutes under the condition of 100r / min, stop heating and cool to room temperature, then add 30 parts of SR506NS, 1 part of 184, 0.5 part of bis(4-tert-butylcyclohexyl) peroxydicarbonate, 30 parts of EH-5031S and high-speed stirring for 2 hours, after the glue is stirred evenly, add 5 parts of fumed silicon R202, at a temperature of 25 ° C, Vacuum degree -0.1MPa, high-speed stirring for 3 hours, the finished product is obtained.

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Abstract

The invention relates to an ultraviolet light / heating double-curing adhesive. The adhesive contains the following raw materials in parts by mass: 40-70 parts of toughening-type epoxy premix, 15-35 parts of acrylate monomer, 0.1-1 part of photoinitiator, 0.1-1 part of thermal initiator, 10-35 parts of latent initiator and 1-10 parts of thixotropic agent, wherein the toughening-type epoxy premix contains bifunctional epoxy resin, liquid crystal epoxy resin and core-shell rubber particles. According to the adhesive disclosed by the invention, by adopting an epoxy / acrylate hybrid system, a heat curing epoxy component with high toughness and high adhesion strength to an LCP (Liquid Crystal Polymer) is obtained by introducing core-shell rubber and liquid crystal epoxy; through the fast photocuring positioning ability of an acrylate system, the applications of photocuring technology to opaque media, complex-shaped substrates, ultra-thick adhesive layers and colored adhesive layers are expanded; and the adhesive is especially suitable for electronic automated high-speed operations and adhesion of components with complex structures.

Description

technical field [0001] The invention relates to an ultraviolet light / heating dual-curing adhesive, which belongs to the field of adhesives. Background technique [0002] With the rapid development of the information industry, UV curing technology has been widely used in the electronics industry, printing industry, and fine processing fields due to its advantages of energy saving, environmental protection, high efficiency, and economy. Since the UV curing process requires photoinitiation, the system has the disadvantages of limited curing depth, difficulty in applying to colored systems and inability to cure shadow parts, which limits the application of traditional UV curing adhesives in some special fields. To this end, we combine photocuring and thermal curing. The cross-linking and curing of the system is completed through two independent stages with different reaction principles, one of which is through photocuring and the other through thermal curing. The UV / heating dua...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J4/06C09J11/06
CPCC09J4/06C09J11/06
Inventor 刘平王建斌陈田安
Owner YANTAI DARBOND TECH
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