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Photosensitive resin composition

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of complexity and low adhesion strength, and achieve the effect of excellent coating property and excellent adhesion

Active Publication Date: 2019-02-05
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are following problems in this method: the coating and stripping of photoresist are included in the process, which is complicated.
Therefore, the adhesive strength is lower than the case without additives

Method used

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  • Photosensitive resin composition
  • Photosensitive resin composition
  • Photosensitive resin composition

Examples

Experimental program
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Effect test

Embodiment

[0151] Hereinafter, although an Example is given and this invention is demonstrated, this invention is not limited to these examples. First, the evaluation method in each Example and a comparative example is demonstrated. In the evaluation of the photosensitive resin composition (hereinafter referred to as varnish), a varnish previously filtered with a 1 μm polytetrafluoroethylene filter (manufactured by Sumitomo Electric Industries, Ltd.) was used.

[0152] (1) Determination of content of (C) compound in photosensitive resin composition (varnish)

[0153] 0.03 g of the component (A) polymerized under the conditions of using the compound (C) and 0.01 g of methyl 3-nitrobenzoate as an internal standard substance were dissolved in 0.7 g of deuterated dimethyl sulfoxide, and used Analysis was performed by NMR (manufactured by JEOL Ltd., GX-270). Based on the peak area around 3.9 ppm derived from methyl 3-nitrobenzoate, the amount of the (C) compound contained in the (A) compone...

Synthetic example 1 2

[0174] [Synthesis Example 1] Synthesis of diamine compound (HA)

[0175] Dissolve 164.8 g (0.45 moles) of 2,2-bis(3-amino-4-hydroxyphenyl) hexafluoropropane (hereinafter referred to as BAHF) in 900 mL of acetone and 156.8 g (2.7 moles) of propylene oxide, and cool to -15°C. A solution obtained by dissolving 183.7 g (0.99 mol) of 3-nitrobenzoyl chloride in 900 mL of acetone was added dropwise thereto. After completion of the dropwise addition, the reaction was carried out at -15°C for 4 hours, and then returned to room temperature. The precipitated white solid was filtered and vacuum-dried at 50°C.

[0176] 270 g of the solid was put into a 3 L stainless steel autoclave, and dispersed in 2400 mL of methyl cellosolve, and 5 g of 5% palladium-carbon was added. Hydrogen was introduced thereinto with a balloon, and the reduction reaction was carried out at room temperature. After 2 hours, confirm that the balloon is no longer deflated, and end the reaction. After completion of...

Synthetic example 2

[0179] [Synthesis example 2] Synthesis of polyimide resin (A-1)

[0180] Dissolve 62.04 g (0.2 mol) of bis(3,4-dicarboxyphenyl) ether dianhydride (hereinafter referred to as ODPA) in 1,000 g of N-methyl-2-pyrrolidone (hereinafter referred to as NMP) under dry nitrogen gas middle. Add 58.60 g (0.16 mol) of BAHF, 12.00 g (0.02 mol) of ED-600 (trade name, manufactured by HUNTSMAN Co., Ltd.), and 4.37 g (0.04 mol) of 3-aminophenol as a capping material to this together with 250 g of NMP , react at 60°C for 1 hour, then react at 160°C for 6 hours. After the reaction, the solution was cooled to room temperature, and then the solution was poured into 10 L of water to obtain a white precipitate. This precipitate was collected by filtration, washed with water three times, and then dried for 40 hours with an 80° C. vacuum dryer to obtain a polyimide resin (A-1).

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Abstract

The present invention provides a photosensitive resin composition with which it is possible to obtain a cured film that has high coating properties and that excels in adhesion with a metal material, specifically copper, even in a heat treatment at low temperature. A photosensitive resin composition containing (A) an alkali-soluble resin having an organic group deriving from aliphatic diamine, (B)a photosensitizer, and (C) a compound which is a liquid under conditions of 1013 hPa and 25DC and has a boiling point of 210 DC or more, wherein the photosensitive resin composition is characterized by including 0.1-15 parts by mass of the compound (C) which is a liquid under conditions of 1013 hPa and 25DC and has a boiling point of 210DC or more per 100 parts by mass of the alkali-soluble resin(A) having an organic group deriving from aliphatic diamine.

Description

technical field [0001] The present invention relates to a photosensitive resin composition. More specifically, it is related with the photosensitive resin composition suitable for the surface protection film of a semiconductor element, an interlayer insulating film, the insulating layer of an organic electroluminescent element, etc. Background technique [0002] Conventionally, polyimide-based resins, polybenzoxazole-based resins, and the like excellent in heat resistance, mechanical properties, and the like have been widely used in surface protective films, interlayer insulating films, and the like of semiconductor elements of electronic equipment. When polyimide or polybenzoxazole is used as a surface protection film or an interlayer insulating film, one of methods for forming via holes and the like is etching using a positive photoresist. However, this method has a problem in that the steps include application and peeling of the photoresist, which is complicated. Theref...

Claims

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Application Information

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IPC IPC(8): G03F7/004G03F7/023G03F7/037G03F7/20
CPCG03F7/004G03F7/023G03F7/037G03F7/20
Inventor 早坂惇马场修奥田良治
Owner TORAY IND INC