Photoelectric detection diode based on diamond/InP/SiC double heterojunction and preparation method of diode
A photoelectric detection and double heterojunction technology, which is applied in the field of microelectronics, can solve the problems of weak light absorption ability and weak ultraviolet detection ability, so as to improve light absorption ability, reduce low leakage current, and improve device reliability. Effect
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Embodiment 1
[0042] Please also see figure 1 , Figure 2a to Figure 2g , image 3 as well as Figure 4 , figure 1 It is a flow chart of a method for preparing a photodetection diode based on a diamond / InP / SiC double heterojunction provided by an embodiment of the present invention; Figure 2a-Figure 2g A schematic diagram of the preparation process of a photodetector diode based on a diamond / InP / SiC double heterojunction provided by an embodiment of the present invention; image 3 A schematic structural diagram of a first mask plate provided by an embodiment of the present invention; Figure 4 A schematic structural diagram of a second mask plate provided by an embodiment of the present invention. The preparation method of the present embodiment comprises the following steps:
[0043] S1: Continuously grow a homoepitaxial layer, an InP layer and a diamond layer on the upper surface of the SiC substrate;
[0044] Specifically, the S1 includes:
[0045] S11: Using a PECVD (Plasma Enh...
Embodiment 2
[0076] See Figure 5 and Figure 6 , Figure 5 A schematic cross-sectional view of a photodetector diode based on a diamond / InP / SiC double heterojunction provided for an embodiment of the present invention; Figure 6 A schematic top view of a photodetector diode based on a diamond / InP / SiC double heterojunction provided by an embodiment of the present invention. The photodetection diode based on the diamond / InP / SiC double heterojunction of this embodiment includes bottom electrode 5, substrate 1, N-type homoepitaxial layer 2, InP layer 3, N-type diamond layer 4, Light absorbing layer 7 and top electrode 6, wherein, N-type homoepitaxial layer 2 is made of SiC material doped with N element; InP layer 3 is made of P-type InP material doped with N element, N-type diamond layer 4 Made of diamond material doped with N, P, O or S elements.
[0077] Further, in this embodiment, the substrate 1 is made of N-type 4H-SiC or 6H-SiC material, and the N-type homoepitaxial layer 2 is dope...
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Abstract
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