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Preparation and cutting method of a silicone rubber thermal pad

A technology of thermal conductive gasket and silicone rubber, applied in the direction of coating, etc., can solve problems such as void cutting surface and unevenness, and achieve the effect of reducing filling amount, improving compatibility, and reducing interface thermal resistance.

Active Publication Date: 2021-12-31
深圳市驭晟新材料科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Aiming at the problems existing in the above-mentioned prior art, the present invention provides a preparation and cutting method of a silicone rubber heat-conducting gasket, which can solve the problem of a large number of voids easily appearing inside the material caused by the previous extrusion process and the unevenness of the cutting surface of the extruded sample. To solve the problem of flatness, the present invention adopts a brand-new pipeline flow orientation method, and at the same time, vacuuming and degassing can effectively remove the internal voids of the material, and the method of coating the surface of the cut sample with a thin layer and covering the release film can obtain a very smooth surface. sample

Method used

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  • Preparation and cutting method of a silicone rubber thermal pad
  • Preparation and cutting method of a silicone rubber thermal pad
  • Preparation and cutting method of a silicone rubber thermal pad

Examples

Experimental program
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Effect test

Embodiment 1

[0028] Embodiment 1, concretely make the silicone rubber thermal pad with smooth surface through the following steps:

[0029] The first step is to pretreat the filler with a silane coupling agent. The filler is spherical filler (spherical alumina) and fibrous filler (carbon fiber), and the size range of the filler is between 0.5-100um. While improving the thermal conductivity, other excellent properties can also be obtained, such as increasing the content of ceramic fillers to improve the breakdown resistance of the thermal pad, etc.;

[0030] 2 parts by weight of silane coupling agent, 15 parts by weight of ethanol, and 1 part by weight of deionized water were stirred for 30 minutes to obtain solution A; then 100 parts by weight of carbon fiber and spherical alumina were added to 700 parts by weight of Obtain solution B in deionized water, and heat solution B to 80°C in a water bath; take 5 parts by weight of solution A and add it to solution B, perform coupling reaction at ...

Embodiment 2

[0036] Due to the elasticity of the product, it will be squeezed and deformed during the cutting process, resulting in a decrease in surface flatness. In addition, due to the inevitable contact with the filler during the cutting process, the surface of the thermal pad will have an uneven surface structure. Therefore, the coating process can be added, that is, a coating slurry with 160 parts by weight of alumina and 60 parts by weight of silicone rubber can be prepared, and the coating slurry can be made to stick to the surface of the thermal pad by spraying, and its thickness can be controlled at 20- In the range of 50um, cover it with a release film, put it in an oven at 100°C to cure for 10 minutes, and then get the final silicone rubber thermal pad with a smooth surface.

[0037] Performance testing was performed on the silicone rubber thermal pad obtained above, and it was found through performance testing that the thermal conductivity of the silicone rubber thermal pad obt...

Embodiment 3

[0039] Embodiment 3. As described in Embodiment 2, the cured product is an elastic flexible material, which is deformed by the shear force during the cutting process, and it is difficult to realize that the sheet material is uniform and smooth at one time. If the flatness is too high Poor even if the coating process as in Example 2 is adopted, the effect will be particularly ideal, so after the product is solidified, it is placed in an ultra-low temperature environment (freezing with liquid nitrogen can be used), and the heat-conducting product is completely hardened before mechanical cutting. The freezing and hardening method overcomes the characteristics of easy deformation during the cutting process of the product. A thin sheet structure of silicone rubber thermal pad with uniform thickness can be prepared by diamond wire cutting or blade cutting, and then the product is allowed to return to room temperature. The coating process is carried out in the manner in 2, so as to im...

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Abstract

The invention discloses a preparation and cutting method of a silicone rubber heat-conducting gasket. The modified filler is obtained by pretreating the spherical filler and the fibrous filler with a silane coupling agent under the condition of a water bath; the modified filler Mix evenly in a certain proportion, then add a suitable proportion of silicone rubber to it, and vacuumize and degas to obtain the original slurry; import the original slurry into the orientation device, and apply external pressure to the slurry, and finally from After the orientation device flows out, it is introduced into the molding tank and cured under certain conditions to obtain a thermally conductive product, and a thermally conductive pad of a specific size is cut on the cutting platform; then the thermally conductive pad after cutting is further surface coated. , to obtain silicone rubber thermal pads. The invention utilizes mechanical extrusion and secondary treatment to obtain a silicone rubber thermal pad with a smooth surface, which not only greatly improves the thermal conductivity of the thermal pad, but also meets the requirements of practical applications.

Description

technical field [0001] The invention relates to the technical field of composite thermal interface materials, in particular to a preparation and cutting method of a silicone rubber heat conduction gasket. Background technique [0002] With the advancement of science and technology and the development of industry, especially the rise of the electronic field and the emergence of a large number of high-power devices, integrated circuits with high assembly density generate a lot of heat during operation, which will lead to the reliability and stability of electronic components. And the service life is reduced, so the problem of heat dissipation has become one of the bottlenecks in the development of today's electronic packaging industry. Along with the three major development trends of high performance, miniaturization and integration in the electronics industry, the problem of heat dissipation is becoming more and more prominent. Research in 2007 showed that if the operating t...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/05C08K9/06C08K7/06C08K7/18C08J7/04
CPCC08L83/04C08J2383/04C08J2483/04C08K2201/003C08L2205/025C08J7/0427C08K9/06C08K7/06C08K7/18
Inventor 陈威
Owner 深圳市驭晟新材料科技有限公司
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