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Polylactic acid heat-conducting compound material and preparation method thereof

A heat-conducting composite material and composite material technology, applied in the field of polylactic acid heat-conducting composite materials and their preparation, can solve the problems of poor crystallization performance and unsatisfactory thermal conductivity of polylactic acid composite materials, so as to improve crystallization performance, accelerate crystallization, Effect of improving thermal conductivity

Active Publication Date: 2019-03-01
CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of the polylactic acid composite materials prepared by the above method is still unsatisfactory, and there are also problems of poor crystallization properties.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0036] The present invention also provides a method for preparing the polylactic acid thermally conductive composite material described in the above technical solution, comprising the following steps:

[0037] a) Melting and blending poly-L-lactic acid, poly-D-lactic acid and a heat-conducting filler to obtain a heat-conducting polylactic acid composite material;

[0038] The melt blending temperature is higher than the melting point of poly-L-lactic acid and poly-D-lactic acid, and lower than the melting point of stereocomplex polylactic acid.

[0039]In the preparation method provided by the present invention, firstly, poly-L-lactic acid, poly-D-lactic acid and heat-conducting filler are melt-blended in proportion. Among them, the poly-L-lactic acid, poly-D-lactic acid and thermally conductive filler are preferably dried before being melt-mixed; the drying temperature is preferably 70-120°C, specifically 70°C, 75°C, 80°C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 115°C or 120°...

Embodiment 1

[0046] Take by weighing 100 parts by weight of polylactic acid with a weight average molecular weight of 100,000, 5 parts by weight of boron nitride (20 nanometers in particle diameter), 8 parts by weight of aluminum oxide (30 nanometers in particle diameter), aluminum-silicon alloy powder (aluminum-silicon ratio 6, Particle diameter 80 nanometers) 10 parts by weight, weight average molecular weight is 20 parts by weight of poly-D-lactic acid of 100,000; Mix the above-mentioned raw materials for 10 minutes under the conditions of 180 ℃ and 80 rpm, cool to room temperature after blending, and obtain poly Lactic acid thermally conductive compound.

[0047] The thermal conductivity and crystallization performance of the above-mentioned polylactic acid heat-conducting composite material are measured, and the results are: thermal conductivity 1.43W / mK, crystallization half-life (T c = 100°C) for 0.9 min.

Embodiment 2

[0049] Take by weighing 100 parts by weight of polylactic acid with a weight average molecular weight of 50,000, 7 parts by weight of aluminum nitride (50 nanometers in particle diameter), 7 parts by weight of silicon micropowder (20 nanometers in particle diameter), 6 parts by weight of boron nitride (150 nanometers in particle diameter). Parts by weight, 15 parts by weight of poly-d-lactic acid with a weight-average molecular weight of 50,000; the above raw materials were mixed for 10 minutes at 180°C and 80 rpm, and cooled to room temperature after blending to obtain polylactic acid thermally conductive composite materials.

[0050] The thermal conductivity and crystallization performance of the above-mentioned polylactic acid heat-conducting composite material are measured, and the results are: thermal conductivity 1.23W / mK, crystallization half-life (T c = 100°C) for 1.2 min.

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Abstract

The invention belongs to the field of high polymer materials, and particularly relates to a polylactic acid heat-conducting compound material and a preparation method thereof. The polylactic acid heat-conducting compound material is prepared by conducting melt blending on the following raw materials in parts by weight: 100 parts of poly-l-lactic acid, 5-25 parts of poly(d-lactide) and 20-50 partsof heat-conducting filler; the heat-conducting filler comprises at least three of boron nitride, aluminium oxide, silicon carbide, aluminium nitride, bauxite, silica powder and aluminium-silicon alloypowder; the temperature of the melt blending is higher than melting points of the poly-l-lactic acid and the poly(d-lactide), and is lower than a melting point of isotactic compound polylactic acid.Experiment results show that the polylactic acid heat-conducting compound material has good heat-conducting performance and crystallization performance, the heat-conducting coefficient is 1.0 W / mK orabove, and the crystallization half-life (Tc being equal to 100 DEG C) is shorter than 1.6 min.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a polylactic acid heat-conducting composite material and a preparation method thereof. Background technique [0002] Polylactic acid (PLA) is an aliphatic polyester formed by fermenting starch extracted from renewable plant resources into lactic acid and further polymerized. It is one of the more active researched varieties of aliphatic polyester. The glass transition temperature and melting point of polylactic acid are about 60°C and 175°C, respectively. It is a hard polymer in a glass state at room temperature, and its thermal properties are similar to polystyrene. Polylactic acid is thermoplastic and can be molded on general-purpose processing equipment like synthetic polymers such as PP, PS, and PET. [0003] Polylactic acid material is a biodegradable material, which is buried in the soil after use, and will naturally decompose into water and carbon dioxide afte...

Claims

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Application Information

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IPC IPC(8): C08L67/04C08K3/22C08K3/38C08K3/08C08K3/02C08K3/28C08K3/36C08K3/30
CPCC08K2003/023C08K2003/0812C08K2003/2227C08K2003/282C08K2003/385C08K2201/003C08K2201/011C08L67/04C08L2205/025C08K3/22C08K3/38C08K3/08C08K3/02C08K3/28C08K3/36C08K3/30
Inventor 韩常玉于彦存董丽松
Owner CHANGCHUN INST OF APPLIED CHEMISTRY - CHINESE ACAD OF SCI