Copper alloy wire and manufacturing method thereof

Abstract

The invention relates to a copper alloy wire. The copper alloy wire contains 0.1-3% of Ag, 460-1000 ppm of a trace additive element and the balance of copper; and the trace additive element is the combination of one or more in Ca, Be, In and Ge. The invention further provides a manufacturing method of the copper alloy wire. The copper alloy bonding wire in the invention has the beneficial effectsthat: after being routed, the product has high resistance to humidity in high-temperature, high-humidity and high-voltage conditions; the adhesive power between a welding spot and a bonding pad is good; the copper alloy bonding wire has excellent operability and reliability; the anti-aging performance is good; the hardness of a wire rod is relatively proper; the routing camber height is greatly reduced; when IC routing is carried out, breakage and damage to a welding electrode are avoided; the good bonding performance is provided; and the cost is relatively low.

Description

technical field [0001] The invention relates to a bonding wire for IC and LED packaging, in particular to a copper alloy wire and a manufacturing method thereof. Background technique [0002] Bonding wire (also known as bonding wire) is a main connection method for connecting a chip to an external packaging substrate (substrate) and / or multilayer circuit board (PCB). The development trend of bonding wire, in terms of product direction, mainly includes wire diameter miniaturization, high floor life and high bobbin length; in terms of chemical composition, there are mainly copper wires (including bare copper wires, palladium-coated copper wires) , flash gold palladium-plated copper wire) has largely replaced gold wires in the semiconductor field, while silver wires and silver alloy wires have replaced gold wires in LED and some IC packaging applications. Due to the development requirements of miniaturization and thinning of electronic products, the semiconductor industry adop...

AI Technical Summary

Problems solved by technology

Pure copper wire has good workability and low cost, but poor aging resistance, high temperature and high humidity resistance, and low reliability

Palladium-plated gold-plated copper wire includes a core wire, a palladium pre-plating layer coated on the outside of the core wire, and a gold cladding layer coated on the outside of the palladium pre-plated layer. The core wire is made of pure copper; the palladium-plated gold-plated copper wire is used to ensure good For workability and reliability, thicker palladium pre-plating layer and gold cladding layer are required. The cost of raw materials is high, and the manufacturing process is relatively complicated, so that the manufacturing cost is too high and lacks market competitiveness.

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