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Silver-containing film etchant composition and conductive pattern forming method using same

A conductive pattern and etching solution technology, applied in the field of silver-containing film etching solution composition, can solve the problems of difference in etching rate, residue, low oxidation/reduction potential, etc., and achieve the effects of inhibiting re-precipitation and improving solubility

Active Publication Date: 2021-09-07
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of using the above-mentioned inorganic strong acid, defects such as uneven etching profile, over-etch, and over-hang due to the difference in etching rate of different conductive films may occur, and it is difficult to adjust Etching rate for fine pattern formation
[0007] In addition, silver (Ag) has a low oxidation / reduction potential, and after etching, re-adsorption, residue, etc. may occur, and in this case, short circuits may occur between adjacent conductive patterns, etc.

Method used

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  • Silver-containing film etchant composition and conductive pattern forming method using same
  • Silver-containing film etchant composition and conductive pattern forming method using same
  • Silver-containing film etchant composition and conductive pattern forming method using same

Examples

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experiment example

[0151] Form on the glass substrate Three-layer film, using a diamond knife and cut into a size of 10cmX10cm sample manufactured.

[0152] For the above-described three-layer film by photolithography etching step. Specifically, the etchant compositions of Examples and Comparative Examples of the etching apparatus in a jet injection (ETCHER, K.C.Tech Inc.) in. Ejecting the etching solution in the sample of composition embodiments 85 seconds when the temperature of the etching step, the etching solution after the composition was set to 40 ℃, the temperature reaches 40 ± 0.1 ℃.

[0153] After the etching step, the above samples washed with deionized water, drying by hot air drying apparatus, and using a photoresist stripping machine (PR stripper) the photoresist is removed.

[0154] (1) Evaluation of re-adsorbed silver

[0155] For sample was etched, was observed by a scanning electron microscope (SU-8010, manufactured by Hitachi Ltd.) in the entire surface, and then evaluate the ads...

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Abstract

The invention provides a silver-containing film etchant composition and a method for forming a conductive pattern using the same. The silver-containing film etchant composition comprises an etching initiator, an inorganic acid, an organic acid and a balance of water, and the silver (Ag ) concentration of 10,000ppm, the absorption wavelength is 300-370nm. By using the silver-containing film etchant composition, a fine-sized conductive pattern with reduced etching defects can be formed.

Description

Technical field [0001] The present invention relates to a silver-containing film and the etching solution composition using a conductive pattern forming method thereof. More specifically, it relates to an acid component comprising a metal film and an etching solution composition using a conductive pattern forming method thereof. Background technique [0002] For example, as part of the drive circuit of the semiconductor device and a display device utilizing a thin film transistor (ThinFilm Transistor: TFT). TFT e.g. organic light emitting display (OLED) on a substrate (LCD) device in accordance with the respective pixels arranged in the pixel electrode, a counter electrode, the source and drain electrodes, data lines, power lines, electrical wiring may be the TFT liquid crystal display device connect. [0003] To form the electrode or wiring, a metal film may be formed on a display substrate, after forming a photoresist, the metal film is partially etching solution composition us...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09K13/06H01L21/3213
CPCH01L21/32134C09K13/06C23F1/30G02F1/136286G02F1/13439H01L27/124
Inventor 金童基南基龙沈庆辅
Owner DONGWOO FINE CHEM CO LTD
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