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Preparation method of hexagonal boron nitride/epoxy resin composite material with high thermal conductivity

A technology of hexagonal boron nitride and epoxy resin, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of low thermal conductivity of polymer materials, reduce the working efficiency of devices, shorten the service life of electronic devices, etc. Achieve the effect of improving thermal conductivity, reducing production cost, and simple method

Inactive Publication Date: 2019-03-29
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

As we all know, polymer materials are widely used in electronic circuits and their packaging materials because of their good mechanical strength, light weight and insulation, but the thermal conductivity of polymer materials is usually very low (< 0.5 W / mk), which greatly limits The application of polymer materials in practice
Moreover, as the operating frequency of electronic components and related equipment is greatly increased, the equipment will generate a lot of heat during operation. If the heat cannot be removed in time, it will not only reduce the working efficiency of the device, but also shorten the service life of the electronic device.

Method used

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  • Preparation method of hexagonal boron nitride/epoxy resin composite material with high thermal conductivity
  • Preparation method of hexagonal boron nitride/epoxy resin composite material with high thermal conductivity
  • Preparation method of hexagonal boron nitride/epoxy resin composite material with high thermal conductivity

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specific Embodiment approach 1

[0024] Specific embodiment one: a kind of preparation method of hexagonal boron nitride / epoxy resin composite material with high thermal conductivity comprises:

[0025] (1) Weigh 4g of block h-BN, appropriate amount of epoxy resin, curing agent methyl tetrahydrophthalic anhydride, and accelerator DMP-30 and mix them in a beaker, add 200ml of absolute ethanol solution, stir and ultrasonicate for 6 hours to make the solution well mixed.

[0026] (2) Put the mixed solution obtained in step (1) into a vacuum filter and dry it in an oven at 80°C for 2 hours to remove the remaining alcohol. After drying, a filter cake of hexagonal boron nitride / epoxy resin composite material is obtained;

[0027] (3) Place the hexagonal boron nitride / epoxy resin composite material filter cake obtained in step (2) in the tablet press mold that has been coated with a release agent, and press the front and back sides of the filter cake separately, The pressure is 5-20Mpa, the application time is 15mi...

specific Embodiment approach 3

[0029] In order to make the connection between the hexagonal boron nitride more fully, adjust the pressure of the front and back sheeting methods described in the second specific embodiment. The specific method is: put 5g of hexagonal boron nitride and 200ml of concentrated sulfuric acid into a ball mill tank and mill for 48 hours . After ball milling, take out the solution, put it into a 1500ml beaker and add 1000ml of deionized water to dilute, and place the beaker in an ultrasonic oscillator for 2 hours to disperse the hexagonal boron nitride evenly, then filter the solution with a vacuum filtration device, And wash the filter cake with deionized water until the pH value of the solution is neutral, then put it in an oven at 80°C and dry it for 12 hours to obtain hydroxylated hexagonal boron nitride. The silane coupling agent KH-540, water, and ethanol are mixed in a ratio of 1:4: The volume ratio of 36 was dissolved and ultrasonicated for 3 hours, then the hydroxylated hexa...

Embodiment 1

[0031](1) Weigh 4g of block h-BN, 36g of epoxy resin, 2g of curing agent methyltetrahydrophthalic anhydride, 0.2g of accelerator DMP-30 and mix them in a beaker, add 200ml of absolute ethanol solution, and stir magnetically for 6h The solution is mixed evenly, and then the mixed solution is vacuum filtered to remove the alcohol, and a filter cake of hexagonal boron nitride / epoxy resin composite material is obtained in the funnel.

[0032] (2) Gently remove the filter cake and place it on a flat silicon plate, remove the filter paper, then cover the filter cake with a new piece of filter paper and dry it in an oven at 80°C for 2 hours to remove a little remaining alcohol.

[0033] (3) After the filter cake is dry, place the filter cake in the abrasive tool of the tablet press that has been coated with a release agent, and apply pressure on the front and back sides for 15min and 10Mpa respectively. Afterwards, the filter cake was removed, covered and wrapped with filter paper, a...

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Abstract

The invention discloses a preparation method of a hexagonal boron nitride / epoxy resin composite material with a high thermal conductivity. The preparation method is characterized in that hexagonal boron nitride and epoxy resin which are used as raw materials undergo solvent dispersion, vacuum suction filtration, tabletting treatment and curing treatment to obtain the hexagonal boron nitride / epoxyresin composite material with the high thermal conductivity. The preparation method can realize the high-content filling of the epoxy resin with the commercial bulk hexagonal boron nitride, and also can realize the high thermal conductivity of the composite material. The epoxy resin can be filled with 70% of the commercial hexagonal boron nitride by the method, so the thermal conductivity of the composite material reaches up to 2.6 W / mk, and is 13 times higher than that of pure epoxy resin. The method has the advantages of significant reduction of the production cost, simple and easy process,and suitableness for large-scale production.

Description

technical field [0001] The invention relates to the field of inorganic-organic composite materials, in particular to a hexagonal boron nitride / epoxy resin composite material. Background technique [0002] With the rapid development of electronic technology, the field of insulated electronic devices is turning to miniaturization and multi-function, and at the same time, the requirements for electronic packaging technology are increasing. As we all know, polymer materials are widely used in electronic circuits and their packaging materials because of their good mechanical strength, light weight and insulation, but the thermal conductivity of polymer materials is usually very low (< 0.5 W / mk), which greatly limits The application of polymer materials in practice. Moreover, as the operating frequency of electronic components and related equipment is greatly increased, the equipment will generate a lot of heat during operation. If the heat cannot be removed in time, it will n...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/02C08K9/06C08K9/00C08K3/38C09K5/14
CPCC08K3/38C08K9/00C08K9/02C08K9/06C08K2003/385C09K5/14C08L63/00
Inventor 唐成春贺仁正薛彦明曹超超周正王德坤
Owner HEBEI UNIV OF TECH
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