Heat conductive interface material for heat dissipation of electronic equipment

A technology of interface materials and electronic equipment, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve the problems of large diameter-thickness ratio of graphene materials, difficulty in dispersion of nanomaterials, easy agglomeration, etc., to reduce interface thermal resistance, The preparation process is simple and the effect of cost reduction

Pending Publication Date: 2019-04-02
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This process overcomes the problems of using mechanical stirring and other conventional processes in the preparation process due to the large diameter-thickness ratio of graphene materials, easy agglomeration, and difficulty in dispersing as nanomaterials.

Method used

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  • Heat conductive interface material for heat dissipation of electronic equipment
  • Heat conductive interface material for heat dissipation of electronic equipment
  • Heat conductive interface material for heat dissipation of electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Put 1g of intercalated graphene powder, 20g of spherical alumina filler with an average particle size of 3 μm, 100g of acrylic resin with a solid content of 45% and 1g of isocyanate into a ball mill jar, and stir for 10 minutes at a speed of 100 rpm. Add 100 g of zirconia balls to the ball mill jar. The mixture was ball milled at a speed of 400 rpm for 10 hours. After the ball milling is completed, the mixture is taken out to obtain a graphene-containing thermally conductive adhesive composite material.

[0034] figure 1 Optical photographs of the prepared thermally conductive adhesive, figure 2 It can be seen from the scanning electron microscope photos that the graphene and alumina in the composite material are uniformly dispersed, and the graphene and alumina overlap and cooperate with each other to form a uniform and effective heat conduction network structure. Since the macroscopic and microscopic structures of the thermally conductive adhesives prepared in the...

Embodiment 2

[0037] Put 1g of intercalated graphene powder, 15g of aluminum nitride powder with an average particle size of 1 μm, 100g of acrylic resin with a solid content of 45% and 1g of isocyanate into a ball mill jar, and stir for 10 minutes at a speed of 100 rpm. Add 100 g of zirconia balls to the ball mill jar. The mixture was ball milled at a speed of 400 rpm for 10 hours. After the ball milling is completed, the mixture is taken out to obtain a graphene-containing thermally conductive adhesive composite material.

[0038] The thermal conductivity of the prepared graphene thermally conductive adhesive was measured to be 0.95W / mK. use Figure 5 The device shown is tested for cooling effect. The composite heat-dissipating film prepared by using this heat-conducting adhesive dissipates heat, and the center temperature of the ceramic heating sheet is 88.2°C.

Embodiment 3

[0040] Put 1g of electrolytic graphene powder, 15g of boron nitride powder with an average particle size of 1 μm, 100g of acrylic resin with a solid content of 45%, and 1g of isocyanate into a ball mill jar, and stir for 10 minutes at a speed of 100 rpm. Add 100 g of zirconia balls to the ball mill jar. The mixture was ball milled at a speed of 400 rpm for 10 hours. After the ball milling is completed, the mixture is taken out to obtain a graphene-containing thermally conductive adhesive composite material.

[0041] The thermal conductivity of the prepared graphene thermally conductive adhesive was measured to be 0.88W / mK. use Figure 5 The device shown is tested for cooling effect. The composite heat-dissipating film prepared by using this heat-conducting adhesive dissipates heat, and the center temperature of the ceramic heating sheet is 90.4°C.

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Abstract

The invention discloses a heat conductive interface material for heat dissipation of electronic equipment and belongs to the technical field of new materials. Through simple process, graphene and common filler are cooperated to form heat conductive filler; then with acrylic resin and other additives being a substrate, a graphene composite heat conductive adhesive material is prepared and serves asthe heat conductive interface material. In the heat conductive interface material, the graphene and the common filler are uniformly dispersed, so that the characters that the graphene has high heat conductivity and the common filler achieves large filling quantity are fully achieved, and the performances of the heat conductive adhesive are better than those of a conventional heat conductive adhesive. The product significantly improves heat dissipation and cooling effect on electronic devices. The graphene composite heat conductive adhesive is simple in preparation method and allows large-scale industrial production, and can be applied independently or matched with a substrate as a novel high-effective heat conductive interface material for heat dissipation of electronic equipment.

Description

technical field [0001] The invention relates to the technical field of new materials, in particular to a thermally conductive interface material used for heat dissipation of electronic equipment. Background technique [0002] With the development of science and technology, the miniaturization and multi-functionalization of electronic components put forward higher requirements for the heat dissipation of the devices. The heat dissipation of devices has become a technical "bottleneck" faced by the rapidly developing telecom industry. The thermal resistance analysis shows that the interface thermal resistance between the device and the heat sink is large. The reason is that the solid surface is rough and uneven on the microscopic scale. Even if the contact pressure of the two solid surfaces is as high as 10 MPa, the actual contact area only accounts for 1-2% of the apparent contact area, and the rest is a microscopic surface filled with air. porosity. Therefore, how to reduc...

Claims

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Application Information

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IPC IPC(8): C08L33/04C08K3/04C09K5/14
CPCC08K3/042C09K5/14C08L33/04
Inventor 任文才马超群黄坤刘海超裴嵩峰成会明
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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