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PID-resistant ethylene vinyl acetate film, encapsulation component, and encapsulation method

An ethylene vinyl acetate film, vinyl acetate technology, applied in the direction of adhesives, electrical components, semiconductor devices, etc., can solve the problems of high reliability of components and high technical requirements, to ensure cross-linking density, inhibit PID, and reduce hydrolysis. Effect

Active Publication Date: 2021-01-01
SHANGHAI HIUV NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the photovoltaic EVA film accounts for a small part of the overall cost of the module, it is closely related to the reliability of the module and has high technical requirements

Method used

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  • PID-resistant ethylene vinyl acetate film, encapsulation component, and encapsulation method
  • PID-resistant ethylene vinyl acetate film, encapsulation component, and encapsulation method
  • PID-resistant ethylene vinyl acetate film, encapsulation component, and encapsulation method

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preparation example Construction

[0035] In the anti-PID ethylene vinyl acetate film prepared by the present invention, the crosslinking accelerator includes but not limited to acrylic acid, methacrylic acid, acrylamide, allyl, epoxy compound one or more.

[0036] Specific examples of (meth)acrylic co-crosslinking agents include trimethylolpropane trimethacrylate, ethoxylated trimethylolpropane trimethacrylate, trimethylolpropane trimethacrylate, Acrylates, Ethoxylated Trimethylolpropane Triacrylate, Ethylene Glycol Dimethacrylate, Polybutadiene Dimethacrylate, Magnesium Methacrylate, Zinc Methacrylate, etc.

[0037] Specific examples of acrylamide-based co-crosslinking agents include N,N'-m-phenylene bismaleimide, 4,4'-dithiobisphenylmaleimide, 4,4 - Methylene diphenyl bismaleimide and the like.

[0038] Specific examples of the allyl-based crosslinking assistant include triallyl isocyanurate, triallyl cyanurate, diallyl phthalate, and the like.

[0039] Specific examples of the epoxy compound-based crossl...

Embodiment 1

[0053] The formula component of a kind of embodiment of the anti-PID ethylene vinyl acetate adhesive film among the present invention is as follows:

[0054] Element parts by weight EVA resin, VA content 28% 80 Ethylene-vinyl alcohol copolymer 10 Triallyl isocyanurate (TAIC) 3 3-aminopropyltriethoxysilane (silane coupling agent KH550) 2 Dicumyl peroxide (peroxide crosslinker DCP) 3 N,N'-di-sec-butyl-p-phenylenediamine (Antioxidant 4720) 2

[0055] Mix the above components thoroughly and add them to the extruder. The temperature of the extruder is 90°C, and the temperature of the mold is 90°C; extrude through a T-shaped flat die to form a film, or directly pass through two calender rolls to form a film and wind it up. . Cut the rolled anti-PID ethylene vinyl acetate film to the size of the solar photovoltaic module, and stack them in the order of glass / anti-PID ethylene vinyl acetate film / cell sheet / common EVA film / back sheet ...

Embodiment 2

[0057] The formula component of a kind of embodiment of the anti-PID ethylene vinyl acetate adhesive film among the present invention is as follows:

[0058] Element parts by weight EVA resin 99.69 polyvinyl alcohol 0.05 3-aminopropyltriethoxysilane (silane coupling agent KH550) 0.01 Triallyl isocyanurate (TAIC) 0.1 tert-butyl peroxy-2-ethylhexyl carbonate (TBEC) 0.1 Tetrakis[β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]pentaerythritol ester (Antioxidant 1010) 0.05

[0059] Mix the above components thoroughly and add them to the extruder. The temperature of the extruder is 160°C, and the temperature of the mold is 160°C; extrude through a T-shaped flat die to form a film, or directly pass through two calender rolls to form a film and wind it up. . Cut the rolled anti-PID ethylene vinyl acetate film to the size of the solar photovoltaic module, and stack them in the order of glass / anti-PID ethylene vinyl acetate film / cell s...

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PUM

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Abstract

The invention relates to an anti-PID ethylene vinyl acetate film comprising the following components: 80-99.69 parts by weight of EVA resin; 0.1-3 parts by weight of an organic peroxide crosslinking agent; 0.1 to 3 parts by weight of a cross-linking accelerator; 0.05 to 2 parts by weight of an anti-aging agent; 0.01 to 2 parts by weight of a silane coupling agent; and 0.05 to 10 parts by weight ofan anti-PID auxiliary agent. The invention also provides a package assembly and a packaging method thereof. The anti-PID auxiliary agent of the anti-PID film is resin having a carbon chain and a branched chain containing a plurality of hydroxyl groups, the structure of the resin is similar to the structure of a hydrolyzed product of the EVA resin, progress of EVA hydrolysis reaction can be suppressed, the EVA hydrolysis reaction can be effectively reduced, the crosslink density of the EVA film can be ensured, ions on the surface of the EVA and glass can be effectively blocked from accumulating on the surface of a battery, and the PID phenomenon of the assembly can be suppressed.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a packaging adhesive film, in particular to an anti-PID ethylene vinyl acetate adhesive film, a packaging component and a packaging method. Background technique [0002] PID (Potential Induced Degradation) is a potential potential induced degradation, a characteristic of photovoltaic panels, and improper treatment will lead to a decrease in the power and efficiency of photovoltaic panels. In recent years, more and more customers have reported that the power generation of power plant components has decreased to varying degrees, which is lower than the expected value, and many of them have been confirmed to be caused by PID. At present, the PID phenomenon has been understood by more people, and more and more research institutions and component manufacturers have conducted in-depth research and published articles on it. [0003] In order to reduce the impact of PID, various effo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J123/08C09J11/06C09J11/08H01L33/56
CPCC08L2203/206C08L2205/025C09J11/06C09J11/08C09J123/0853H01L31/0481H01L33/56C08L23/0846C08K5/34924C08K5/544C08K5/14C08K5/18C08K5/00C08K5/1345C08L23/0853C08K5/103C08K5/5425Y02E10/50
Inventor 杨英李民
Owner SHANGHAI HIUV NEW MATERIALS