Graded curing temperature-resistant epoxy adhesive and preparation method thereof
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An epoxy adhesive and curing agent technology, applied in the field of construction structural adhesives, can solve the problems of structural adhesive performance changes, ambient temperature rise, difficult on-site use, etc., and achieve the effect of multi-time and opportunity and enhanced heat resistance
Active Publication Date: 2021-02-02
江苏大力士云石护理材料有限公司
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Problems solved by technology
However, epoxy structural adhesives cured at room temperature generally begin to soften at 40-80°C, and begin to decompose at around 200-300°C, so they can only be used at room temperature.
Epoxy adhesives used at slightly higher temperatures generally require medium and high temperature curing to meet the requirements, such as novolac epoxy adhesives, anhydride-cured epoxy adhesives, etc., which are difficult to use on site in structural bonding
In some special cases, such as electric welding of the bonded steel bars, or a fire in the building, the ambient temperature rises rapidly, causing changes in the performance of structural adhesives, resulting in accidents
[0004] At present, conventional high-temperature resistant resins include ordinary phenolic resins, boron phenolic resins, ring-opening cured heterocycles, etc., but most of these products are solid at room temperature and cannot be used at room temperature, and they all need to be cured at a higher temperature , in normal temperature engineering, none of the above varieties can be used
[0005] Epoxy system adhesives cure at room temperature, but there are no relevant reports on adhesive materials that can be used at high temperatures above 200°C
Method used
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preparation example Construction
[0032] The preparation method of described pretreatment powdery phenolic resin is as follows:
[0033] The thermoplastic modified phenolic resin is placed in a flask, heated to 130-150° C. to make it melt, and the thermoplastic modified phenolic resin contains a salicylic acid accelerator and a silane coupling agent (in the commercially available thermoplastic modified phenolic resin Already contains salicylic acid accelerator and silane coupling agent), while stirring, add 15% urotropine solution with a content of 33% as a curing agent, keep stirring for about 10-20 seconds, and then pour out the melt, After it is fully cooled, use grinding equipment to fully grind it to obtain powder, so that the particle size is 20-40 microns, that is, the pretreated powdered phenolic resin is obtained.
[0034] The preparation method of described phenolic resin coated quartz sand is as follows:
[0035] Use 100-150 mesh quartz sand, use a molding sand coating machine, heat the quartz sand...
specific Embodiment
[0061] Table 1 is the component and proportioning table of embodiment 1-6
[0062]
[0063]
[0064] Table 2 is the component and proportioning table of embodiment 7-12
[0065]
[0066]
[0067] Table 3 is the component and proportioning table of embodiment 13-18
[0068]
[0069]
[0070] Table 4 is the detection data table of embodiment 1-18 of the present invention and comparative example:
[0071]
[0072] Among them, a certain brand of planting glue in the market was selected as the comparative example.
[0073] According to comprehensive performance, wherein embodiment 2, 8, 9, 17 are preferred embodiments, wherein embodiment 9 is the best embodiment.
[0074] Other parts not specified in detail are prior art.
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Abstract
The invention discloses a graded curing temperature-resistant epoxy adhesive, which consists of two components A and B, wherein component A contains the following components: bisphenol A epoxy resin, multi-functional special epoxy diluent, Pretreatment powdered phenolic resin, the first silane activated silicon powder, phenolic resin coated quartz sand, other fillers, anti-sedimentation agent; among them, component B contains the following components: modified amine curing agent, accelerator, pretreatment powder Phenolic resin, second silane activated silica powder, phenolic resin coated quartz sand, other fillers, anti-sedimentation agent. The invention organically combines the epoxy resin system and the phenolic resin system to make it easy to operate, good in strength and temperature resistance, can be cured at normal temperature, and can have better strength at normal temperature and high temperature. Mainly used in planting reinforcement glue, fireproof structure reinforcement glue, etc. The invention also discloses a preparation method of the graded curing temperature-resistant epoxy adhesive at the same time.
Description
technical field [0001] The invention belongs to the field of building structural adhesives. More specifically, it is a graded curing temperature-resistant epoxy adhesive, and the invention also relates to a preparation method of the graded curing temperature-resistant epoxy adhesive. It is mainly used in planting reinforcement glue, fireproof structure reinforcement glue, etc. Background technique [0002] As an excellent adhesive resin system, epoxy resin can be cured at room temperature and has strong operability. It also has excellent bonding strength, excellent weather resistance, water resistance, and chemical resistance. [0003] As an important structural adhesive, epoxy adhesive is generally used at room temperature. It is widely used in important places such as pasting stone materials on the inner and outer walls of buildings, strengthening the inside and outside of new and old buildings, repairing and strengthening roads and bridges, etc., and plays a very import...
Claims
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