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High-thermal-conductivity and high-tensile-elasticity-modulus polyimide film and preparing method thereof

A technique for stretching elastic modulus and polyimide film, which is applied in the field of high thermal conductivity and high tensile elastic modulus polyimide film and its preparation, can solve the problem of surface property deterioration of polyimide film, inorganic nanomaterials Problems such as poor dispersion and application limitations of polyimide films can improve mechanical properties, improve compatibility, and improve thermal conductivity.

Inactive Publication Date: 2019-04-16
WUXI CHUANGCAI OPTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, adding these fillers to polyimide raw materials is very easy to produce filler aggregates, which deteriorates the surface properties of polyimide films, and while there are problems in appearance, it seriously affects mechanical properties, making the polyimide films difficult to obtain. App is restricted
Patent document CN105111739A discloses a high thermal conductivity polyimide film and its preparation method, which is prepared by adding nanomaterial slurry containing coupling agent and inorganic nanomaterial to the composition of amine monomer and anhydride monomer Polyimide film with high thermal conductivity, but in this method, the viscosity of the reaction monomer mixture itself is high, after adding nanomaterial slurry, the dispersion of inorganic nanomaterials is relatively poor, the thermal conductivity of the film is limited, and Insufficient dispersion affects the overall mechanical properties of the film

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Add 6g of boron nitride powder (average particle size 3μm) into 100ml of ethanol solution, stir and mix for 30min in a constant temperature water bath at 25°C with a stirring speed of 250rpm to obtain a boron nitride alcohol solution, and add 24g of silane to the boron nitride alcohol solution With coupling agent KH550, raise the reaction temperature to 80°C, then stir and react at a stirring speed of 250rpm / min for 4h, and cool to room temperature to obtain a mixed solution. The mixture was centrifuged at a centrifugal speed of 4000rpm / min for 10min, and the centrifuged liquid was removed to obtain a solid modified boron nitride modified by silsesquisilane, and the modified boron nitride was placed in a vacuum drying oven at 50°C for 2h in vacuo to obtain Silicone modified boron nitride powder;

[0027] Add 15 g of dried siloxane-modified boron nitride powder into 85 g of N, N-dimethylacetamide, and pass N at a stirring speed of 250 rpm / min. 2 Stir for 30 minutes unde...

Embodiment 2

[0031]Add 8g of boron nitride powder (average particle size 5μm) into 100ml of ethanol solution, stir and mix for 30min in a constant temperature water bath at 25°C at a stirring speed of 100rpm to obtain a boron nitride alcohol solution, and add 24g of silane to the boron nitride alcohol solution With coupling agent KH792, raise the reaction temperature to 80°C, then stir and react at a stirring speed of 250rpm / min for 4h, and cool to room temperature to obtain a mixed solution. The mixture was centrifuged at a centrifugal speed of 4000rpm / min for 10min, and the centrifuged liquid was removed to obtain a solid modified boron nitride modified by silsesquisilane, and the modified boron nitride was placed in a vacuum drying oven at 50°C for 2h in vacuo to obtain Silicone modified boron nitride powder;

[0032] Add 15 g of dried siloxane-modified boron nitride powder into 85 g of N, N-dimethylacetamide, and pass N at a stirring speed of 300 rpm / min. 2 Stir for 30 minutes under p...

Embodiment 3

[0036] Add 5g of boron nitride powder (average particle size 5μm) into 100ml of methanol solution, stir and mix for 10min in a constant temperature water bath at 25°C at a stirring speed of 300rpm to obtain a boron nitride alcohol solution, and add 10g of silane to the boron nitride alcohol solution With coupling agent KH560, raise the reaction temperature to 80°C, then stir and react at a stirring speed of 250rpm / min for 4h, and cool to room temperature to obtain a mixed solution. The mixture was centrifuged at a centrifugal speed of 4000rpm / min for 10min, and the centrifuged liquid was removed to obtain a solid modified boron nitride modified by silsesquisilane, and the modified boron nitride was placed in a vacuum drying oven at 50°C for 2h in vacuo to obtain Silicone modified boron nitride powder;

[0037] Add 15 g of dried siloxane-modified boron nitride powder into 85 g of N, N-dimethylacetamide, and pass N at a stirring speed of 300 rpm / min. 2 Stir for 30 minutes under...

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Abstract

The invention relates to a preparing method of a high-thermal-conductivity and high-tensile-elasticity-modulus polyimide film. The preparing method of the high-thermal-conductivity and high-tensile-elasticity-modulus polyimide film is characterized by including the steps that siloxane-modified boron-nitride organic dispersion liquid accounting for 5% to 25% of the whole weight of a polyamide acidsolution is added into the polyamide acid solution, and through salivating, the high-thermal-conductivity and high-tensile-elasticity-modulus polyimide film is prepared; the siloxane-modified boron-nitride organic dispersion liquid is prepared in a manner that siloxane-modified boron nitride powder is dispersed into an organic solvent, wherein the mass concentration of siloxane-modified boron nitride is 10% to 20%. Under the condition that the excellent mechanical performance is guaranteed, the polyimide film prepared with the method has the high thermal conductivity and the high tensile elasticity modulus.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a polyimide film with high thermal conductivity and high tensile elastic modulus and a preparation method thereof. Background technique [0002] Polyimide (PI) is an aromatic heterocyclic polymer compound containing imide groups in the main chain of the molecule. It is a special engineering plastic with excellent performance, and it is also the polymer material with the highest heat resistance level so far. It can be widely used Used in aerospace, machinery, electronics and other high-tech fields. [0003] On the other hand, miniaturization has become one of the main development directions of printed circuit boards and electronic packaging materials, among which polymer-based electronic packaging materials have broad prospects in the application of electronic device packaging. The existing polyimide is a very promising printed circuit board material and electronic packaging mate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08K9/06C08K3/38
CPCC08J5/18C08J2379/08C08K9/06C08K2003/385
Inventor 周浪夏梦雨赵子刚
Owner WUXI CHUANGCAI OPTICAL MATERIALS
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