Peelable one-component structural adhesive for monocrystalline silicon slicing and preparation method thereof

Abstract

The invention discloses a peelable one-component structural adhesive for monocrystalline silicon slicing and a preparation method thereof. The peelable one-component structural adhesive comprises a main agent and a diluent. The main agent is prepared from maleopimaric acid tri-functionality epoxy vinyl resin, oil-based bi-functionality epoxy vinyl resin, bisphenol A epoxy vinyl resin, methacrylicacid, a polymerization inhibitor, an initiator, a peelable factor and an inorganic filler; the diluent is prepared from hydroxyethyl methacrylate and a catalyst promoter. After curing is carried out for 4 hours at room temperature, the shear strength can reach 15 MPa or above; after a curing product is soaked for 15-30 minutes in 100 DEG C hot water, an adhesive layer is completely separated froma substrate automatically, and there is no residual adhesive on the surface of an adherend after peeling. The peelable one-component structural adhesive prepared by the method is high in strength, does not need mixing during curing, has no pot life and reduces material loss caused by two-component mixing, main raw materials are obtained from renewable resources with a wide source and high environmental friendliness, and thus the peelable one-component structural adhesive has broad application prospects.

Description

technical field [0001] The invention relates to the field of peelable epoxy vinyl resin structural adhesives, in particular to a single-component structural adhesive for peelable monocrystalline silicon slices and a preparation method thereof. Background technique [0002] Single crystal silicon wafer, also known as single crystal of silicon, is a crystal with a substantially complete lattice structure. Different directions have different properties, and it is a good semiconducting material. Single crystals used in the manufacture of semiconductor devices, solar cells, etc., require a purity of 99.9999%, or even more than 99.9999999%, and are usually drawn from high-purity polycrystalline silicon in a single crystal furnace. More than 90% of integrated circuits in the world use silicon wafers. The feature size of VLSI has been as small as 0.09 microns, and the wiring structure has reached 6-7 layers, which can integrate the entire electronic system on a chip. The size of ...

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Problems solved by technology

According to the existing literature search, most of the peelable monocrystalline silicon slice structural adhesives currently used in my country use epoxy two-component structural adhesives, and the applicant also disclosed "a peelable solar monocrystalline silicon slice structural adhesive and its preparation method" (Patent No. CN201510664963.6), this type of two-component curing process has the advantages of high bonding strength and fast curing, but there are also two-component adhesives that need to be fully mixed, the mixing period is short, the material loss is large, and the qualified rate of slicing is not good. advanced defects

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