LTCC-based cantilever beam structure and manufacturing method thereof
A manufacturing method and cantilever beam technology, applied in printed circuit manufacturing, circuit substrate materials, electrical components, etc., can solve the problems of unguaranteed flatness, cracking, deformation, etc., and achieve low cost, improved consistency, and easy control. Effect
Active Publication Date: 2019-04-16
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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[0041] Such as figure 1 As shown, the overall structure of the LTCC-based accelerometer is from top to bottom: upper capacitor plate (chip mounting plate) 1, cantilever beam plate 2, lower capacitor plate 3 (chip mounting plate), and the upper capacitor plate ( chip mounting plate) and the lower capacitor plate are LTCC substrates with cavities,
[0042] An LTCC-based cantilever beam structure is provided, including a cantilever beam plate 2. The cantilever beam plate 2 is a cantilever beam support part 2a and a mass block 2c arranged concentrically from the outside to the inside. Each corner of the mass block passes through a The cantilever beam 2b used to carry the mass block in the air is connected to the support part of the cantilever beam. The cantilever beam has N bends, and N is a positive even number. The connection point between the cantilever beam and the mass block and the connection between the cantilever beam and the support part of the cantilever beam Point righ...
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The invention discloses a manufacturing method of an LTCC-based cantilever beam structure and belongs to the field of micromechanical three-dimensional structure manufacturing. The method mainly comprises the steps of machining a widened cantilever beam and an added auxiliary beam in the mechanical cutting manner or in the laser cutting manner on each layer of raw ceramic chips after being subjected to hole metallization and conductor pattern printing, and cutting the auxiliary beam laser or mechanical equipment after lamination, respectively printing and coating glass welding slurry and interconnection slurry after sintering densification, and carrying out medium-temperature sintering and welding after combination by adopting an inverted chip mounter. According to the method, the laser cutting method is adopted on the basis of a series of technological problems of the conventional machining means. Meanwhile, the auxiliary beam and cantilever beam widening method is additionally adopted to achieve the good control effect over the laminating process. Therefore, compared with a conventional manufacturing method, the method provided by the invention has the advantages of higher operation yield, higher precision, easiness in control and lower cost. In addition, mass blocks manufactured by applying the manufacturing method disclosed by the invention greatly improve the consistency of manufacture control and greatly improves the product rate due to the adoption of the auxiliary beam and cantilever beam widening method.
Description
technical field [0001] The invention belongs to the field of micromechanical three-dimensional structure manufacturing, and in particular relates to a cantilever beam structure in an accelerometer realized on a low-temperature co-fired ceramic (LTCC) substrate and a manufacturing method thereof. technical background [0002] Low temperature co-fired ceramic (LTCC) technology is a passive component integrated circuit technology developed in the 1980s. Multi-layer LTCC substrate technology can integrate some passive components into the substrate, making it have the advantages of high speed, high frequency, high density, high reliability, etc., which is conducive to system miniaturization, and improves system reliability while increasing circuit assembly density , so it is widely used in microwave communication, aerospace and military electronics and other fields. [0003] In recent years, in addition to its wide application in the field of electronic technology, LTCC technolo...
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Login to View More IPC IPC(8): H05K1/03H05K3/00C04B35/622C04B37/00
CPCC04B35/622C04B37/003C04B2237/10C04B2237/62H05K1/0306H05K3/00
Inventor 唐小平严英占卢会湘党元兰赵飞李攀峰武云超
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP