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Slice-type heat-conducting and wave-absorbing composite and preparation method thereof

A technology of composite materials and composite wave-absorbing materials, which is applied in the field of sheet-type heat-conducting wave-absorbing composite materials and their preparation, can solve the problems of low magnetic permeability and lack of wave-absorbing properties, and achieve excellent heat conduction and wave-absorbing properties, The effect of easy precise control and easy process control

Active Publication Date: 2019-04-23
HENGDIAN GRP DMEGC MAGNETICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the existing thermal pads have low magnetic permeability and do not have good wave-absorbing properties

Method used

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  • Slice-type heat-conducting and wave-absorbing composite and preparation method thereof
  • Slice-type heat-conducting and wave-absorbing composite and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Such as figure 1 As shown, the sheet-type heat-conducting and wave-absorbing composite material has a double-layer structure of a heat-conducting layer and a wave-absorbing layer. The performance of the composite material can be regulated by adjusting the number, thickness, formula and process of the heat conducting layer and the wave absorbing layer in the composite absorbing material.

[0040] (1) The composition and weight percentage of the heat conducting layer are:

[0041] Polymer binder: 10%

[0042] Heat conduction agent: 86%

[0043] Auxiliary: 4%

[0044] The polymer binder is polyurethane, which is required to meet the requirements of the heat-conducting material casting process.

[0045] The heat conducting agent is spherical silicon carbide with a diameter of 0.8-3 μm.

[0046] The auxiliary agent includes a dispersant, a polyurethane curing agent and a curing catalyst, and the mass ratio of the three is 1:8:1.

[0047] The single layer thickness of t...

Embodiment 2

[0063] Such as figure 1 As shown, the sheet-type heat-conducting and wave-absorbing composite material has a double-layer structure of a heat-conducting layer and a wave-absorbing layer. The performance of the composite material can be regulated by adjusting the number, thickness, formula and process of the heat conducting layer and the wave absorbing layer in the composite absorbing material.

[0064] (1) The composition and weight percentage of the heat conducting layer are:

[0065] Polymer binder: 12%

[0066] Heat conduction agent: 84%

[0067] Auxiliary: 4%

[0068] The polymer binder is polymethyl methacrylate, which is required to meet the requirements of the heat-conducting material casting process.

[0069] The heat conducting agent is spherical aluminum oxide with a diameter of 1-3 μm.

[0070] The auxiliary agent includes a dispersant, a polymethyl methacrylate curing agent and a curing catalyst, and the mass ratio of the three is 3:6:1.

[0071] The single-l...

Embodiment 3

[0087] Such as figure 1 As shown, the sheet-type heat-conducting and wave-absorbing composite material has a double-layer structure of a heat-conducting layer and a wave-absorbing layer. The performance of the composite material can be regulated by adjusting the number, thickness, formula and process of the heat conducting layer and the wave absorbing layer in the composite absorbing material.

[0088] (1) The composition and weight percentage of the heat conducting layer are:

[0089] Polymer binder: 14%

[0090] Heat conduction agent: 82%

[0091] Auxiliary: 4%

[0092] The polymer binder is ethyl cellulose, which is required to meet the requirements of the heat-conducting material casting process.

[0093] The heat conducting agent is spherical zinc oxide with a diameter of 0.5-2 μm.

[0094] The auxiliary agent includes a dispersant, an ethyl cellulose curing agent and a curing catalyst, and the mass ratio of the three is 3:6:1.

[0095] The single-layer thickness of...

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Abstract

The invention discloses a slice-type heat-conducting and wave-absorbing composite and a preparation method thereof. The slice-type heat-conducting and wave-absorbing composite comprises heat conducting layers and wave absorbing layers; each heat conducting layer comprises, by weight, 8-15% of polymer binders, 80-87% of heat conducting agents and less than or equal to 5% of auxiliary agents; each wave absorbing layer comprises, by weight, 5-17% of polymer binders, 80-92% of magnetic powder and less than or equal to 3% of auxiliary agents. During preparation, the thickness of each heat conducting layer is 0.07-0.13mm, and the thickness of each wave absorbing layer is 0.07-0.13mm. The composite has good heat dissipation characteristics and good wave absorbing properties, and also has excellent comprehensive performance such as mechanical property, weather resistance, corrosion resistance and environmental protection, thereby being expected to be a novel ideal heat-conducting and wave-absorbing material.

Description

technical field [0001] The invention relates to the fields of wave-absorbing materials and heat-conducting materials, in particular to a sheet-type heat-conducting wave-absorbing composite material and a preparation method thereof. Background technique [0002] With the development of electronic equipment in the direction of thinning, high-speed operation, high frequency and high integration, heat dissipation problems may occur in any part of electronic equipment, thus affecting the working stability, reliability and service life of electronic equipment, and even Will cause damage to the device. The parts where heat dissipation problems are prone to occur are usually in some chip positions with digital control / power amplification. The use of thermal pads can effectively export or conduct excess heat generated by the equipment to the graphite layer, so that the chip will not overheat and the heat on the surface will flow along the surface. Diffusion evenly in the direction, ...

Claims

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Application Information

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IPC IPC(8): B32B9/00B32B9/04B32B37/06B32B37/10
CPCB32B9/00B32B9/041B32B37/06B32B37/10B32B2307/302B32B2307/712B32B2307/714
Inventor 郝斌刘立东蒋劭培
Owner HENGDIAN GRP DMEGC MAGNETICS CO LTD
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