Nano-silver powder and, preparation of nano-silver powder and application of nano-silver powder in low-temperature curing conductive silver paste

A technology of nano-silver powder and conductive silver paste, which is applied in the direction of conductive materials, circuits, and electrical components dispersed in non-conductive inorganic materials, which can solve the problems of reducing electrical conductivity and achieve low cost, guaranteed application performance, and high promotional value Effect

Active Publication Date: 2019-04-30
TAIYUAN HYPERION NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, common dispersants include polyvinylpyrrolidone (PVP), polyvinyl alcohol, sodium citrate, etc. These dispersants are wrapped on the surf

Method used

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  • Nano-silver powder and, preparation of nano-silver powder and application of nano-silver powder in low-temperature curing conductive silver paste
  • Nano-silver powder and, preparation of nano-silver powder and application of nano-silver powder in low-temperature curing conductive silver paste
  • Nano-silver powder and, preparation of nano-silver powder and application of nano-silver powder in low-temperature curing conductive silver paste

Examples

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Example Embodiment

[0031] Example 1

[0032] This example provides a method for preparing nano silver powder with uniform particle size and stable performance by using silver ammonia solution as the silver source, glucose as the reducing agent, and E44 as the dispersant, as follows:

[0033] (1) Prepare 220 ml of silver ammonia solution with a concentration of 1.5 mol / l, in which silver nitrate: ammonia water = 1:1.

[0034] (2) Configure a mixed solution containing dispersant and reducing agent:

[0035] Dissolve 2 g of E44 in a mixed solution of a proper amount of DBE and ethanol, then dissolve the mixed solution in 500 ml of pure water, stir and disperse for 1.5 hours, then slowly raise the temperature to 60°C, then add 5.2 g of glucose and continue stirring for 30 minutes and then raise the temperature to 62.0 ℃.

[0036] (3) Add the above-mentioned mixed solution configured in step (2) to the configured 220 ml silver ammonia solution at a rate of 2.5 ml / min, and after the dropwise addition is comple...

Example Embodiment

[0038] Example 2

[0039] This example provides a method for preparing nano silver powder with uniform particle size and stable performance by using silver ammonia solution as the silver source, glucose as the reducing agent, and E42 as the dispersant, as follows:

[0040] (1) Prepare 220 ml of silver ammonia solution with a concentration of 1.5 mol / l, in which silver nitrate: ammonia water = 1:1.

[0041] (2) Configure a mixed solution containing dispersant and reducing agent:

[0042] Dissolve 2 g of E42 in a mixed solution of a suitable amount of DBE and ethanol, dissolve the mixed solution in 500 ml of pure water, stir and disperse for 1.5 hours, then slowly raise the temperature to 60°C, then add 5.2 g of glucose and continue stirring for 30 minutes and then raise the temperature to 62.0°C .

[0043] (3) The above-mentioned mixed solution configured in step (2) is added to the configured silver ammonia solution at a rate of 2.5 ml / min. After the dripping reaction is completed, the...

Example Embodiment

[0045] Example 3

[0046] This example provides a specific application example of using the silver powder obtained in Example 1 to prepare low-temperature curing conductive nano silver paste.

[0047] The preparation method of the above-mentioned low-temperature solidified conductive nano silver paste is as follows: add 20 g of E44 resin to 16.5 g of DBE solvent, stir at 80° C. for 2 hours, obtain a binder after the E44 resin is fully dissolved, and cool at room temperature for later use. Weigh 0.5g each of 2950 and 4360S curing agents, 1g each of the leveling agent Efka 3777 and defoamer BYK333 into the cooled binder, stir at room temperature for 1 hour, and then add 16g of the silver powder obtained in Example 1. Stir and disperse for 1 hour at room temperature, and roll 4 times with a three-roll mill to obtain low-temperature solidified nano silver paste.

[0048] After the low-temperature curing conductive silver paste prepared in this example was cured at 150°C for 10 minutes, ...

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Abstract

The invention provides a nano-silver powder, a preparation of the nano-silver powder and an application of the nano-silver powder in low-temperature curing conductive silver paste. A method for preparing the nano-silver powder adopts epoxy resin as a dispersing agent, hydrazine hydrate, ascorbic acid and one kind or several kinds of glucose as a reducing agent, and a silver-ammonia solution as a silver source, and the high-dispersity nano-silver powder with the particle size of 50 nm-700 nm is prepared through a reduction reaction. According to the method, the epoxy resin is used as the dispersing agent, the prepared nano-silver powder is applied to low-temperature curing conductive silver paste of the same resin system, the compatibility between the silver powder and the resin in the low-temperature curing conductive silver paste can be improved, so that the conductivity of the slurry is improved, by taking the nano-silver powder as a raw material, the low-temperature cured conductingsilver paste with square resistance which is reduced to 20 m Ohm/sq.

Description

technical field [0001] The invention relates to the preparation of nano-silver powder, in particular to a nano-silver powder used in the field of low-temperature curing conductive silver paste and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, the demand for membrane switches, LED displays, and radio frequency identification systems has increased rapidly. As a functional material for preparing such electronic components, the development and application of conductive silver paste has attracted widespread attention. Among them, low-temperature curing conductive silver paste is widely used in membrane switches, capacitive electrodes, touch screens, etc. because of its excellent electrical conductivity, thermal conductivity, and practicability. Silver powder is an important component in low-temperature curing conductive silver paste, and its particle size and morphology have a direct impact on the performance o...

Claims

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Application Information

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IPC IPC(8): B22F9/24B22F1/00H01B1/22H01B13/00
CPCH01B1/22H01B13/00B22F9/24B22F1/05B22F1/102
Inventor 商海谢寒陈艳敏赵刚郎嘉良
Owner TAIYUAN HYPERION NEW MATERIAL CO LTD
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