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Nano-silver powder and, preparation of nano-silver powder and application of nano-silver powder in low-temperature curing conductive silver paste

A technology of nano-silver powder and conductive silver paste, which is applied in the direction of conductive materials, circuits, and electrical components dispersed in non-conductive inorganic materials, which can solve the problems of reducing electrical conductivity and achieve low cost, guaranteed application performance, and high promotional value Effect

Active Publication Date: 2019-04-30
TAIYUAN HYPERION NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, common dispersants include polyvinylpyrrolidone (PVP), polyvinyl alcohol, sodium citrate, etc. These dispersants are wrapped on the surface of nano-silver particles, (the low temperature of 130°C in the silver paste system cannot be completely cured thereby) reducing its Conductivity

Method used

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  • Nano-silver powder and, preparation of nano-silver powder and application of nano-silver powder in low-temperature curing conductive silver paste
  • Nano-silver powder and, preparation of nano-silver powder and application of nano-silver powder in low-temperature curing conductive silver paste
  • Nano-silver powder and, preparation of nano-silver powder and application of nano-silver powder in low-temperature curing conductive silver paste

Examples

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Effect test

example 1

[0032] This example provides a kind of adopting silver ammonia solution as silver source, and glucose is reducing agent, and E44 is dispersing agent, the method for preparing the uniform particle size, stable performance nano-silver powder, specifically as follows:

[0033] (1) Configure 220ml of silver ammonia solution with a concentration of 1.5mol / l, wherein silver nitrate:ammonia water=1:1.

[0034] (2) Configure a mixed solution containing a dispersant and a reducing agent:

[0035] Dissolve 2 grams of E44 in a mixed solution of an appropriate amount of DBE and ethanol, then dissolve the mixed solution in 500ml of pure water, stir and disperse for 1.5 hours, then slowly raise the temperature to 60°C, then add 5.2 grams of glucose, continue stirring for 30 minutes, and then raise the temperature to 62.0 ℃.

[0036](3) Add the above-mentioned mixed solution configured in step (2) to the configured 220ml silver ammonia solution at a rate of 2.5ml / min. After the dropwise add...

example 2

[0039] This example provides a kind of adopting silver ammonia solution to be silver source, and glucose is reducing agent, and E42 is dispersing agent, the method for preparing the uniform particle size, stable performance nano-silver powder, specifically as follows:

[0040] (1) Configure 220ml of silver ammonia solution with a concentration of 1.5mol / l, wherein silver nitrate:ammonia water=1:1.

[0041] (2) Configure a mixed solution containing a dispersant and a reducing agent:

[0042] Dissolve 2 grams of E42 in a mixed solution of an appropriate amount of DBE and ethanol, dissolve the mixed solution in 500ml of pure water, stir and disperse for 1.5 hours, then slowly heat up to 60°C, then add 5.2 grams of glucose and continue stirring for 30 minutes, then heat up to 62.0°C .

[0043] (3) Add the above-mentioned mixed solution configured in step (2) to the configured silver ammonia solution at a rate of 2.5ml / min. After the dropwise reaction is completed, continue to sti...

example 3

[0046] This example provides a specific application example of using the silver powder obtained in Example 1 to prepare low-temperature curing conductive nano-silver paste.

[0047] The preparation method of the above-mentioned low-temperature curing conductive nano-silver paste is as follows: add 20g of E44 resin to 16.5g of DBE solvent, stir at 80°C for 2 hours, obtain a binder after the E44 resin is fully dissolved, and cool it at room temperature for use. Weigh 0.5g each of the 2950 and 4360S curing agents, 1g each of the leveling agent Efka 3777 and the defoamer BYK333 and add them to the cooled binder, stir at room temperature for 1h, and then add 16g of the silver powder obtained in Example 1, Stir and disperse at room temperature for 1 hour, and roll 4 times with a three-roll mill to obtain a low-temperature solidified nano-silver paste.

[0048] The low-temperature curing conductive silver paste prepared in this example has a square resistance of 30 mΩ / □ after curing ...

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Abstract

The invention provides a nano-silver powder, a preparation of the nano-silver powder and an application of the nano-silver powder in low-temperature curing conductive silver paste. A method for preparing the nano-silver powder adopts epoxy resin as a dispersing agent, hydrazine hydrate, ascorbic acid and one kind or several kinds of glucose as a reducing agent, and a silver-ammonia solution as a silver source, and the high-dispersity nano-silver powder with the particle size of 50 nm-700 nm is prepared through a reduction reaction. According to the method, the epoxy resin is used as the dispersing agent, the prepared nano-silver powder is applied to low-temperature curing conductive silver paste of the same resin system, the compatibility between the silver powder and the resin in the low-temperature curing conductive silver paste can be improved, so that the conductivity of the slurry is improved, by taking the nano-silver powder as a raw material, the low-temperature cured conductingsilver paste with square resistance which is reduced to 20 m Ohm / sq.

Description

technical field [0001] The invention relates to the preparation of nano-silver powder, in particular to a nano-silver powder used in the field of low-temperature curing conductive silver paste and a preparation method thereof. Background technique [0002] With the rapid development of the electronics industry, the demand for membrane switches, LED displays, and radio frequency identification systems has increased rapidly. As a functional material for preparing such electronic components, the development and application of conductive silver paste has attracted widespread attention. Among them, low-temperature curing conductive silver paste is widely used in membrane switches, capacitive electrodes, touch screens, etc. because of its excellent electrical conductivity, thermal conductivity, and practicability. Silver powder is an important component in low-temperature curing conductive silver paste, and its particle size and morphology have a direct impact on the performance o...

Claims

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Application Information

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IPC IPC(8): B22F9/24B22F1/00H01B1/22H01B13/00
CPCH01B1/22H01B13/00B22F9/24B22F1/05B22F1/102
Inventor 商海谢寒陈艳敏赵刚郎嘉良
Owner TAIYUAN HYPERION NEW MATERIAL CO LTD
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