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High-heat-resistance packaging adhesive, LED packaged device employing same and packaging method

A technology of LED packaging and high heat resistance, which is applied in the direction of semiconductor devices, electrical components, non-polymer adhesive additives, etc., can solve the problems of limited lifting range, discoloration, low ratio, etc., and achieves mild conditions, high yield rate, The effect of simple process steps

Inactive Publication Date: 2019-05-10
深圳市艾迪恩科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to improve the heat resistance of the encapsulating colloid, in the prior art, a certain proportion of inorganic nano-powder materials such as nano-silicon dioxide, nano-alumina, nano-diamond, nano-boron nitride, etc. are usually used in the colloid. The introduction of inorganic nanomaterials can improve the heat resistance of encapsulating colloids to a certain extent, but the improvement range is limited. The effect of heat conduction and heat dissipation is very limited, and if the proportion of inorganic nano-powder material in the encapsulation colloid is increased to improve heat resistance, there will be a problem of discoloration after the colloid is cured, such as increasing the proportion of inorganic nano-powder material to More than 10%, the colloid will be milky white after curing, and the light transmittance of the encapsulating colloid will be greatly affected, which in turn will affect the light extraction efficiency of the encapsulating device

Method used

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  • High-heat-resistance packaging adhesive, LED packaged device employing same and packaging method

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Embodiment 1

[0029] This embodiment provides a high heat-resistant encapsulant. In parts by weight, the encapsulant is composed of 100 parts of colloidal material and 5 parts of fluoride material, wherein the colloidal material is a single-component silica gel, and its refractive index is is 1.4, the fluoride material is lutetium fluoride, and its average particle size is 10nm-50 μm, preferably 50nm-30 μm in this embodiment, and the colloid material and the fluoride material are mixed evenly with a mixer to obtain a high Heat-resistant encapsulant.

[0030] This embodiment also provides an LED packaging device using the above-mentioned high heat-resistant packaging glue, the LED packaging device such as figure 1 As shown, it includes an LED bracket 1, and at least one LED chip 2 is mounted on the LED bracket 1. In this embodiment, the LED bracket 1 is a 2835 bracket, and the LED chip 2 is a blue LED chip. The LED chip 2 is electrically connected to the positive and negative electrodes of ...

Embodiment 2

[0037] This embodiment provides a high heat-resistant encapsulant. In parts by weight, the encapsulant is composed of 100 parts of colloidal material and 500 parts of fluoride material, wherein the colloidal material is a two-component epoxy resin, which The refractive index is 1.55, the fluoride material is zirconium tetrafluoride, and its average particle size is 10nm-50μm, preferably 500-1000nm in this embodiment, and the colloid material and the fluoride material are mixed evenly with a mixer That is, a highly heat-resistant encapsulant is obtained.

[0038] This embodiment also provides an LED packaging device using the above-mentioned high heat-resistant packaging glue. The structure of the LED packaging device is basically the same as that of Embodiment 1, the difference is that the LED support 1 is a filament support, and the number of LED chips 2 is 28. Blue light LEDs are mounted with chips, and the LED chips 2 and between the LED chips 2 and the LED bracket 1 are co...

Embodiment 3

[0041] This embodiment provides a high heat-resistant encapsulant. In parts by weight, the encapsulant is composed of 100 parts of colloidal material and 400 parts of fluoride material, wherein the colloidal material is a two-component silica gel, and its refractive index is is 1.44, the fluoride material is magnesium fluoride, and its average particle size is 10nm-50 μm, preferably 5-30 μm in this embodiment, and the colloid material and the fluoride material are mixed evenly with a mixer to obtain a high Heat-resistant encapsulant.

[0042] This embodiment also provides an LED packaging device using the above-mentioned high heat-resistant packaging glue. The structure of the LED packaging device is basically the same as that of Embodiment 1, the difference is that the LED support 1 is a filament support, and the number of LED chips 2 is 28. Blue light LEDs are mounted with chips, and the LED chips 2 and between the LED chips 2 and the LED bracket 1 are connected by gold wire...

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Abstract

The invention belongs to the technical field of semiconductor packaging and discloses high-heat-resistance packaging adhesive, an LED packaged device employing the same and a packaging method. The high-heat-resistance packaging adhesive is made from, by weight, 100 parts of an adhesive material and 5-500 parts of a fluoride material. Compared with traditional packaging adhesive materials, the high-heat-resistance packaging adhesive has a higher doping ratio of the inorganic fluoride material, which helps effectively improve heat resistance and heat-dissipating property of the packaging adhesive; more importantly, the high-ratio mixing of the fluoride powder material herein brings very low influence on the light transmittance of the adhesive material; after the high-heat-resistance packaging adhesive is applied to an LED packaged device and solidifies, very high light transmittance can be maintained for the device herein, and therefore, light emergence efficiency of the pacakaged deviceis never affected.

Description

technical field [0001] The invention belongs to the technical field of semiconductor lighting, and in particular relates to a high heat-resistant encapsulation adhesive, an LED encapsulation device and an encapsulation method using the encapsulation adhesive. Background technique [0002] In recent years, with the rapid development of electronic technology, breakthroughs have been made in the research of light-emitting diode (LED) products. This semiconductor device, which converts electrical energy into light, has rich luminous colors, energy saving, long life, and fast response. And other advantages, widely used in general lighting, traffic signals, landscape lighting, display screens and other fields. [0003] LED packaging devices and lighting products are constantly developing towards higher power and higher brightness, which puts forward higher requirements for LED devices and their packaging technology, and has also been continuously innovated and developed. Since th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J11/04H01L33/56H01L33/48
Inventor 不公告发明人
Owner 深圳市艾迪恩科技有限公司
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