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A kind of aluminum alloy surface modification sintering lead-free low-temperature silver paste thick film method

An aluminum alloy surface and modification technology, applied in the direction of metal material coating process, coating, etc., can solve problems such as the adhesion of silver thick film on the surface of aluminum alloy, improve wettability and solderability, and ensure electrical conductivity. , the effect of good industrial application prospects

Active Publication Date: 2021-02-02
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0010] The main purpose of the present invention is to provide a method of modifying and sintering lead-free low-temperature silver paste thick film on the surface of aluminum alloy to solve the problem of preparation of lead-free low-temperature sinter silver paste and the problem of adhesion of silver thick film on the surface of aluminum alloy

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  • A kind of aluminum alloy surface modification sintering lead-free low-temperature silver paste thick film method
  • A kind of aluminum alloy surface modification sintering lead-free low-temperature silver paste thick film method

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Embodiment 1

[0046] This embodiment provides the first aluminum alloy surface modification sintering lead-free low-temperature silver paste thick film method, which specifically includes the following steps:

[0047] The composition of raw materials for preparing glass powder is in molar percentage: Bi 2 o 3 35%; H 3 BO 3 50%; ZnO 10%; Al 2 o 3 2%, Li 2 CO 3 1 %, SiO 2 2%;

[0048] 1. Preparation of lead-free low-temperature sintered glass powder by melt quenching method, including the following steps:

[0049] (1) Calculate and weigh the raw materials according to the mole percentage, put each component in a beaker, add an appropriate amount of absolute ethanol for ultrasonic dispersion for 10 min, then stir for 2 h, mix well and dry at 80 °C;

[0050] (2) Take out the dried powder and grind it fully into a corundum crucible for smelting. During smelting, the heating rate is 10 ℃ / min to 1300 ℃ for 30 minutes; then pour the molten liquid into deionized water for smelting Quenchin...

Embodiment 2

[0063] This embodiment provides the second aluminum alloy surface modification sintering lead-free low-temperature silver paste thick film method, which specifically includes the following steps:

[0064] The composition of raw materials for preparing glass powder is in molar percentage: Bi 2 o 3 35%; H 3 BO 3 50%; ZnO 10%; Al2O 3 2%, Li 2 CO 3 1 %, SiO 2 is 2%.

[0065] 1. Preparation of lead-free low-temperature sintered glass powder by melt quenching method, including the following steps:

[0066] (1) Calculate and weigh the raw materials according to the mole percentage, put each component in a beaker, add an appropriate amount of absolute ethanol for ultrasonic dispersion for 10 min, then stir for 2 h, mix well and dry at 80 °C;

[0067] (2) Take out the dried powder and fully grind it into a corundum crucible for smelting. During smelting, the heating rate is 10 ℃ / min to 1300 ℃ for 30 minutes; then pour the melt into deionized water for smelting Quenching treatm...

Embodiment 3

[0080] This embodiment provides the third aluminum alloy surface modification sintering lead-free low-temperature silver paste thick film method, which specifically includes the following steps:

[0081] The composition of raw materials for preparing glass powder is in molar percentage: Bi 2o 3 35%; H 3 BO 3 50%; ZnO is 15%.

[0082] 1. Preparation of lead-free low-temperature sintered glass powder by melt quenching method, including the following steps:

[0083] (1) Calculate and weigh the raw materials according to the mole percentage, put each component in a beaker, add an appropriate amount of absolute ethanol for ultrasonic dispersion for 10 minutes, then stir for 2 hours, mix well and dry at 80 °C;

[0084] (2) Take out the dried powder and grind it fully into a corundum crucible for smelting. During smelting, the heating rate is 10 ℃ / min to 1300 ℃ for 30 minutes; then pour the molten liquid into deionized water for smelting Quenching treatment to obtain dark brown ...

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Abstract

The invention provides a sintered lead-free low-temperature silver paste thick film method for surface modification of an aluminum alloy, and belongs to the technical field of the surface modificationof the aluminum alloy. The sintered lead-free low-temperature silver paste thick film method comprises the steps that a lead-free low-temperature sintered conductive silver paste is prepared, the silver paste is applied on the surface of the aluminum alloy by means of silk screen printing or metal stencil printing or dip coating, a silver thick film is formed on the surface of the aluminum alloyafter short-time low-temperature sintering, and a thick film layer has good bonding force with an aluminum alloy substrate, so that the surface modification of the aluminum alloy is realized, the wettability of a tin alloy brazing material on the surface of the aluminum alloy is greatly improved, the ohmic contact between the silver thick film and the aluminum alloy surface is maintained, and theapplicability of the aluminum alloy is further enhanced. The sintered lead-free low-temperature silver paste thick film method has a low temperature, environmental protection and no pollution and is simple and feasible, can obviously improve the wettability and weldability of the tin alloy brazing material on the surface of the aluminum alloy, is suitable for industrial production, and has excellent industrial application prospects.

Description

technical field [0001] The invention belongs to the technical field of aluminum alloy surface modification, in particular to a method of aluminum alloy surface modification and sintering lead-free low-temperature silver paste thick film to improve the solderability of tin alloy solder on the surface. Background technique [0002] Aluminum alloy is the most widely used non-ferrous metal structural material in industrial production and application. Because the aluminum alloy formed by adding alloy elements such as copper, zinc, manganese, silicon, and magnesium can maintain the advantages of light weight of pure aluminum, it can also have high The strength makes it better than many alloy steels in specific strength, and it becomes an ideal structural material, which is widely used in the fields of aviation, aerospace, shipbuilding, automobile, mechanical electronics and chemical industry. [0003] With the rapid development of science and technology and industrial economy, the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C24/10C03C12/00
Inventor 李明雨孙钦
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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