Application of graphene oxide conductive slurry in hole blackening direct electroplating

A technology of conductive paste and graphene, applied in electrolytic inorganic material plating, electrical components, printed circuits, etc., can solve the problems of strict requirements on the density of conductive layers and many steps, so as to improve the efficiency of electroplating, combine firmly, and prevent aggregation The effect of the phenomenon

Active Publication Date: 2019-05-28
YANTAI HENGNUO CHEM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention aims at the problem that the existing black hole direct electroplating technology has many steps and has strict requirements on the compactness of the conductive layer, and provides an application of graphene oxide conductive paste in black hole direct electroplating

Method used

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  • Application of graphene oxide conductive slurry in hole blackening direct electroplating
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  • Application of graphene oxide conductive slurry in hole blackening direct electroplating

Examples

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Embodiment 1

[0032] A kind of application of graphene oxide electroconductive paste in black hole direct electroplating, comprising preparing graphene oxide electroconductive paste and using the obtained graphene oxide electroconductive paste to carry out black hole direct electroplating, the steps are:

[0033] A. Preparation of graphene oxide conductive paste

[0034] A1) Preparation of graphite oxide powder: immerse 10g of natural flake graphite in the mixed acid of 100ml of concentrated sulfuric acid and 20ml of concentrated nitric acid, filter after soaking at room temperature for 12h, wash the filter cake with deionized water until the pH value of the lotion is between 6-7 After a period of time, the filter cake was placed in a vacuum drying oven and dried at 70°C for 4 hours to obtain graphite oxide powder;

[0035] A2) Modified graphite oxide: Soak graphite oxide powder in hydrazine hydrate at room temperature for 10 hours, filter after soaking, wash the filter cake with deionized ...

Embodiment 2

[0044] A kind of application of graphene oxide electroconductive paste in black hole direct electroplating, comprising preparing graphene oxide electroconductive paste and using the obtained graphene oxide electroconductive paste to carry out black hole direct electroplating, the steps are:

[0045] A. Preparation of graphene oxide conductive paste

[0046] A1) Preparation of graphite oxide powder: immerse 10g of natural flake graphite in the mixed acid of 100ml of concentrated sulfuric acid and 20ml of concentrated nitric acid, filter after soaking at room temperature for 16h, wash the filter cake with deionized water until the pH value of the lotion is between 6-7 After a period of time, the filter cake was placed in a vacuum drying oven and dried at 65°C for 5 hours to obtain graphite oxide powder;

[0047] A2) Modified graphite oxide: Soak graphite oxide powder in hydrazine hydrate for 9 hours at room temperature, filter after soaking, wash the filter cake with deionized w...

Embodiment 3

[0056] A kind of application of graphene oxide electroconductive paste in black hole direct electroplating, comprising preparing graphene oxide electroconductive paste and using the obtained graphene oxide electroconductive paste to carry out black hole direct electroplating, the steps are:

[0057] A. Preparation of graphene oxide conductive paste

[0058] A1) Preparation of graphite oxide powder: immerse 10g of natural flake graphite in the mixed acid of 100ml of concentrated sulfuric acid and 20ml of concentrated nitric acid, filter after soaking at room temperature for 18h, wash the filter cake with deionized water until the pH value of the lotion is between 6-7 After a period of time, the filter cake was placed in a vacuum drying oven and dried at 60°C for 6 hours to obtain graphite oxide powder;

[0059] A2) Modified graphite oxide: Soak graphite oxide powder in hydrazine hydrate at room temperature for 8 hours, filter after soaking, wash the filter cake with deionized w...

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Abstract

The invention discloses application of graphene oxide conductive slurry in hole blackening direct electroplating. The application comprises the steps of preparing the graphene oxide conductive slurryand using the prepared graphene oxide conductive slurry to carry out hole blackening direct electroplating. According to the graphene oxide conductive slurry in hole blackening direct electroplating,the graphene oxide is modified to contain cyanate ester in the surface so that the graphene oxide conductive slurry has the very high mobility and the very high film forming property, an attached graphene oxide dense layer has stable continuity, the strength of the dense layer can be improved while the electric conduction capacity is improved, an electroplating plate is not prone to having littlecracks or being broken when deforms, and the service life of a conductive plate is prolonged; and according to the application of the graphene oxide conductive slurry in hole blackening direct electroplating, compared with a hole blackening direct electroplating technology in the prior art, the process step of using the graphene oxide conductive slurry in hole blackening direct electroplating is greatly simplified, the whole electroplating technology can be completed by repeating coating once, operation is easy to carry out, and the rate of finished products is high.

Description

technical field [0001] The invention relates to black hole direct electroplating technology, in particular to the application of a graphene oxide conductive paste in black hole direct electroplating. Background technique [0002] Printed circuit board (PCB, FPC) hole metallization technology is one of the keys to printed board manufacturing technology. For a long time, people have used the method of electroless copper deposition (PTH), but the PTH solution contains various substances that are harmful to the ecological environment. Chemical substances, such as EDTA, NTA, EDTP and easily carcinogenic formaldehyde, make wastewater treatment complex and costly. In addition, the stability of the PTH solution is poor, and the analysis and maintenance of the solution are complicated; at the same time, the mechanical properties of the PTH copper plating layer are relatively poor, and the process is cumbersome. Therefore, the industry has been looking for a new hole metallization tec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D7/00C25D9/04H05K3/18
Inventor 任朋成
Owner YANTAI HENGNUO CHEM TECH CO LTD
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