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A kind of cleaning agent and using method thereof

A pore agent and cleaning technology, applied in chemical instruments and methods, detergent compositions, detergent compounding agents, etc., can solve the problems of high cost of electroless copper plating, improve effective adsorption, improve backlight, reduce The effect of holes without copper problems

Active Publication Date: 2021-01-01
湖南互连微电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the electroless copper plating process, the cost of activated palladium accounts for about 45%. As a precious metal, palladium is also a high-quality catalyst. More and more stringent, in order to make the backlight meet the requirements, usually can only be achieved by increasing the activation concentration, increasing the thickness of electroless copper plating, etc., making the cost of electroless copper plating remain high

Method used

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  • A kind of cleaning agent and using method thereof
  • A kind of cleaning agent and using method thereof
  • A kind of cleaning agent and using method thereof

Examples

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Effect test

Embodiment 1

[0041] 1.1. The formula of the cleaning agent is: sodium gluconate 25g / L, ammonium chloride 4g / L, diethylenetriamine 25g / L, isopropanol 20g / L, non-ionic surfactant TRITON X-100 Be the anionic surfactant 0.2g / L of the alkyl diphenyl ether sulfonate group of 0.4g / L, formula one structure, wherein R is C 12 h 25 ; The rest are deionized water, as shown in Table 1.

[0042]1.2. Take 6 pieces of 5×3cm Shengyi Tg170 substrate boards, remove the copper foil on the board surface with etching solution, then soak in the cleaning agent obtained in 1.1, soak at 50°C for 5 minutes, wash with water, and soak them separately In the ionic palladium activation tank with a standard concentration of 10%, 30%, 50%, 70%, 100%, and 150% at a constant temperature of 45°C (the ionic palladium activation standard solution is: 3 pyridinemethanol 1g / L, palladium chloride 0.15 g / L, adjust PH=9.5), take it out after 5 minutes, wash it with water, soak it in a reducing agent solution (dimethylamine boran...

Embodiment 2

[0046] 2.1. The formula of the cleaning agent is: sodium gluconate 25g / L, ammonium chloride 4g / L, diethylenetriamine 25g / L, isopropanol 20g / L, non-ionic surfactant TRITON X-100 Be the anionic surfactant 0.6g / L of the alkyl diphenyl ether sulfonate group of 0.4g / L, formula one structure, wherein R is C 12 h 25 ; The rest are deionized water, as shown in Table 1.

[0047] 2.2. Take 6 pieces of 5×3cm Shengyi Tg170 substrate boards, remove the copper foil on the board surface with etching solution, then soak in the cleaning agent obtained in 2.1, soak at 50°C for 5min, wash with water, and soak them separately In the ionic palladium activation tank with a standard concentration of 10%, 30%, 50%, 70%, 100%, and 150% at a constant temperature of 45°C (the ionic palladium activation standard solution is: 3 pyridinemethanol 1g / L, palladium chloride 0.15 g / L, adjust PH=9.5), take it out after 5 minutes, wash it with water, soak it in a reducing agent solution (dimethylamine borane 0....

Embodiment 3

[0051] 3.1. The formula of the cleaning agent is: sodium gluconate 25g / L, ammonium chloride 4g / L, diethylenetriamine 25g / L, isopropanol 20g / L, non-ionic surfactant TRITON X-100 Be the anionic surfactant 1.0g / L of the alkyl diphenyl ether sulfonate group of 0.4g / L, formula one structure, wherein R is C 12 h 25 ; The rest are deionized water, as shown in Table 1.

[0052] 3.2. Take 6 pieces of 5×3cm Shengyi Tg170 substrate boards, remove the copper foil on the board surface with etching solution, then soak in the cleaning agent obtained in 2.1, soak for 5 minutes at 50°C, wash with water, and soak them separately In the ionic palladium activation tank with a standard concentration of 10%, 30%, 50%, 70%, 100%, and 150% at a constant temperature of 45°C (the ionic palladium activation standard solution is: 3 pyridinemethanol 1g / L, palladium chloride 0.15 g / L, adjust PH=9.5), take it out after 5 minutes, wash it with water, soak it in a reducing agent solution (dimethylamine bora...

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Abstract

An embodiment of the invention discloses a cleaning and finishing agent and an application method thereof. The cleaning and finishing agent comprises sodium gluconate, ammonium chloride, polyethylenepolyamine, lower alcohol, a non-ionic surfactant, an anionic surfactant and deionized water. Compared with a cleaning and finishing agent in the prior art, the cleaning and finishing agent has the advantages that the sodium gluconate, ammonium chloride, polyethylene playamine, lower alcohol, non-ionic surfactant, anionic surfactant and deionized water are used to treat the surface of a pore ring of a PCB board, and glass fiber exposed in the surface of the pore ring is cleaned through sodium gluconate and ammonium chloride; the surface of pore ring resin can be treated by polyethylene polyamine; pore walls can be wetted through the lower alcohol and non-ionic surfactant; the resin and glass fiber on the pore ring surface can be modified through the anionic surfactant to enable the surfaceof the pore ring to form high Zeta potential, effective adsorption capacity of a palladium activator is increased, backlight of electroless copper plating is improved, and the situation of hole-without-copper is reduced.

Description

technical field [0001] The present application relates to the technical field of surface treatment, in particular to a cleaning agent for electroless copper plating and a method for using the same. Background technique [0002] Printed circuit board (PCB) has the advantages of high operational reliability, light weight, small size, and easy standardization, and is the core component of almost all electronic equipment. Electroless copper plating process is the key technology of printed circuit metallization. Since the base material of the circuit board is mostly composed of non-conductive materials such as non-conductive resin and glass fiber, the hole wall cannot be plated with metal when the printed circuit is plated. Therefore, the electroplating of the hole wall must first prepare a conductive film. At present, the commonly used method is to first electroless copper plating. [0003] Before electroless copper plating, the substrate must be pre-treated, generally includi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C11D1/83C11D3/20C11D3/04C11D3/30C11D3/60C11D11/00
Inventor 肖开球张新学刘龙平张毅邹银超贺炳祥
Owner 湖南互连微电子材料有限公司
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