Copper-based spherical powder material, as well as preparation method and application thereof

Abstract

The invention discloses a copper-based spherical powder material, as well as a preparation method and application thereof. The copper-based spherical powder material is prepared from the following components in percentage by mass: 0.01 to 0.2 percent of phosphorus, 0.1 to 0.5 percent of tin, 0.1 to 1 percent of nickel, and the balance copper and inevitable impurities. The preparation method comprises the steps of uniformly mixing molten copper, a phosphorus source, a tin source, a nickel source and a reducing agent, and carrying out smelting; and adopting a water atomization method or a gas atomization method for powdering the smelting product, and obtaining the copper-based spherical powder material. According to the copper-based spherical powder material, as well as the preparation method and the application thereof provided by the invention, the surface tension of molten metal can be appropriately increased, and the copper-based spherical powder material with high sphericity and high bulk packing density is obtained. Meanwhile, along with the increase of the surface tension, the capacity of a welding flux filling a large-gap welded joint is improved, and the problem that the large-gap welded joint is hard to braze is solved. The content of the material in a thixotropic welding flux can maximally reach up to 93 percent, and large-gap carbon steel parts with the gap being 1mmcan be brazed.

Description

technical field [0001] The invention relates to a copper-based spherical powder material, in particular to a copper-based spherical powder material for thixotropic solder and its preparation method and application, belonging to the field of welding technology. Background technique [0002] Thixotropic solder is mainly composed of special alloy (or metal) powder, high thixotropic colloid and active substances. Under the condition of no external force, thixotropic solder shows almost solid-state characteristics, such as maintaining a certain shape and not flowing and collapse etc. When subjected to external force, it immediately shows certain liquid characteristics, such as certain fluidity, can be easily extruded by pneumatic or mechanical extrusion through dispensing equipment, and can quickly return to a solid state. The special properties of thixotropic solder make it have broad application prospects in the field of automatic brazing. [0003] In thixotropic solder, the ...

AI Technical Summary

Problems solved by technology

This kind of powder has poor sphericity and low bulk density. For example, the bulk density of common copper powder is 3.2g / m3. 3 ; When the content of this copper powder is increased in the thixotropic metal, the viscosity of the thixotropic metal will also increase rapidly, which will lead to difficulty in solder coating or the inability to apply solder. Usually, the content of this powder can only be added to 85% Left and right, so it is powerless for brazing parts with large gaps

In addition, pure copper powder is currently widely used as the solder for welding carbon steel parts in the furnace. This type of solder has low surface tension after melting. Although it can well fill conventional parts with a weld gap below 0.5mm, when the brazing gap is greater than mm, it is prone to the problem that the weld cannot be filled due to weak capillary action