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Composite abrasive particle polishing solution and preparation method thereof

A technology of composite abrasive grains and polishing liquid, which is applied in the fields of surface treatment and chemical mechanical polishing, can solve the problems that the polishing rate and polishing effect of hard materials need to be improved, so as to improve the service life and scope of application, not easy to break, and operability strong effect

Active Publication Date: 2019-06-14
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The polishing rate and polishing effect of the existing composite abrasive polishing fluid on hard materials need to be improved

Method used

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  • Composite abrasive particle polishing solution and preparation method thereof
  • Composite abrasive particle polishing solution and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0039] (1) Take 10mL of polystyrene microsphere emulsion with a concentration of 12g / L, add 250mL of deionized water, ultrasonically disperse at 40KHz frequency, add 0.002mol of cerium nitrate hexahydrate and 0.001mol of hexamethylenetetramine to obtain a mixture Solution; react the configured mixed solution in a magnetic stirrer at 85°C for 3 hours to obtain a composite abrasive solution containing cerium oxide;

[0040] (2) Add 125ml of nanodiamond suspension with a concentration of about 0.002g / mL to the above solution, stir evenly to obtain a reaction solution; react the configured reaction solution in a magnetic stirrer at 25°C for 3 hours to obtain a mixture; Carry out centrifugation and washing, specifically using the relative centrifugal force RCF to carry out centrifugation treatment in the range of 70×g to 7690×g, using deionized water, absolute ethanol, and deionized water in order to add pure liquid phase for washing, through the washing process Remove the polystyrene...

Embodiment 2

[0044] (1) Take 10mL of polystyrene microsphere emulsion with a concentration of 12g / L, add 250mL of deionized water, disperse ultrasonically at a frequency of 40KHz, add 100ml of polycrystalline diamond suspension with a concentration of about 0.005g / mL, water bath at 25℃ Heat for 3 hours to obtain a composite abrasive solution containing polycrystalline diamond;

[0045] (2) Add 0.004 mol of cerium nitrate hexahydrate and 0.002 mol of potassium hydroxide to the above-obtained solution, continue heating at 85°C in a water bath for 1.5 hours, centrifuge and wash the mixture, specifically using a relative centrifugal force RCF of 70×g to 7690 ×g for centrifugation, using deionized water, absolute ethanol, and deionized water in order to add pure liquid phase for washing. Through this washing process, the polystyrene microspheres, soft abrasive particles, and hard grinding particles that are not involved in the composite are removed To improve the purity of the composite abrasive p...

Embodiment 3

[0049] (1) Take 10mL polystyrene microsphere emulsion with a concentration of 12g / L, add 250mL deionized water, ultrasonically disperse at 40KHz frequency, add 0.02mol water glass and 0.001mol sodium hydroxide, stir to dissolve, add concentration about 200ml of a 0.002g / mL cubic boron nitride suspension, stir it evenly to obtain a reaction solution;

[0050] (2) Heat the above reaction solution in a common water bath at 80°C for 1.5 hours, centrifuge and wash the mixture, specifically using a relative centrifugal force RCF of 70×g to 7690×g for centrifugation, using deionized water, absolute ethanol, Deionized water is added to the pure liquid phase for washing. The washing process removes the polystyrene microspheres, soft abrasive particles, and hard abrasive particles that are not involved in the compounding to improve the purity of the composite abrasive particles. After washing, it is removed by centrifugation In the liquid phase, composite abrasive grains containing silicon...

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Abstract

The invention provides a composite abrasive particle polishing solution and a preparation method thereof. The composite abrasive particle polishing solution is prepared from the components in percentage by mass: 0.01%-60% of composite abrasive particles, 37%-99.97% of water, 0.01%-2% of a dispersant and 0.01%-1% of a pH value regulator; and the composite abrasive particles are each of a core-shellstructure, polystyrene microspheres are adopted as inner cores of the composite abrasive particles, and the surfaces of the polystyrene microspheres are loaded with the soft abrasive particles and the hard abrasive particles. The method for preparing the polishing solution comprises the steps: a soft abrasive particle solution and a hard abrasive particle solution are added into polystyrene microsphere dispersion liquid, then heating and stirring are carried out to react to obtain a composite abrasive particle solution, after washing and centrifugation for liquid phase removal, deionized water, the dispersant and the pH value regulator are added, the content of the components is regulated, and the composite abrasive particle polishing solution is obtained. According to the preparation method, the steps are simple, the raw materials are easy to obtain, the prepared polishing solution is high in polishing speed, and the flatness of the sub-nanometer-sized surface can be improved greatly.

Description

Technical field [0001] The invention relates to the technical field of surface treatment, in particular to the field of chemical mechanical polishing, in particular to a composite abrasive grain polishing liquid and a preparation method thereof. Background technique [0002] With the advancement of science and technology, optical components and electronic components are becoming more highly integrated and high-precision development, which puts forward higher requirements for the surface processing accuracy of materials. The surface precision processing of various optical glass and panel glass is the basis and key technology to improve the accuracy of materials and realize their high-value applications. Currently, chemical mechanical polishing technology is generally used to precisely polish the surface of the device to obtain an ultra-precision surface. For example, chemical mechanical polishing technology is used for electronic components and ceramic-based substrate / panel mater...

Claims

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Application Information

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IPC IPC(8): C09G1/02
Inventor 许向阳戴磊龚海明
Owner CENT SOUTH UNIV