Heat conduction electromagnetic shielding composite material and preparation method thereof

A composite material, electromagnetic shielding technology, applied in the fields of magnetic field/electric field shielding, chemical instruments and methods, electrical components, etc., can solve the problems of the folding method, which is difficult to produce in large quantities and quickly, difficult to obtain thick graphite sheets, and thick graphite sheets. Achieve the effect of flexible adjustment of appearance and size, simple structure and processing technology, and improved vertical thermal conductivity.

Active Publication Date: 2019-06-14
SHENZHEN INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this invention has produced vertically oriented graphite sheets, the thickness of the graphite sheets is relatively thick (0.2-0.3mm), it is difficult to prod

Method used

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  • Heat conduction electromagnetic shielding composite material and preparation method thereof
  • Heat conduction electromagnetic shielding composite material and preparation method thereof
  • Heat conduction electromagnetic shielding composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] First, the copper foil with a thickness of 50 μm is cut into long strips ( figure 1 Left), the cut copper foil is put into a mechanical device, and after rolling, a copper foil with a vertically oriented structure is obtained ( figure 1 Right), converting the high thermal conductivity in the horizontal plane of the copper foil to the high thermal conductivity out-of-plane in the vertical direction. The mixture of premixed epoxy resin and dicyandiamide and 1-cyanoethyl-2-ethyl-4-methylimidazole (mass ratio is 100:50:20) is poured on the oriented copper foil, The liquid epoxy resin will permeate and fill the gaps of the copper foil, and it will be cured after being heated at 120°C for 2 hours to obtain a copper foil composite material filled with epoxy resin and having a vertically oriented structure inside. Its thermal conductivity is 15W / m·K, and its shielding effectiveness is 60dB from 10MHz to 1GHz.

Embodiment 2

[0044] The same as the method of embodiment 1, the difference is only that the mixture of premixed epoxy resin and ethylenediamine and ethyl acetate (mass ratio is 100:8:20) is mixed uniformly with thermally conductive filler spherical alumina (aluminum oxide content of 90wt%), die-cast it into the gap of the copper foil with the orientation structure with a flat plate, heat at 120°C for 2 hours, and then solidify and form it to obtain a copper foil composite material with a vertical orientation structure filled with epoxy resin / alumina. Since epoxy / alumina is thermally conductive but insulating, the composite can be used as an insulating thermal interface material with high thermal conductivity, and its electromagnetic shielding performance comes only from copper foil. Its thermal conductivity is 25W / m·K, and its shielding effectiveness is 60dB from 10MHz to 1GHz.

Embodiment 3

[0046] Identical to the method of embodiment 1, the difference is only that the mixture of premixed epoxy resin and diaminomethylcyclohexane and triphenyl phosphite (mass ratio is 100:18:5) and carbon nanotube After the n-hexane dispersion is blended uniformly (the content of carbon nanotubes is 12wt%), it is poured into the gap of the copper foil with an orientation structure, and it is cured after heating at 150°C for 4h to obtain an epoxy resin / carbon nanotube filled interior with a vertical Oriented copper foil composites. Its thermal conductivity is 20W / m·K, and its shielding effectiveness is 80dB from 10MHz to 1GHz.

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Abstract

The invention discloses a heat conduction electromagnetic shielding composite material. The heat conduction electromagnetic shielding composite material is characterized by comprising a polymer matrixcomposite material and a heat conduction electromagnetic shielding membrane framework with a vertical orientation structure inlaid in the polymer matrix composite material; the heat conduction electromagnetic shielding membrane framework is parallel to the extension direction of the polymer matrix composite material; the heat conduction electromagnetic shielding membrane framework is made of oneor more composite membrane of gold foil, silver foil, copper foil, nickel foil, aluminum foil, iron foil, titanium foil, zinc foil, chromium foil, cobalt foil, a stainless steel plate and metal alloy;and the thickness of the heat conduction electromagnetic shielding membrane framework is 0.01mm to 0.2mm. The heat conduction electromagnetic shielding composite material is low in cost, simple in structure, simple and convenient to manufacture, easy to produce and capable of being used as a thermal interface material and an electromagnetic shielding material of an electronic device.

Description

technical field [0001] The invention relates to the field of composite materials, in particular to a heat conduction and electromagnetic shielding composite material and a preparation method thereof. Background technique [0002] With the rapid development of electronic technology, the number of various electronic devices has increased sharply and is developing in the direction of intelligence, integration, thinness, and multi-function. On the one hand, the miniaturization and high density of electronic devices make the electronic components closer and closer, greatly shortening the length of the signal propagation path and increasing the chance of interference, which leads to more and more serious electromagnetic interference. , will not only cause harm to human physical and mental health, but also affect the normal work of other precision electronic equipment. Therefore, the importance of electromagnetic shielding has become increasingly prominent. [0003] On the other ...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C9/06C22C21/00C22C49/02C22C49/14B32B15/08B32B27/20B32B33/00H05K9/00C22C101/10
Inventor 胡友根张保坦赵涛梁先文孙蓉
Owner SHENZHEN INST OF ADVANCED TECH
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