Packaging structure and processing technology of IPM hybrid module based on graphene

Abstract

The invention relates to a packaging structure and a processing technology of an IPM hybrid module based on graphene. The packaging structure comprises a silicon-based IGBT chip, a silicon carbide-based schottky barrier diode chip, a driving unit chip, a graphene-based copper-clad ceramic substrate, a nano-silver interconnection layer, a buffer gasket, a copper interconnection block, a solder layer, a plastic package shell, a packaging resin, heat conduction silicone grease and an integrated radiator. A packaging mode with an upper substrate, a lower substrate and a flip chip, a chip electrodeis connected to a lead frame through a copper-clad ceramic substrate, and a bonding lead is replaced, so that the double-sided heat dissipation of the IPM hybrid module is realized, and the reliability of the module is improved; meanwhile, by combination of the design of the layout of the chip on the substrate, the rapid heat dissipation of the local hot spots of the substrate is enhanced by adopting the high-thermal-conductivity graphene material, so that the maximum temperature of the IPM hybrid module is reduced, and the service life of the module is prolonged.

Description

technical field [0001] The invention belongs to the technical field of semiconductors, and in particular relates to a graphene-based IPM hybrid module packaging structure and processing technology. Background technique [0002] Compared with the IGBT power module, the intelligent power module IPM (Intelligent Power Module) that integrates the IGBT power unit and the drive protection circuit board has been further reduced in size and weight, and its integration and stability have been continuously improved, adapting to the needs of power devices. In the direction of development, more and more power electronic devices choose to use power modules instead of discrete components. IPM modules have been widely used in the fields of drive motor inverters and various inverter power supplies. With the development of high efficiency, miniaturization and lightweight modules, low power consumption, high current, ultra-high speed silicon carbide (Silicon Carbide, SiC) based Schottky barri...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art, to provide a graphene-based IPM hybrid module packaging structure and processing technology, using the upper and lower double-sided heat dissipation unit structure, through the packaging form of the power unit and the drive unit chip flip chip, Solve the problem of overheating failure of traditional bonding wires, and at the same time use graphene film with high thermal conductivity as a heat dissipation material on the copper-clad ceramic substrate (Direct Bonded Copper, DBC) of the IPM hybrid module to exert its high lateral thermal conductivity. For large The heat of local hot spots in the power IPM hybrid module has a direct and effective conduction and dissipation effect, thereby improving the heat dissipation performance and working stability of the module

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