Resist substrate pretreatment composition and method for producing resist substrate

A resist and pretreatment technology, applied in the direction of detergent composition, surface active detergent composition, chemical instruments and methods, etc., can solve the problems of large wetting expansion, low viscosity, exudation, etc.
CN109964546BActive Publication Date: 2021-09-10SANYO CHEM IND LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SANYO CHEM IND LTD
Publication Date
2021-09-10

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Abstract

The present invention provides a resist substrate pretreatment composition capable of suppressing wetting spread after resist ink is applied by an inkjet method and capable of forming a fine resist pattern with high precision. The resist substrate pretreatment composition of the present invention is a resist substrate pretreatment composition containing an amphoteric surfactant (A1), an anionic surfactant (A2) and water, and is characterized in that, from the above-mentioned amphoteric surfactant The numerical value obtained by subtracting the pH value of the above-mentioned resist substrate pretreatment composition from the numerical value of the isoelectric point of the agent (A1) ([the numerical value of the isoelectric point of the amphoteric surfactant (A1)]−[the numerical value of the resist The value of the pH of the substrate pretreatment composition]) is -3 to 4, the number of moles of the above-mentioned amphoteric surfactant (A1) is relative to the number of moles of the above-mentioned amphoteric surfactant (A1) and the number of moles of the above-mentioned anionic surfactant (A2 ) ratio of the total number of moles in moles ([the number of moles of the amphoteric surfactant (A1)] / ([the number of moles of the amphoteric surfactant (A1)]+[the number of moles of the anionic surfactant (A2) ])) ranges from 0.1 to 0.9.
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Description

technical field

[0001] The present invention relates to a resist substrate pretreatment composition and a method for producing a resist substrate. Specifically, it relates to a resist substrate pretreatment composition used before patterning a copper or copper alloy surface using a solder resist, and a method for producing a resist substrate using the resist substrate pretreatment composition. Background technique

[0002] In recent years, patterning using an inkjet method has been proposed as a solder resist for protecting a conductive circuit formed on a wiring board (see Patent Document 1 and Patent Document 2). In the conventional screen printing method, in order to form a pattern, pre-drying, development of the coating film, post-curing, and removal of uncured resist are required after coating the insulating film. On the other hand, when the inkjet method is used, the insulating film ink is ejected and patterned, and then exposed to light and cured to form a pattern. T...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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