Multi-level magnetic field and lining bias voltage conical pipe and stepped pipe composite filtering arc ion plating

A technology of arc ion plating and composite filtration, applied in the field of arc ion plating, which can solve the problems of low arc plasma transmission efficiency, limited use of target elements, large particle defects, etc., to eliminate large particle defects, improve utilization efficiency, reduce The effect of loss

Pending Publication Date: 2019-07-09
魏永强
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem that the traditional arc ion plating method adopts high melting point target material, low melting point pure metal or multi-element alloy material and non-metallic material (such as graphite) as the target material, which is easy to produce large particle defects, and the curved magnetic filter technology causes arc. Low plasma transmission efficiency, limited use of target elements, uniform target ablation, film deposition density and defects, vacuum chamber space and deposition position limitations, workpiece shape limitations, and residues of different targets in multi-level magnetic field devices Contamination of film components caused by sub-sputtering, combined with multi-stage magnetic field filtering method and the combination of the shape of the lined bias conical tube and stepped tube combination device's own shape of mechanical barrier shielding and bias electric field attraction to eliminate arc plasma At the same time, ensure that the arc plasma passes through the combination device of the lined bias conical tube and the stepped tube and the multi-stage magnetic field filter device with a high transmission efficiency, and then use the bias power to completely remove the defects from the multi-stage magnetic field device. And the large particle defects that may remain in the arc plasma transmitted from the combination device of the lined bias conical tube and the stepped tube make the surface of the workpiece adjust the ion energy under the condition of applying a negative bias to prepare continuous and dense high-quality At the same time, it realizes the control of the content of target elements in the film, reduces the production cost of using alloy targets, improves the transmission efficiency of arc plasma, increases the deposition speed of the film, and reduces or even eliminates the impact of large particle defects on the film microstructure and continuous dense deposition. and the adverse effects on performance, a multi-level magnetic field and lined bias conical tube and stepped tube composite filter arc ion plating is proposed

Method used

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  • Multi-level magnetic field and lining bias voltage conical pipe and stepped pipe composite filtering arc ion plating
  • Multi-level magnetic field and lining bias voltage conical pipe and stepped pipe composite filtering arc ion plating
  • Multi-level magnetic field and lining bias voltage conical pipe and stepped pipe composite filtering arc ion plating

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specific Embodiment approach 1

[0019] Specific implementation mode 1: the following combination figure 1 with 2 To explain this embodiment, the device used for arc ion plating with multi-stage magnetic field and lining bias conical tube and stepped tube composite filtration includes bias power supply (1), arc power supply (2), and arc ion plating target source (3) Multi-stage magnetic field device (4), multi-stage magnetic field power supply (5), lining bias conical tube and stepped tube assembly (6), lining bias power supply (7), sample stage (8) , Bias power supply waveform oscilloscope (9) and vacuum chamber (10);

[0020] In this device:

[0021] The substrate workpiece to be processed is placed on the sample table (8) in the vacuum chamber (10). The multi-stage magnetic field device (4), the lining biased conical tube and stepped tube combination device (6) and the vacuum chamber (10) The workpiece is insulated from each other, the workpiece is placed on the sample stage (8), the sample stage (8) is conne...

specific Embodiment approach 2

[0034] Second embodiment: The difference between this embodiment and the first embodiment is that the device can also achieve other functions: it can combine traditional DC magnetron sputtering, pulsed magnetron sputtering, traditional arc ion plating and pulsed cathode arc. One or a combination of two or more methods, and then apply DC bias, pulse bias, DC pulse composite bias or bipolar pulse bias device to the workpiece for film deposition to prepare pure metal films and compounds with different element ratios Ceramic films, functional films and high-quality films with nano-multilayer or gradient structure.

specific Embodiment approach 3

[0035] Specific embodiment 3: The difference between this embodiment and the second embodiment is that the multi-stage magnetic field and the lining of the biased tapered tube and the stepped tube are combined to filter the arc ion plating connection, the arc power supply (2) is turned on, and the multi-stage The magnetic field power supply (5) adjusts the multi-stage magnetic field device (4), turns on the lining bias power supply (7), the lining bias tapered tube and stepped tube assembly (6) maintains the DC positive bias, and turns on the bias power supply ( 1) Adjust the process parameters, perform thin film deposition, and prepare multilayer structure thin films with different stress states, microstructures and element ratios. Others are the same as the second embodiment.

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Abstract

The invention discloses multi-level magnetic field and lining bias voltage conical pipe and stepped pipe composite filtering arc ion plating, belongs to the technical field of material surface treatment, and aims at solving the problems about film pollution through large particles in a multi-level magnetic field filter device and losses in the plasma transmission process. The device comprises a bias voltage power source, an arc ion plating target source and power source, a multi-level magnetic field device and power source, a lining bias voltage conical pipe and stepped pipe combination device, bias voltage power source and power source, a bias voltage power source waveform oscilloscope and the like. Film deposition is conducted, device connection is conducted, the system is started, and when the vacuum degree in a vacuum chamber is smaller than 10<-4>Pa, inflation of work gas is conducted, a coating power source is started, and the bias voltage power source is utilized for adjusting arc plasma energy; and the lining bias voltage conical pipe and stepped pipe combination device and the multi-level magnetic field device are used for eliminating large particle defects in arc plasmasand improving the transmission efficiency of the filter device, losses in the vacuum chamber are reduced, and technology parameters are set for film preparing.

Description

Technical field [0001] The invention relates to a multi-stage magnetic field and a composite filtering arc ion plating of a biased tapered tube and a stepped tube lining, and belongs to the technical field of material surface treatment. Background technique [0002] In the process of preparing thin film by arc ion plating, the current density of arc spot is as high as 2.5~5×10 10 A / m 2 , Causing molten liquid metal to appear at the arc spot on the surface of the target, which is sprayed out in the form of droplets under the action of the partial plasma pressure, attached to the surface of the film or embedded in the film to form "Macroparticles" (Macroparticles) Defects (BoxmanR L, Goldsmith S. Macroparticle contamination in cathodic arc coatings: generation, transport and control [J]. Surf Coat Tech, 1992, 52(1): 39-50.). In arc plasma, since the moving speed of electrons is much greater than that of ions, the number of electrons reaching the surface of large particles per unit ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/32C23C14/35C23C14/54
CPCC23C14/325C23C14/564C23C14/35C23C14/3485
Inventor 魏永强宗晓亚王好平侯军兴蒋志强
Owner 魏永强
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