Multi-level magnetic field and lining bias voltage conical pipe and stepped pipe composite filtering arc ion plating
A technology of arc ion plating and composite filtration, applied in the field of arc ion plating, which can solve the problems of low arc plasma transmission efficiency, limited use of target elements, large particle defects, etc., to eliminate large particle defects, improve utilization efficiency, reduce The effect of loss
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specific Embodiment approach 1
[0019] Specific implementation mode 1: the following combination figure 1 with 2 To explain this embodiment, the device used for arc ion plating with multi-stage magnetic field and lining bias conical tube and stepped tube composite filtration includes bias power supply (1), arc power supply (2), and arc ion plating target source (3) Multi-stage magnetic field device (4), multi-stage magnetic field power supply (5), lining bias conical tube and stepped tube assembly (6), lining bias power supply (7), sample stage (8) , Bias power supply waveform oscilloscope (9) and vacuum chamber (10);
[0020] In this device:
[0021] The substrate workpiece to be processed is placed on the sample table (8) in the vacuum chamber (10). The multi-stage magnetic field device (4), the lining biased conical tube and stepped tube combination device (6) and the vacuum chamber (10) The workpiece is insulated from each other, the workpiece is placed on the sample stage (8), the sample stage (8) is conne...
specific Embodiment approach 2
[0034] Second embodiment: The difference between this embodiment and the first embodiment is that the device can also achieve other functions: it can combine traditional DC magnetron sputtering, pulsed magnetron sputtering, traditional arc ion plating and pulsed cathode arc. One or a combination of two or more methods, and then apply DC bias, pulse bias, DC pulse composite bias or bipolar pulse bias device to the workpiece for film deposition to prepare pure metal films and compounds with different element ratios Ceramic films, functional films and high-quality films with nano-multilayer or gradient structure.
specific Embodiment approach 3
[0035] Specific embodiment 3: The difference between this embodiment and the second embodiment is that the multi-stage magnetic field and the lining of the biased tapered tube and the stepped tube are combined to filter the arc ion plating connection, the arc power supply (2) is turned on, and the multi-stage The magnetic field power supply (5) adjusts the multi-stage magnetic field device (4), turns on the lining bias power supply (7), the lining bias tapered tube and stepped tube assembly (6) maintains the DC positive bias, and turns on the bias power supply ( 1) Adjust the process parameters, perform thin film deposition, and prepare multilayer structure thin films with different stress states, microstructures and element ratios. Others are the same as the second embodiment.
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