Process for electroplating diamond wire adopting bare powder coating

A diamond wire and process technology, which is applied in the field of bare powder sanding electroplating diamond wire process, can solve the problems of weakening cutting force and increasing the outer diameter of steel wire, and achieve the effects of reduced material loss, stable wire diameter, and reduced pollution

Active Publication Date: 2019-08-02
盛利维尔(常州)金属材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since diamond is not conductive, it is necessary to pre-plate a layer of metallic nickel on the surface of the diamond to make it conductive, that is, diamond 4 with a nickel layer, such as Figure 1.1 , Figure 1.2 As shown, in this way, sand can be electroplated on the core wire steel wire 1 with a layer of pre-plated nickel coating 2, and then a layer of metal nickel layer 3 is deposited on the sand to make it consolidate on the steel wire, so that the surface of the finished electroplated diamond wire There is a certain thickness of nickel metal layer on the top of the diamond, which increases the outer diameter of the steel wire, and during the cutting process, it will be worn into powder and stick to the surface of the diamond wire, weakening its cutting force

Method used

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  • Process for electroplating diamond wire adopting bare powder coating
  • Process for electroplating diamond wire adopting bare powder coating
  • Process for electroplating diamond wire adopting bare powder coating

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] figure 2 SEM image of the surface of the coated sand electroplated diamond wire;

[0044] image 3 Process flow chart of bare sand electroplating diamond wire;

[0045] Figure 4.1 Schematic diagram of the side structure of diamond wire electroplated for bare sand;

[0046] Figure 4.2 Schematic diagram of the cross-section of electroplating diamond wire for bare sand;

[0047] Figure 5 SEM image of the surface of bare sand electroplated diamond wire.

[0048] With the method of the present invention, use 65um steel wire to cooperate the diamond of D50=8.5um to produce electroplated diamond wire, the production process is as follows:

[0049] (1) Surface treatment of diamond 5: select diamond powder with D50=8.5,

[0050] a) Use NaOH solution with a concentration of 40±5g / L and a temperature of 50°C to clean the diamond powder for 10 minutes, and then wash it with water;

[0051] b) Use a sulfamic acid solution with a concentration of 40±5g / L to clean the ...

Embodiment 2

[0061] Example 2: The difference from Example 1 is that the core wire is a steel wire with a diameter of 55um, and the particle size of the diamond powder used is D50=8.0μm. Other steps are the same as in Example 1, and the finished product electroplated diamond wire has a specification of 68±3 μm.

Embodiment 3

[0062] Embodiment 3: The difference from Embodiment 1 is that the core wire is a steel wire with a diameter of 170 μm, and the particle size of the diamond powder used is D50=35 μm. The other steps are the same as in Example 1, and the specification of the obtained finished electroplated diamond wire is 250±10 μm.

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Abstract

The invention relates to the technical field of electroplating diamond wires, in particular to a process for embedding electroplating diamond wire with bare powder. The method comprises the followingsteps that cleaning and chemically treating bare diamond, enabling the surface of the bare diamond to be provided with high-density positive charges, depositing the treated bare diamond on the surfaceof a steel wire in an embedding groove, and performing electrochemical consolidation diamond to prepare the finished product electroplating diamond wire. Compared with a common diamond wire, the diamond used by the diamond wire is free of pre-plating nickel (which can generate a large amount of nickel and phosphorus wastewater to pollute the environment), so that the pollution of the nickel and phosphorus is reduced; and the diamond wire uses the bare diamond, a process of chemical nickel plating is omitted, the diamond cost is reduced by 40%, the diamond on the surface of the bare sand electroplating diamond wire is not coated with a nickel layer, and the cutting capability is stronger; impurities such as nickel or silicon powder are not easy to stick in the cutting process, the cuttingforce in the later stage is not affected, the corrosion problem of the nickel layer does not exist in a plating solution of the diamond used by the bare sand electroplating diamond wire, the sand doesnot need to be subjected to stripping and other treatment, and the labor cost and the machining cost are reduced.

Description

technical field [0001] The invention relates to the technical field of electroplating diamond wire, in particular to a process for electroplating diamond wire with sand on bare powder. Background technique [0002] At present, the electroplated diamond wire is a kind of wire-shaped cutting tool made of electroplated metal nickel as a binder, and the diamond abrasive is consolidated on the high-carbon steel wire through electrodeposition, referred to as "wire saw". Electroplated diamond wire has high cutting efficiency, good stability, and excellent cutting surface quality. It is widely used in the cutting of crystal, sapphire and other non-metallic hard and brittle materials, magnetic materials, especially silicon materials. [0003] Since diamond is not conductive, it is necessary to pre-plate a layer of metallic nickel on the surface of the diamond to make it conductive, that is, diamond 4 with a nickel layer, such as Figure 1.1 , Figure 1.2 As shown, in this way, sand ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00C25D15/00
CPCB24D18/0018C25D15/00
Inventor 李坤堂盛荣生但胜钊曹永华
Owner 盛利维尔(常州)金属材料有限公司
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