Molybdenum-niobium alloy rotating target material and preparation method thereof

Abstract

The invention discloses a molybdenum-niobium alloy rotating target and a preparation method thereof. Molybdenum powder and niobium powder are contained into a mold, under the cold isostatic pressure effect, a large-size hollow molybdenum-niobium pipe pressed blank is formed, then containing into a package sheathing for vacuum welding sealing is performed, a pipe blank is formed due to hot isostatic pressure sintering, and after later-period machining, finally a molybdenum-niobium rotating target material is made. According to the preparation method, introduction of impurity elements can be reduced, and the produced target material is uniform is component, free of segregation and tiny in grain. By detecting the obtained molybdenum-niobium alloy rotating target, the density of the rotating target is larger than 9.97g / cm<3>, the grain size is smaller than 50 microns, C-SCAN displays that a structure is uniform, no internal defects are found, and the requirement of a high-end sputtering target material is met.

Description

technical field [0001] The invention relates to the technical field of metal target production, in particular to a molybdenum-niobium alloy rotating target and a preparation method thereof. Background technique [0002] At present, flat panel display (FPD), including liquid crystal display TFT-LCD, plasma display PDP and touch screen TP, etc. have become the mainstream of displays. As the key material of FPD, molybdenum-niobium alloy has been widely used in LCD source matrix liquid crystal display, plasma display bipolar PDP, TFT flexible display, touch screen, OLED and other fields. In recent years, the tubular molybdenum alloy sputtering target with higher utilization rate has been extensively researched and applied by foreign large-scale target manufacturers, and its utilization rate can reach 70% in theory, which is much higher than the 20%-30% use of planar targets. Rate. [0003] Tubular molybdenum-niobium alloy sputtering target (Mo:Nb=90:10at%) is difficult to be p...

AI Technical Summary

Problems solved by technology

[0004] 1. Sintering method: This method has high requirements on the particle size of raw materials, and can quickly realize densified molding and sintering, but the sintering density is low, about 95%, and it is difficult to meet the density requirement of more than 99%.

At the same time, if the sintering deformation of the long tube target is large, it is difficult to correct it later, and it is impossible to produce large-size tube targets

[0005] 2. Hot pressing method: the raw material molybdenum powder and niobium powder are mixed in proportion and pressed into a green body, the green body is crushed and ground to make a secondary powder (large particle powder), and then the secondary powder is put into a sealed mold for pressing Sintering to make a molybdenum-niobium tube target. This method is very easy to introduce new impurity element pollution in the secondary pulverization process, and it is difficult to deoxidize during the sealed pressure sintering process, which will lead to excessive impurities and oxygen content in the product, which cannot meet the existing high-purity molybdenum. Niobium target requirements

[0006] 3. Plasma spraying method: the sputtering layer is prepared by plasma spraying on the surface of stainless steel or other materials, but the prepared sputtering layer has high impurity content, poor compactness, and high cost, which is not suitable for large-scale molybdenum Production of niobium rotating targets

At present, the density of molybdenum-niobium alloy targets produced by most domestic manufacturers is 9.4-9.7g / cm 3 Between, it is difficult to achieve high-end customer density ≥ 9.9g / cm 3 Requirements, especially for products with pipe length requirements within 1000-3000mm, there are holes in the organization, coarse and uneven grains, and the quality is difficult to meet the sputtering target requirements of high-end liquid crystal display and electronics industries.

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