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A kind of latent curing agent capable of toughening imidazole epoxy resin and preparation method thereof

A technology of latent curing agent and epoxy resin, applied in the direction of organic chemistry, can solve the problems of many factors affecting the formation of microcapsules, the compatibility of epoxy resin is not as good as that of liquid curing agent, and the impact on physical and mechanical properties

Active Publication Date: 2021-11-30
NANJING TECH UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, there are many factors affecting the formation of microcapsules during the preparation process, and the reaction is not easy to control; and after curing, the wall material remains inside the product, which may affect the physical and mechanical properties of the product.
In addition, the curing agent encapsulated by microcapsules is generally solid, and its compatibility with epoxy resin is not as good as that of liquid curing agent.

Method used

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  • A kind of latent curing agent capable of toughening imidazole epoxy resin and preparation method thereof
  • A kind of latent curing agent capable of toughening imidazole epoxy resin and preparation method thereof
  • A kind of latent curing agent capable of toughening imidazole epoxy resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Add maleic anhydride and polyethylene glycol monomethyl ether (n=4) with a molecular weight of 200 in a molar ratio of 1:2.1 into the flask, then add a catalyst p-toluenesulfonic acid with a mass fraction of 3%, and react at 50°C for 5 hours. Reaction under vacuum at 100°C for 5h. After the reaction, the product was dissolved in dichloromethane, washed three times with saturated sodium carbonate solution and saturated sodium chloride solution, and the dichloromethane was removed to obtain maleic acid polyethylene glycol monomethyl ether diester. Dissolve maleic acid polyethylene glycol monomethyl ether diester with a molecular weight of 480 and 2-phenylimidazole at a molar ratio of 1:1 in acetonitrile, and add a catalyst 1,8-diazepine with a mass fraction of 5%. Dicycloundec-7-ene, react at 40°C for 20h, remove acetonitrile by distillation under reduced pressure at the end of the reaction, dissolve the product in ethanol, and use petroleum ether to settle and purify to ...

Embodiment 2

[0033] Add maleic anhydride and polyethylene glycol monomethyl ether (n=12) with a molecular weight of 550 in a molar ratio of 1:2.1 into the flask, then add a catalyst with a mass fraction of 3% p-toluenesulfonic acid, and react at 60°C for 4 hours. Reacted under vacuum at 110°C for 4h. After the reaction, the product was dissolved in dichloromethane, washed four times with saturated sodium carbonate solution and saturated sodium chloride solution, and the dichloromethane was removed to obtain maleic acid polyethylene glycol monomethyl ether diester. Dissolve maleic acid polyethylene glycol monomethyl ether diester with a molecular weight of 2080 and 2-phenylimidazole at a molar ratio of 1:1 in acetonitrile, and add a catalyst 1,8-diazepine with a mass fraction of 7%. Dicycloundec-7-ene, react at 45°C for 24h, remove acetonitrile by distillation under reduced pressure after the reaction, dissolve the product in ethanol, and use petroleum ether for sedimentation and purificati...

Embodiment 3

[0037] Add maleic anhydride and polyethylene glycol monomethyl ether (n=22) with a molecular weight of 1000 into the flask at a molar ratio of 1:2.1, then add a catalyst p-toluenesulfonic acid with a mass fraction of 5%, and react at 70°C for 3 hours. Reaction under vacuum at 120°C for 5h. After the reaction, the product was dissolved in dichloromethane, washed three times with saturated sodium carbonate solution and saturated sodium chloride solution, and the dichloromethane was removed to obtain maleic acid polyethylene glycol monomethyl ether diester. Dissolve the molecular weight of 1000 and 2-phenylimidazole in acetonitrile in a molar ratio of 1:1, add the catalyst 1,8-diazabicycloundec-7-ene with a mass fraction of 10%, and react at 50°C for 48h After the reaction, the acetonitrile was distilled off under reduced pressure, the product was dissolved in ethanol, and petroleum ether was used for sedimentation and purification to obtain the modified imidazole epoxy resin lat...

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Abstract

The invention discloses a latent curing agent capable of toughening imidazole epoxy resins. The curing agent has a long application period, good latent stability at low temperature, long storage period at room temperature, fast curing rate at high temperature and can cure epoxy resin. The material achieves the toughening effect. The latent curing agent for toughening imidazole epoxy resin of the present invention has the following structural formula I: wherein the value of n is 4-22.

Description

technical field [0001] The invention relates to a curing agent and a preparation method thereof, in particular to a latent curing agent capable of toughening imidazole epoxy resins and a preparation method thereof. Background technique [0002] With the development of microelectronic packaging technology, epoxy molding compound as the main packaging material has also been developed rapidly. Epoxy molding compound is a one-component thermosetting material containing a latent curing agent. Generally, it needs to be stored and transported at a low temperature of about 5 degrees Celsius after mixing and preparation, and before packaging and use. This cold chain link not only consumes a lot of energy but also Also affects the use efficiency of epoxy resin. The optimization research of epoxy resin curing agent has always been a hot research field. Among them, the use of imidazole curing agent is more common because of its fast curing rate, better heat insulation performance, high...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/50C08G65/332C08G65/333C07D233/64
CPCC07D233/64C08G59/5073C08G65/332C08G65/333
Inventor 沈育才石坤祥王庭慰高聪
Owner NANJING TECH UNIV
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