Preparation method of silicon-doped HfO2-based ferroelectric film
A ferroelectric thin film, silicon doping technology, applied in chemical instruments and methods, ion implantation plating, crystal growth, etc., can solve the problems of difficult preparation and limitation of thin film ferroelectricity, and achieve controllable layered structure and improved Film growth rate, effect of improving film purity
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Embodiment 1
[0056] A silicon-doped HfO 2 The preparation method of the base ferroelectric thin film, the crystal plane orientation is (100), yttrium-stabilized zirconia (YSZ) is selected as the substrate, and the self-made Si-doped HfO 2 As the target, Si-doped HfO was grown on the substrate surface by pulsed laser molecular beam epitaxy. 2 base film; then in-situ annealing was performed on the grown film under an oxygen atmosphere to obtain a stable Si-doped HfO 2 -base film, specifically comprises the following steps:
[0057] S1. The YSZ substrate is cleaned, polished and annealed, specifically including the following steps:
[0058] S11. At a temperature of 80°C, H 2 SO 4 :H 2 o 2 =3:1 solution for 5 minutes, then rinse with HF (10%) for 10 seconds;
[0059] S12. Undiluted HNO at a temperature of 80°C 3 Keep warm for 5 minutes, then rinse with HF (10%) for 10 seconds;
[0060] S13. At a temperature of 80°C, NH 4 OH:H 2 o 2 :H 2 O=1:1.5:4 solution was incubated for 5 minut...
Embodiment 2
[0080] Compared with Example 1, Example 2 differs in that the crystal plane orientation of the yttrium-stabilized zirconia (YSZ) substrate used is (111), and the others are the same as in Example 1. The prepared Si-doped HfO 2 The thickness of the base film was 20 nm.
Embodiment 3
[0082] Compared with Example 1, Example 3 differs in that the crystal plane orientation of the yttrium-stabilized zirconia (YSZ) substrate used is (110), and the others are the same as in Example 1. The prepared Si-doped HfO 2 The thickness of the base film was 20 nm.
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