Ambient-temperature-independent silicon nitride micro-ring filter chip based on vertical slit structure

A silicon nitride microring and ambient temperature technology, applied in the direction of optical waveguide light guide, light guide, optics, etc., can solve the problems of complex structure, inability to accurately separate and multiplex specific wavelengths, poor integrity, etc., and achieve simple manufacturing process and easy integration application, effect on device performance

Active Publication Date: 2019-09-20
UNIV OF SHANGHAI FOR SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The microring structure itself is very sensitive to the ambient temperature. The change of the ambient temperature will cause the change of the resonant wavelength, which will not only increase the crosstalk and loss between channels, but the excessive temperature drift may also lead to the inability to accurately separate and multiplex specific wavelengths.
At present, the commonly used methods to overcome temperature wavelength drift are mostly external mechanical devices to move the waveguide or additional metal temperature compensation. These methods are poor in integrity, complex in structure, and difficult to integrate on a large scale.

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  • Ambient-temperature-independent silicon nitride micro-ring filter chip based on vertical slit structure
  • Ambient-temperature-independent silicon nitride micro-ring filter chip based on vertical slit structure
  • Ambient-temperature-independent silicon nitride micro-ring filter chip based on vertical slit structure

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Embodiment Construction

[0019] Below in conjunction with accompanying drawing, further elaborate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

[0020] For the temperature-independent design, the polymer material polydimethylsiloxane is used as the outer cladding, and its negative thermo-optic coefficient is used [Prior Art 3: He L, Xiao Y F, Zhu J, et al. Optics express, 2009,17(12):9571-9581.], to counteract the influence of ambient temperature on the microring. At present, the commonly used methods to overcome temperature and wavelength drift are: 1. Using packaging...

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Abstract

The invention provides an ambient-temperature-independent silicon nitride micro-ring filter chip based on a vertical slit structure. The chip comprises a buffer layer plated on a silicon substrate and a core layer. The core layer is a vertical slit type micro-ring resonant cavity formed by clamping a silicon dioxide micro ring between two silicon nitride micro rings; and each of a silicon nitride micro-ring waveguide and a silicon dioxide micro-ring waveguide includes a disc waveguide and a straight waveguide. The core layer is coated by a negative-thermo-optical-coefficient outer cladding layer coated on the buffer layer. The ambient-temperature-independent silicon nitride micro-ring filter chip is characterized by the vertical slit structure; and the temperature-independent characteristic of filtering can be realized by combining the negative-thermo-optical-coefficient outer cladding layer.

Description

technical field [0001] The invention relates to a silicon nitride microring filter. Background technique [0002] In recent years, the rapid development of society has entered the era of informationization, so higher requirements are put forward for the data transmission volume and transmission speed. With the development of technology, the expansion of ultra-high-definition video formats, the increase of mobile data traffic, and the emergence of cloud-intensive data services [Prior Art 1: Kwack M J, Tanemura T, Higo A, et al. Opt. Express. 20 (27 ), 28734-41(2012)], which greatly promoted the development of society. However, the current processing capability of electronic chips has reached a technical bottleneck. As we all know, the "Moore's Law" guiding the development of microelectronics has basically failed, and the development of integrated circuit chips has become saturated. On the other hand, due to the development of big data, cloud computing, and the Internet of T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/12
CPCG02B6/12007
Inventor 冯吉军刘晓腾张福领曾和平
Owner UNIV OF SHANGHAI FOR SCI & TECH
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