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Method for preparing polyimide film

A technology of polyimide film and polyamic acid, which is applied in the field of preparing polyimide film, can solve the problems of inability to obtain polyimide film conveniently, different thermal expansion coefficients, deformation and curling, etc., and achieve outstanding mechanical properties and High-temperature use performance, excellent performance, and the effect of improving quality and service life

Active Publication Date: 2019-09-24
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to overcome the problem that the polyimide film with the target thermal expansion coefficient cannot be easily obtained in the prior art, so that the deformation and curling caused by the different thermal expansion coefficients of the polyimide film and the attached substrate are provided. A kind of method for preparing polyimide film

Method used

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  • Method for preparing polyimide film
  • Method for preparing polyimide film
  • Method for preparing polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] (1) According to the CTE of the matched Ni metal substrate (shown in Table 4), take 0.1mol of 4,4'-diaminobenzanilide and 0.06mol of pyromellitic dianhydride and 0.04mol of 3 , 3',4,4'-diphenyl ether dianhydride, reacted in a DMAc solvent at 0°C, the solid content of the obtained polyamic acid solution was 12wt%, and the intrinsic viscosity was 1.8dl / g;

[0081] (2) Cast the solution prepared in step (1) into a film under the condition of 25° C., the carrier is a glass plate, and dry it in a drying oven at 60° C. for 6 hours;

[0082] (3) Put the film and carrier obtained in step (2) into the electric heating blower, heat up at 3°C / min, and keep warm at 135°C, 300°C, and 350°C for 2 hours each, and cool naturally after the program ends;

[0083] (4) Put the film and carrier through step (3) into boiling water for 10 minutes to remove the film;

[0084] (5) Put the film after step (4) into a drying oven, keep at 200° C. for 10 min to remove moisture to prepare the polyi...

Embodiment 2

[0086] (1) According to the CTE of the matched Cu metal substrate (shown in Table 4), take 0.06mol of 4,4'-diaminobenzanilide, 0.04mol of p-phenylenediamine and 0.06mol of pyromellitic Formic acid dianhydride and 0.04mol of 3,3',4,4'-diphenyl ether dianhydride react in DMAc solvent at 0°C, the solid content of the obtained polyamic acid solution is 15wt%, and the intrinsic viscosity is 2.1 dl / g;

[0087] (2) Cast the solution prepared in step (1) into a film under the condition of 25° C., the carrier is a glass plate, and dry it in a drying oven at 60° C. for 6 hours;

[0088] (3) Put the film and carrier obtained in step (3) into the electric heating blower, heat up at 3°C / min, and keep warm at 135°C, 300°C, and 350°C for 2 hours each, and cool naturally after the program ends;

[0089] (4) Put the film and carrier through step (3) into boiling water for 10 minutes to remove the film;

[0090] (5) Put the film after step (4) into a drying oven, keep it at 200° C. for 10 min...

Embodiment 3

[0092] (1) According to the CTE of the matched Al metal substrate (shown in Table 4), take 0.03mol of 4,4'-diaminobenzanilide and 0.07mol of 4,4'-diaminodiphenyl ether and 0.1mol of pyromellitic dianhydride was reacted in a DMAc solvent at 0°C, and the obtained polyamic acid solution had a solid content of 15wt% and an intrinsic viscosity of 2.0dl / g;

[0093] (2) Cast the solution prepared in step (1) into a film under the condition of 25° C., the carrier is a glass plate, and dry it in a drying oven at 60° C. for 6 hours;

[0094] (3) Put the film and carrier obtained in step (2) into the electric heating blower, heat up at 3°C / min, and keep warm at 135°C, 300°C, and 350°C for 2 hours each, and cool naturally after the program ends;

[0095] (4) Put the film and carrier through step (3) into boiling water for 10 minutes to remove the film;

[0096] (5) Put the film after step (4) into a drying oven, keep it at 200° C. for 10 min to remove moisture to prepare the polyimide fi...

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Abstract

The invention relates to the field of high-molecular materials, and concretely relates to a method for preparing a polyimide film. The method comprises the following steps: (1) selecting at least one diamine monomer and at least one dianhydride monomer, and adjusting the molar ratio of the diamine monomer to the dianhydride monomer according to a calculating formula in order to obtain the moles of the diamine monomer and the dianhydride monomer when a target thermal expansion coefficient is achieved; and (2) reacting the selected diamine and dianhydride monomers in a solvent according to the above moles to obtain a polyamic acid solution, and performing film formation and imidization on the polyamic acid solution to obtain the polyimide film. The method of the invention adopts a structure containing a hydrogen bond, the dianhydride and diamine monomers are selected, and the ratio of the two monomers is adjusted to effectively adjust the thermal expansion coefficient of the polyimide film, so the obtained polyimide film has excellent mechanical performances and high-temperature application performances, and has the thermal expansion coefficient matching with an adhered substrate to avoid the deformation and curling of the polyimide film due to the difference in thermal expansion coefficients.

Description

technical field [0001] The invention relates to the field of polymer materials, in particular to a method for preparing a polyimide film. Background technique [0002] As an engineering plastic with excellent heat resistance that has been industrially produced, polyimide material also has excellent thermal stability, mechanical properties, low temperature resistance, outstanding insulation performance, and solvent resistance. It has a wide range of applications in many fields such as electronic microelectronics and mechanical chemistry. And when polyimide is applied in electronic devices such as electronic packaging substrates and copper clad laminates, its dimensional stability and coefficient of thermal expansion (CTE) have a very important impact on the actual use effect. [0003] The thermal expansion coefficient of polyimide film is usually between 25-50ppm / °C, and it expands and deforms greatly when used at a higher temperature. As an electronic material, after lamina...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08G73/10C08L79/08
CPCC08G73/1007C08G73/1067C08G73/1071C08J5/18C08J2379/08
Inventor 田国峰王健华武德珍齐胜利
Owner BEIJING UNIV OF CHEM TECH
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