Epoxy resin prepreg and preparation method thereof

Abstract

The invention discloses an epoxy resin prepreg. The prepreg comprises, by weight, 10-20 parts of bromine-containing epoxy, 10-20 parts of high-TG epoxy, 3-8 parts of tetrafunctional epoxy, 1-15 parts of a bromine-containing flame retardant, 10-25 parts of an anhydride curing agent, 0-6 parts of an amine curing agent, 10-25 parts of long-chain flexible resin, 0.02-0.3 part of a catalyst, 20-50 parts of a solvent and 0-60 parts of a filler. The epoxy resin prepreg has extremely low fluidity, high adhesion, infiltration filling properties, high Tg content and high heat resistance, and solves the problems caused by white spots, white lines and white marks, such as layered plate blasting, copper wire fall-off, copper wire displacement short-circuit after deformation, and the qualification rate and reliability of the product are improved.

Description

technical field [0001] The invention relates to printed circuit board technology, in particular to an epoxy resin prepreg and a preparation method thereof. Background technique [0002] With the development of science and technology and the improvement of people's living needs, electronic products are proposed to be "thin, light, short, small", multi-functional, and personalized. It requires more and thinner layers of PCB and more diverse structures. For example: wearable electronics, foldable electronics, rigid-flex boards, rigid-winding boards, PCB internal embedded parts, thick copper hole filling, etc. The traditional prepregs produced today cannot guarantee the dimensional stability of the product because of their high fluidity. properties, as well as filling and cohesive properties, the resin system can not meet the heat resistance required for multiple pressing. Rigid-flex boards, rigid-wound boards, and multi-layer PCB boards, after lamination with traditional prepr...

AI Technical Summary

Problems solved by technology

Rigid-flex boards, rigid-wound boards, and multi-layer PCB boards, after lamination with traditional prepregs, white spots on the base material, white silk, and dried flowers often appear in the quality problems of filling voids, and the machinability is also poor, which is prone to delamination. Explosion, copper wire falling off, copper wire shifting and short circuit after deformation, etc.

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