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UV debonding pressure-sensitive adhesive and preparation method thereof

A pressure-sensitive adhesive and debonding technology, which is applied in the direction of adhesives, non-polymer organic compound adhesives, etc., can solve the problems of residue and insufficient peeling force of UV debonding pressure-sensitive adhesives, so as to reduce the residue problem and reduce the peeling force , Improve the effect of peeling force

Active Publication Date: 2019-09-27
四川羽玺新材料股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a UV debonding pressure-sensitive adhesive and its preparation method to solve the problem that the peeling force of the existing UV debonding pressure-sensitive adhesive is not high enough before light and the problem of residues before and after UV debonding

Method used

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  • UV debonding pressure-sensitive adhesive and preparation method thereof
  • UV debonding pressure-sensitive adhesive and preparation method thereof
  • UV debonding pressure-sensitive adhesive and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] The raw materials of the UV debonding pressure-sensitive adhesive of this embodiment mainly include: in parts by weight, 100 parts of acrylic resin solution containing carboxylic acid side chains, 40 parts of halogen-containing multifunctional acrylate and 10 parts of anhydrous potassium carbonate.

[0031] The raw material components of the acrylic resin solution containing carboxylic acid side chains include: 4wt% acrylic acid, 35wt% isooctyl acrylate, 11wt% butyl acrylate and 50wt% ethyl acetate.

[0032] The raw material components of halogen-containing multifunctional acrylate include: pentaerythritol triacrylate and dihalogenated compound, and the molar ratio thereof is 1.5:1. The dihalogenated compound is 1,3 dibromopropane.

[0033] The preparation method of the above-mentioned UV debonding pressure-sensitive adhesive comprises the following steps:

[0034] (1) Dissolve acrylic acid, isooctyl acrylate and butyl acrylate in ethyl acetate together with a free rad...

Embodiment 2

[0047] The raw materials of the UV debonding pressure-sensitive adhesive of this embodiment mainly include: in parts by weight, 100 parts of acrylic resin solution containing carboxylic acid side chains, 20 parts of halogen-containing multifunctional acrylate and 15 parts of anhydrous potassium carbonate.

[0048] The raw material components of the acrylic resin solution containing carboxylic acid side chains include: 6wt% acrylic acid, 25wt% isooctyl acrylate, 24wt% butyl acrylate and 45wt% ethyl acetate.

[0049] The raw material components of halogen-containing multifunctional acrylate include: pentaerythritol triacrylate and dihalogenated compound, the molar ratio of which is 1.1:1. The dihalogenated compound is 1,2-dibromoethane.

[0050] The preparation method of the above-mentioned UV debonding pressure-sensitive adhesive comprises the following steps:

[0051] (1) Dissolve acrylic acid, isooctyl acrylate and butyl acrylate in ethyl acetate together with a free radical...

Embodiment 3

[0059] The raw materials of the UV debonding pressure-sensitive adhesive of this embodiment mainly include: by weight, 100 parts of acrylic resin solution containing carboxylic acid side chains, 25 parts of halogen-containing polyfunctional acrylate and 12 parts of anhydrous potassium carbonate.

[0060] The raw material components of the acrylic resin solution containing carboxylic acid side chains include: 5wt% acrylic acid, 30wt% isooctyl acrylate, 10wt% butyl acrylate and 55wt% ethyl acetate.

[0061] The raw material components of the halogen-containing multifunctional acrylate include: pentaerythritol triacrylate and a dihalogenated compound, and the molar ratio thereof is 1.2:1. The dihalogenated compound is 1,4 dibromobutane.

[0062] The preparation method of the above-mentioned UV debonding pressure-sensitive adhesive comprises the following steps:

[0063] (1) Dissolve acrylic acid, isooctyl acrylate and butyl acrylate in ethyl acetate together with a free radical ...

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Abstract

The invention discloses a UV debonding pressure-sensitive adhesive and a preparation method thereof, and belongs to the technical field of functional coatings. Photoactive sites are internally arranged on a macromolecular chain, polyfunctional acrylate photoactive monomers are hung and tied on the side chain of main macromolecules, the built-in sites react when being irradiated by UV, and the effect of rapidly reducing stripping force is realized. Compared with addition of photoactive monomers, the UV debonding adhesive provided by the invention reduces addition of substances with low molecular weight, can improve the stripping force effectively, and solves the residue problem after UV irradiation.

Description

technical field [0001] The invention relates to the technical field of functional coatings, in particular to a UV debonding pressure-sensitive adhesive and its preparation. Background technique [0002] Objects need to be firmly fixed during processing, and after processing, it is hoped that the objects will fall off easily through UV irradiation, so as to facilitate collection. For example, during the grinding and dicing process of the wafer, it is necessary to use UV pressure-sensitive adhesive to fix the wafer to be processed on the film, which requires a high peeling force on the wafer and the ability to pass an appropriate amount of UV light after processing. After irradiation, the peeling force drops rapidly, making the wafer fall off easily and easy to pick up. [0003] In the prior art, in order to achieve the purpose of UV debonding, photoactive monomers that can undergo free radical polymerization under UV light irradiation are generally added to the UV debonding ...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J4/06
CPCC09J4/06
Inventor 巫柯陈善勇陈仁秀郑婷代申强许显成
Owner 四川羽玺新材料股份有限公司
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