A high-performance interface preparation method based on carbon-carbon bonds
A high-performance, carbon-carbon bond technology, applied in semiconductor/solid-state device manufacturing, electrical components, nanotechnology, etc., can solve problems such as device reliability and poor heat dissipation, to avoid work failure, enhance mechanical strength, and enhance contact strength Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0032] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0033] In order to achieve the above object, the present invention provides a method for preparing a high-performance interface based on carbon-carbon bonds, comprising the following steps:
[0034] S1. Pretreat the original substrate, deposit the buffer layer and catalytic layer required for CNT growth on the original substrate, and grow CNT at high temperature;
[0035] Specifically, the catalytic layer can be copper, nickel, cobalt, ruthenium, iridium, palladium, gold-nickel alloy, nickel-copper alloy;
[0036]Specifically, arc discharge method, laser ablation method, plasma enhanced chemical v...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com