Underfill composition
A technology of underfill glue and composition, which is applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problems of low thermal expansion coefficient, high thermal conductivity, flexural strength, high viscosity and inconvenience of underfill glue compositions Flip-chip packaging and other issues, to overcome the effects of solder joint detachment or fracture, improve wetting and spreadability, and low thermal expansion coefficient
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Example Embodiment
[0042] Example 1
[0043] This embodiment provides an underfill rubber composition, which includes the following weight components: 40 g of silica spherical particles, 25 g of bisphenol A epoxy resin, 20 g of methylhexahydrophthalic anhydride curing agent, and 0.4 of silicone coupling agent. g and auxiliary agent 14.6g, among which auxiliary agents include accelerator 2-ethyl-4-methylimidazole 1.0g, BYK-3700.5g, polysiloxane antifoaming agent 0.3g, dimethyl phthalate 1.0g g. 0.6g of carbon black and 11.2g of acetone.
[0044] The test performance of the underfill rubber composition prepared in the above example 1 is as follows:
[0045] The viscosity is 20pa.s, the thermal expansion coefficient CTEl: 38ppm / ℃, CTE2: 112ppm / ℃, the thermal conductivity coefficient is 1.6W / m·K, and the bending strength is 120MPa.
Example Embodiment
[0046] Example 2
[0047] This embodiment provides an underfill gum composition, which includes the following weight components: 60 g of a mixture of silica spherical particles and alumina spherical particles, 25 g of bisphenol A epoxy resin, and 5 g of methylhexahydrophthalic anhydride curing agent , Silicone coupling agent 0.6g and auxiliary agent 9.4g, of which the auxiliary agent includes accelerator 2-ethyl-4-methylimidazole 1.0g, acrylic dispersant 0.6g, acrylic defoamer 0.5g, o-benzene A black paste made up of 0.7 g of diethyl diformate, 0.6 g of carbon black and bisphenol F diglycidyl ether, and 6.0 g of ethyl acetate.
[0048] The test performance of the underfill rubber composition prepared in the above example 2 is as follows:
[0049] Viscosity is 30pa.s, thermal expansion coefficient CTEl: 46ppm / ℃, CTE2: 120ppm / ℃, thermal conductivity is 1.8W / m·K, bending strength is 115MPa.
Example Embodiment
[0050] Example 3
[0051] This embodiment provides an underfill adhesive composition, including the following weight components: 40g of a mixture of silica spherical particles and silicon nitride spherical particles, 25g of bisphenol F epoxy resin, 20g of dicyandiamide curing agent, Organic titanate coupling agent 0.4g and auxiliary agent 14.6g, among which auxiliary agents include accelerator 2-ethyl-4-methylimidazole 1.0g, BYK-3700.5g, polysiloxane antifoaming agent 0.3g, 11.2g of acetone, 0.6g of carbon black and 1.0g of dibutyl phthalate.
[0052] The test performance of the underfill rubber composition prepared in the above example 3 is as follows:
[0053] Viscosity is 25.0pa.s, thermal expansion coefficient CTEl: 35ppm / ℃, CTE2: 120ppm / ℃, thermal conductivity is 1.7W / m·K, bending strength is 135MPa.
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