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Underfill composition

A technology of underfill glue and composition, which is applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problems of low thermal expansion coefficient, high thermal conductivity, flexural strength, high viscosity and inconvenience of underfill glue compositions Flip-chip packaging and other issues, to overcome the effects of solder joint detachment or fracture, improve wetting and spreadability, and low thermal expansion coefficient

Active Publication Date: 2019-10-22
深圳泰研半导体装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, the underfill composition disclosed above still has high viscosity, and does not have low thermal expansion coefficient, high thermal conductivity and high flexural strength, and its performance is not excellent enough, so it is not convenient to be used in flip-chip packaging.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] This embodiment provides an underfill composition, which includes the following components by weight: 40 g of spherical silica particles, 25 g of bisphenol A epoxy resin, 20 g of methyl hexahydrophthalic anhydride curing agent, and 0.4 g of silicone coupling agent. g and 14.6g of additives, including 1.0g of accelerator 2-ethyl-4-methylimidazole, 0.5g of BYK-3700, 0.3g of polysiloxane defoamer, and 1.0g of dimethyl phthalate g, 0.6 g of carbon black and 11.2 g of acetone.

[0044] The performance of the underfill composition prepared in the above-mentioned Example 1 is as follows:

[0045] The viscosity is 20pa.s, the thermal expansion coefficient CTEl: 38ppm / ℃, CTE2: 112ppm / ℃, the thermal conductivity is 1.6W / m·K, and the bending strength is 120MPa.

Embodiment 2

[0047] This embodiment provides an underfill composition, which includes the following components by weight: 60 g of a mixture of spherical silica particles and spherical alumina particles, 25 g of bisphenol A epoxy resin, and 5 g of methyl hexahydrophthalic anhydride curing agent , 0.6g of silicone coupling agent and 9.4g of additives, wherein the additives include 1.0g of accelerator 2-ethyl-4-methylimidazole, 0.6g of acrylic dispersant, 0.5g of acrylic defoamer, o-phthalic 0.7 g of diethyl diformate, 0.6 g of black paste obtained by mixing carbon black and bisphenol F diglycidyl ether, and 6.0 g of ethyl acetate.

[0048] The performance of the underfill composition prepared in the above-mentioned Example 2 is as follows:

[0049] The viscosity is 30pa.s, the coefficient of thermal expansion CTEl: 46ppm / ℃, CTE2: 120ppm / ℃, the thermal conductivity is 1.8W / m·K, and the bending strength is 115MPa.

Embodiment 3

[0051] This embodiment provides an underfill composition, which includes the following components by weight: 40 g of a mixture of spherical silica particles and spherical silicon nitride particles, 25 g of bisphenol F epoxy resin, 20 g of dicyandiamide curing agent, Organic titanate coupling agent 0.4g and auxiliary agent 14.6g, wherein auxiliary agent includes accelerator 2-ethyl-4-methylimidazole 1.0g, BYK-3700.5g, polysiloxane defoamer 0.3g, 11.2 g of acetone, 0.6 g of carbon black, and 1.0 g of dibutyl phthalate.

[0052] The performance of the underfill composition prepared in the above-mentioned Example 3 is as follows:

[0053] The viscosity is 25.0pa.s, the coefficient of thermal expansion CTEl: 35ppm / ℃, CTE2: 120ppm / ℃, the thermal conductivity is 1.7W / m·K, and the bending strength is 135MPa.

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Abstract

The invention discloses an underfill composition. The underfill composition comprises 30-65 wt% of a filler, 15-55 wt% of an epoxy resin, 7-20 wt% of a curing agent, 0.1-2.0 wt% of a silane coupling agent and 1.5-45 wt% of assistants, the filler is an inorganic filler, the filler includes spherical silica particles, and the assistants includes any one or any combination of a promoter, a diluent, aplasticizer, a defoaming agent, a dispersant and a pigment. The above formula and the combination of the above components are combined, so the underfill composition has the advantages of low viscosity, low thermal expansion coefficient, high thermal conductivity, high flexural strength, can solve the problem of the frequent occurring solder joint drop or fracture in the thermal cycle test, and also has the advantages of long-term usability, good adhesion and excellent mechanical properties.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an underfill adhesive composition with low viscosity, low thermal expansion coefficient, high thermal conductivity and high bending strength. Background technique [0002] An underfill is a liquid-phase adhesive, usually a highly silica-filled epoxy composition. Underfill is a key material in flip chip packaging technology. [0003] Originally designed for flip-chip to enhance its reliability, the thermal expansion coefficient of silicon material chips is much lower than that of ordinary PCB board materials, so solder joints often fall off or break during thermal cycle tests. Therefore, the underfill should have a thermal expansion coefficient that matches that of the solder ball, low viscosity, high thermal conductivity, and high flexural strength, as well as long-term usability, good adhesion, and excellent mechanical properties. [0004] However, the existing underfills do...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J11/04
CPCC08K2201/011C08L2205/025C08L2205/03C09J11/04C09J163/00C08L83/04C08K13/04C08K7/18C08K5/12C08K3/04C08K5/3445C08L63/00
Inventor 张少波
Owner 深圳泰研半导体装备有限公司
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