Quantum dot light-emitting diode and preparation method thereof
A quantum dot light-emitting and diode technology, which is applied in semiconductor/solid-state device manufacturing, organic semiconductor devices, electric solid-state devices, etc., can solve the problems of poor stability of quantum dot light-emitting diodes, reduce non-radiative transitions, and increase device efficiency , the effect of mature technology
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[0031] And, the embodiment of the present invention also provides a method for preparing a quantum dot light-emitting diode, which is characterized in that it includes the following steps:
[0032] S01. Provide a cathode;
[0033] S02. Prepare a first functional layer on the cathode, the first functional layer is an electron transport layer of a silicon-doped zinc oxide material;
[0034] S03. sequentially preparing a quantum dot light-emitting layer on the surface of the electron transport layer;
[0035] S04. Prepare an anode on the quantum dot light-emitting layer.
[0036] The preparation method of the quantum dot light-emitting diode provided in the embodiment of the present invention only needs to prepare an electron transport layer of silicon-doped zinc oxide material on the cathode, and then sequentially prepare the quantum dot light-emitting diode and the anode. The process of the method is relatively mature, simple and controllable, and is conducive to realizing larg...
Embodiment 1
[0046] A method for preparing a quantum dot light-emitting diode, comprising the following steps:
[0047] S11. Place the patterned ITO substrate in acetone, lotion, deionized water and isopropanol in sequence for ultrasonic cleaning, and each step of ultrasonic cleaning needs to last for about 15 minutes. After the ultrasound is completed, place the ITO in a clean oven to dry for later use.
[0048] S12. After the ITO substrate is dried, deposit a layer of Zn on it by sputtering m Si n O electron transport layer.
[0049] S13. After the upper sheet is cooled to room temperature, deposit QDs on it. The thickness of this layer is 20-40nm without heating. Afterwards, the hole transport layer TFB is deposited to a thickness of 40 nm. After the deposition of this step is completed, place the sheet on a heating platform at 100° C. for 30 minutes to remove residual solvent. Finally, place the sheet with each functional layer deposited in the evaporation chamber and thermally ev...
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Abstract
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