Analysis method for contact stress distribution of gradient elastic grinding and polishing disc

Abstract

The invention discloses an analysis method for contact stress distribution of a gradient elastic grinding and polishing disc. The method comprises the following steps of (1) establishing a removal function MRR(y) according to the machining requirement of a workpiece; (2) obtaining an ideal contact stress distribution function P*(y) according to a Preston equation, and determining an ideal elasticmodulus distribution function E*(y) of the grinding and polishing disc in the radial direction y through the P*(y); (3) establishing an in-plane gradient distribution elastic thin layer contact modelaccording to E*(y), introducing a compensation function H(z) to compensate the influence of non-principal axis stress on contact stress P(y) according to lateral deformation epsilon x and epsilon y, correcting deformation displacement L of a gradient elastic layer in the vertical direction, and deriving a contact stress analysis equation P(y) by using a semi-inverse solution; and (4) constructinga simulation model, completing static stress simulation, establishing a coupling relationship between a simulation result and an analytical equation, assuming a compensation function expression, and completing an optimization equation of a contact stress analytical solution.

Description

Technical field [0001] The present invention relates to the technical field of ultra-precision machining, and more specifically, to an analytical method for the contact stress distribution of a gradient elastic polishing disc. Background technique [0002] With the rapid development of the high-tech industry, hard and brittle materials such as sapphire, silicon wafers, and optical glass have been widely used in the optical and electronic industries due to their high hardness, high melting point, and high wear resistance. The surface accuracy and surface quality of such materials have a key influence on the quality and life of the device. [0003] At present, the processing methods for such hard and brittle materials mainly include stress plates, magneto-fluidics, ion beams, jets, etc. While achieving relevant technological breakthroughs, there are uneven material removal, poor processing efficiency and quality controllability, etc. The problem is that there is no guarantee that th...

AI Technical Summary

Problems solved by technology

[0003] At present, the processing methods for such hard and brittle materials mainly include stress disk, magneto-fluidic flow, ion beam, jet flow, etc. While making relevant technical breakthroughs, there are uneven material removal, poor processing efficiency and quality controllability, etc. The problem is that it is impossible to guarantee that the medium and high frequency errors can be further suppressed on the basis of not deteriorating the surface accuracy of the workpiece

At the same time, due to the essential problem of uneven material removal at each point in the contact area, it increases the difficulty of controlling the workpiece surface shape accuracy and surface quality consistency, that is, increases the difficulty of optimizing the processing trajectory and dwell time algorithm, making processing time-consuming and laborious , the cost is also higher

Images