LED support electroplating method and LED support
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 崇辉半导体(深圳)有限公司
- Publication Date
- 2019-12-03
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Figure 1
Abstract
Description
technical field
[0001] The invention relates to the technical field of electroplating, and more specifically, the invention relates to an electroplating method for an LED bracket and an LED bracket. Background technique
[0002] SMD LED is a new type of surface-mounted semiconductor light-emitting device, which has the advantages of small size, large scattering angle, good uniformity of light emission, and high reliability. The light-emitting colors include various colors including white light. Therefore, it is widely used in various electronic products. In order to improve the overall performance of the LED bracket, electroplating treatment is required in the processing process. Electroplating is the process of plating a thin layer of other metals or alloys on the surface of certain metals using the principle of electrolysis. It is the process of using electrolysis to make metal or other materials. The process of attaching a layer of metal film to the surface of the part, ...