Photo-thermal dual-curing engineering adhesive, and preparation method and application thereof

A dual-curing, adhesive technology, applied in the direction of adhesives, adhesive additives, adhesive types, etc., can solve the problems of incomplete curing of glue, poor mechanical properties, bonding failure, etc., to solve the application limitations of bonding, Ease of industrial production and the effect of solving absorption problems

Active Publication Date: 2020-01-03
江西腾达电力设计院有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, UV-curable adhesives also have their own limitations. The hardness of conventional UV-curable adhesives is not high after curing, and the adhesive layer is brittle and may have cracks, and the mechanical properties are poor; During the curing process, the light-absorbing effect of the adhesive itself will lead to incomplete curing of the glue, or even no curing, resulting in insufficient bonding strength or even bonding failure; during the curing process, the shading part o

Method used

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  • Photo-thermal dual-curing engineering adhesive, and preparation method and application thereof
  • Photo-thermal dual-curing engineering adhesive, and preparation method and application thereof
  • Photo-thermal dual-curing engineering adhesive, and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0027] Example 1

[0028] A light-heat dual-curable engineering adhesive is made of the following components by weight:

[0029]

[0030] The light gray photochromic powder is a commercially available microcapsule powder that undergoes a colorless to light gray reversible color change with the irradiation of ultraviolet wavelengths. Prepared.

[0031] A preparation method of a photothermal dual-curable engineering adhesive, the method comprising:

[0032] Stir polyurethane acrylate, epoxy polyacrylate, isobornyl acrylate, cyclotrimethylolpropane methylal acrylate, photoinitiator TPO and azobisisoheptanonitrile in a light-tight container, and stir The speed is 300r / min, stirring for 30min to obtain a mixed liquid;

[0033] Slowly add light gray photochromic powder into the mixed liquid while stirring, stir and mix, the stirring speed is 200r / min, stir for 30min, then slowly add nano silicon dioxide, ultrasonic for 20min, after vacuum defoaming to obtain photothermal dual ...

Example Embodiment

[0036] Example 2

[0037] A light-heat dual-curable engineering adhesive is made of the following components by weight:

[0038]

[0039] The red photochromic powder is prepared from a commercially available microcapsule powder that undergoes a reversible color change from colorless to red when irradiated by ultraviolet wavelengths. It is prepared after ultrasonic treatment with 86% ethanol solvent for 18 minutes and spray drying for 2 hours. .

[0040] A preparation method of a photothermal dual-curable engineering adhesive, the method comprising:

[0041] Stir and mix polyurethane acrylate, epoxy polyacrylate, isobornyl acrylate, cyclotrimethylolpropane formal acrylate, photoinitiator 819 and ethylenediamine in a light-tight container at a stirring speed of 200r / min, stirred for 40min to obtain mixed liquid;

[0042]Slowly add red photochromic powder into the mixed liquid while stirring, stir and mix, the stirring speed is 300r / min, stir for 25min, then slowly add nan...

Example Embodiment

[0045] Example 3

[0046] A light-heat dual-curable engineering adhesive is made of the following components by weight:

[0047]

[0048] The blue photochromic powder is prepared from a commercially available microcapsule powder that undergoes a reversible color change from colorless to blue when irradiated with ultraviolet wavelengths, and is prepared after ultrasonic treatment with 90% mass concentration of ethanol solvent for 20 minutes and spray drying for 1.8 hours. made.

[0049] A preparation method of a photothermal dual-curable engineering adhesive, the method comprising:

[0050] Stir and mix polyurethane acrylate, epoxy polyacrylate, isobornyl acrylate, cyclotrimethylolpropane formal acrylate, photoinitiator TPO-L and aromatic amine in a light-tight container at a stirring speed of 250r / min, stirring for 40min to obtain a mixed liquid;

[0051] Slowly add blue photochromic powder into the mixed liquid while stirring, stir and mix, the stirring speed is 270r / mi...

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Abstract

The invention discloses a photo-thermal dual-curing engineering adhesive, and a preparation method and an application thereof. The photo-thermal dual-curing engineering adhesive is prepared from, by weight, 20-70 parts of a polyurethane acrylate, 10-30 parts of an epoxy polyacrylate, 15-40 parts of isobornyl acrylate, 10-30 parts of cyclic trimethylopropane formal acrylate, 0.2-15 parts of a nanometer inorganic filler, 0.5-3 parts of a photoinitiator, 0.5-3 parts of a thermal initiator and 0.5-5 parts of a photochromic powder. The nanometer inorganic filler is uniformly dispersed in the adhesive, so that the cured adhesive has high hardness, no surface cracks and good mechanical properties; and the photochromic powder in the adhesive can be uniformly fused with the adhesive after being modified, so that the ultraviolet absorption problem of a conventional colored adhesive is solved, and the adhesive is completely cured and has a color indication function. The preparation method of thephoto-thermal dual-curing engineering adhesive has the advantages of simplicity, short production period, and easiness in industrial production.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a photothermal dual-curable engineering adhesive and a preparation method and application thereof. Background technique [0002] Adhesives play an extremely important role in industrial production and engineering. Due to the problems of traditional solvent-based and hot-melt adhesives in the process of production and use, such as polluting the environment, high energy consumption in the production process, slow curing speed, short service life, and reduced bond strength after long-term use, the application of adhesives is limited. Application, especially when used in some engineering fields such as civil engineering and construction, due to the limitation of external conditions, the curing of adhesives is more difficult, which restricts the development of the adhesive industry to a certain extent. Therefore, the development and application of new adhesives have attracted much attention....

Claims

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Application Information

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IPC IPC(8): C09J175/14C09J163/10C09J11/04C09J11/00
CPCC08K2003/2227C08K2003/265C08K2201/011C09J11/00C09J11/04C09J175/14C08L63/10C08K3/36C08K3/22C08K3/26C08K3/346
Inventor 姚明侠陈国华吴浩陈幸陈盛华朱云孙蕾刘梦真赖华勇
Owner 江西腾达电力设计院有限公司
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