Photo-thermal dual-curing engineering adhesive, and preparation method and application thereof

Abstract

The invention discloses a photo-thermal dual-curing engineering adhesive, and a preparation method and an application thereof. The photo-thermal dual-curing engineering adhesive is prepared from, by weight, 20-70 parts of a polyurethane acrylate, 10-30 parts of an epoxy polyacrylate, 15-40 parts of isobornyl acrylate, 10-30 parts of cyclic trimethylopropane formal acrylate, 0.2-15 parts of a nanometer inorganic filler, 0.5-3 parts of a photoinitiator, 0.5-3 parts of a thermal initiator and 0.5-5 parts of a photochromic powder. The nanometer inorganic filler is uniformly dispersed in the adhesive, so that the cured adhesive has high hardness, no surface cracks and good mechanical properties; and the photochromic powder in the adhesive can be uniformly fused with the adhesive after being modified, so that the ultraviolet absorption problem of a conventional colored adhesive is solved, and the adhesive is completely cured and has a color indication function. The preparation method of thephoto-thermal dual-curing engineering adhesive has the advantages of simplicity, short production period, and easiness in industrial production.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a photothermal dual-curable engineering adhesive and a preparation method and application thereof. Background technique [0002] Adhesives play an extremely important role in industrial production and engineering. Due to the problems of traditional solvent-based and hot-melt adhesives in the process of production and use, such as polluting the environment, high energy consumption in the production process, slow curing speed, short service life, and reduced bond strength after long-term use, the application of adhesives is limited. Application, especially when used in some engineering fields such as civil engineering and construction, due to the limitation of external conditions, the curing of adhesives is more difficult, which restricts the development of the adhesive industry to a certain extent. Therefore, the development and application of new adhesives have attracted much attention....

AI Technical Summary

Problems solved by technology

However, UV-curable adhesives also have their own limitations. The hardness of conventional UV-curable adhesives is not high after curing, and the adhesive layer is brittle and may have cracks, and the mechanical properties are poor; During the curing process, the light-absorbing effect of the adhesive itself will lead to incomplete curing of the glue, or even no curing, resulting in insufficient bonding strength or even bonding failure; during the curing process, the shading part of the translucent material or component is exposed to ultraviolet The absorption, blocking and reflection of light lead to a decrease in the photoinitiation efficiency of the adhesive and incomplete curing, which greatly reduces the mechanical properties of the adhesive.

These limitations directly limit the scope of application of UV-curable adhesives in engineering fields such as construction, automobiles, machinery, electronics, aerospace, and medical treatment to a certain extent.

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