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Preparation method of silicone rubber with high thermal conductivity

A silicone rubber, high thermal conductivity technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problem that the thermal conductivity of silicone rubber is not high, cannot meet the requirements of electrical insulation, and cannot meet the thermal conductivity of thermal conductive materials for high-power electronic equipment. requirements and other issues to achieve the effect of improving heat dissipation performance

Inactive Publication Date: 2020-01-21
SUZHOU XINTIANXIN HIGH PRECISION MECHANICAL CO LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

At present, many researchers at home and abroad have carried out corresponding research on thermally conductive silicone rubber, but there are still several problems: first, the thermal conductivity of silicone rubber is not high; second, it cannot meet the requirements of electrical insulation
[0005] Although the above-mentioned method for preparing thermally conductive silicone rubber can make the thermal conductivity reach more than 5.0W / m·k, it fails to reflect the advantages of graphene's own ultra-high thermal conductivity applied to silicone rubber, and at the same time it cannot meet the needs of high-power electronics. Requirements of equipment for thermal conductivity of thermally conductive materials

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  • Preparation method of silicone rubber with high thermal conductivity

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[0036] The invention provides a preparation method of high thermal conductivity silicone rubber. The technical solution of the present invention is described in detail below to make it easier to understand and grasp.

[0037] The preparation method of high thermal conductivity silicon rubber comprises the steps:

[0038] Material selection, choose graphite, thermally conductive filler, silicone rubber substrate, silicone oil, catalyst, inhibitor and crosslinking agent.

[0039] Planetary ball milling, solid-phase mixing of graphite and thermally conductive fillers, and obtaining graphene-wrapped fillers after planetary ball milling. The planetary ball milling time is 30-240min, and the milling speed is 100-600r / min.

[0040] Ultrasonic treatment, the graphene-wrapped filler is subjected to ultrasonic treatment to obtain a treated thermally conductive filler. The ultrasonic power is 300W, and the ultrasonic treatment time is 30-120min.

[0041] Mixing, put the graphene-wrap...

Embodiment 1

[0055] Select the following components and parts by mass, natural graphite graphene (1 μm in particle size): 0.5 parts; methyl vinyl silicone rubber: 80 parts; spherical alumina (75 μm in particle size): 70 parts; hydrogen-containing silicone oil (containing The amount of hydrogen accounts for 0.06% of the total weight of hydrogen-containing silicone oil): 1.0 parts; platinum catalyst: 0.05 parts; diphenylsilanediol: 0.01 parts; Oxy)hexane: 0.1 part.

[0056] First, 75 μm spherical alumina powder and natural graphite graphene (1 μm particle size) were solid-phase mixed by planetary ball milling to obtain graphene-coated thermally conductive fillers. The ball milling speed was 100 r / min, and the ball milling time was 200 min. Secondly, the graphene-coated thermally conductive filler was added to the methyl vinyl silicone rubber, and treated under ultrasonic for 80 min, and the ultrasonic power was 300W. Then, the silicone rubber premix containing thermally conductive filler, h...

Embodiment 2

[0058] Select the following components and parts by mass, natural graphite (thickness is 70mm): 0.64 parts, methyl phenyl silicone rubber: 75 parts, boron nitride and zinc oxide: 75 parts, hydrogen-containing silicone oil (hydrogen content accounts for 0.1% of the total weight of hydrogen silicone oil): 1.0 parts, platinum catalyst: 1.0 parts, methylphenyldiethoxysilane: 0.02 parts; 2,4-dichlorobenzoyl peroxide: 0.2 parts.

[0059] First, a mixture of boron nitride and zinc oxide was mixed with natural graphite (70 mm in thickness) in a solid state by planetary ball milling to obtain graphene-coated thermally conductive fillers. The ball milling speed was 250 r / min, and the ball milling time was 100 min. Secondly, add the graphene-coated thermally conductive filler into the methylphenyl silicone rubber, and treat it under ultrasonic for 60min, and the ultrasonic power is 300W. Then, the silicone rubber premix containing thermally conductive filler, hydrogen-containing silicone...

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Abstract

The invention discloses a preparation method of silicone rubber with high thermal conductivity. The preparation method comprises: mixing graphite with the spherical heat-conducting filler; stripping natural graphite into graphene with a thinner nanosheet layer structure by adopting a planetary ball milling method wherein dispersion of the spherical heat-conducting filler is promoted at the same time, so that the graphene-coated heat-conducting filler is obtained; then, performing ultrasonic treatment on a silicone rubber compound formed through proportioning, so that the modified heat-conducting filler is fully dispersed in a silicone rubber matrix under the ultrasonic action to form a heat-conducting network, and then carrying out high-temperature and high-pressure mold pressing to prepare the silicone rubber nanocomposite with the high heat conductivity coefficient. According to the preparation method of the high-thermal-conductivity silicone rubber provided by the invention, the graphene and the thermal-conductive filler can easily form a communicated thermal-conductive network in the silicone rubber; particularly, the heat dissipation performance of a silicone rubber thermal interface material can be greatly improved by utilizing a very small amount of graphene, and the preparation method is particularly suitable for the field of heat dissipation of electronic products.

Description

technical field [0001] The invention relates to a preparation method of high thermal conductivity silicone rubber, and belongs to the technical field of preparation methods of high thermal conductivity silicone rubber nanocomposite materials. Background technique [0002] With the advent of the 5G era and the rapid development of electronic devices in the direction of "miniaturization and integration", electronic devices are bound to generate a lot of heat during operation, resulting in a sharp rise in the temperature inside electronic devices. If the heat dissipation problem of these heating elements cannot be effectively solved, their service life will be seriously affected. Therefore, efficient heat dissipation capability has become a key factor restricting the service life of electronic devices. In order to make electronic devices run efficiently and stably for a long time, effective thermal management measures must be taken to remove the heat generated by electronic de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/04C08L83/07C08L83/05C08K13/06C08K9/10C08K7/18C08K3/04C08K3/38C08K3/22C08K3/34C09K5/14
CPCC08K2003/2227C08K2003/2296C08K2003/385C08L83/04C08L2205/025C09K5/14C08K13/06C08K9/10C08K7/18C08K3/042C08K3/04C08K3/38C08K3/22C08K3/34
Inventor 王一超陈宁陈华井新利王淑娟
Owner SUZHOU XINTIANXIN HIGH PRECISION MECHANICAL CO LTD
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