Application of alkaline cyanide-free copper plating process in gravure plate industry

A cyanide-free copper plating technology, applied in jewelry, etc., can solve the problems of high cost, reduce pollution, save manpower and material resources, and prevent the discharge of nickel ions

Inactive Publication Date: 2020-02-07
SHANTOU KAIJIA MOLD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide the application of the alkaline cyanide-free copper plating process in the gravure industry, so as to solve the problem that the traditional alkaline cyanide-free nickel plating process proposed in the above background technology has a large cost and needs to be cleaned and polished before acid copper plating

Method used

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  • Application of alkaline cyanide-free copper plating process in gravure plate industry
  • Application of alkaline cyanide-free copper plating process in gravure plate industry
  • Application of alkaline cyanide-free copper plating process in gravure plate industry

Examples

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Embodiment 1

[0060] Application of alkaline cyanide-free copper plating process in gravure industry, applying alkaline cyanide-free copper plating process to gravure production, including the following steps:

[0061] Step 1. Grinding and degreasing: Grinding and cleaning the surface of the plate roll to be plated, and using sodium hydroxide to degrease;

[0062] Step 2. Washing: Wash the plated roll after degreasing until the surface is clean and free of debris;

[0063] Step 3, spraying: the preparation mass fraction is 5% potassium carbonate dilute solution, sprays one deck of 5% potassium carbonate dilute solution after washing the plate roller;

[0064] Step 4. Alkaline cyanide-free alkali copper: put the gravure plate to be copper-plated into the copper-plating tank for copper-plating, wherein, the composition of the electroplating solution and the process parameters are as follows: BEO: 15mg / L, copper ion: 4g / L, citric acid Sodium: 120g / L, opener: 145g / L, pH: 9, temperature: 45°C, ...

Embodiment 2

[0066]Application of alkaline cyanide-free copper plating process in gravure industry, applying alkaline cyanide-free copper plating process to gravure production, including the following steps:

[0067] Step 1. Grinding and degreasing: Grinding and cleaning the surface of the plate roll to be plated, and using sodium phosphate to degrease;

[0068] Step 2. Washing: Wash the plated roll after degreasing until the surface is clean and free of debris;

[0069] Step 3, spraying: the preparation mass fraction is 5% potassium carbonate dilute solution, sprays one deck of 5% potassium carbonate dilute solution after washing the plate roller;

[0070] Step 4. Alkaline cyanide-free alkali copper: put the gravure plate to be copper-plated into the copper-plating tank for copper-plating, wherein the composition of the electroplating solution and the process parameters are as follows: BEO: 16mg / L, copper ion: 5.5g / L, HEDP : 115g / L, opening agent: 150g / L, pH value: 9.5, temperature: 47℃,...

Embodiment 3

[0072] Application of alkaline cyanide-free copper plating process in gravure industry, applying alkaline cyanide-free copper plating process to gravure production, including the following steps:

[0073] Step 1. Grinding and degreasing: Grinding and cleaning the surface of the plate roll to be plated, and using sodium carbonate to degrease;

[0074] Step 2. Washing: Wash the plated roll after degreasing until the surface is clean and free of debris;

[0075] Step 3, spraying: the preparation mass fraction is 5% potassium carbonate dilute solution, sprays one deck of 5% potassium carbonate dilute solution after washing the plate roller;

[0076] Step 4. Alkaline cyanide-free alkali copper: put the gravure plate to be copper-plated into the copper plating tank for copper plating, wherein the composition of the electroplating solution and the process parameters are as follows: BEO: 17mg / L, copper ion: 6g / L, B2 Disodium amine tetraacetate: 110g / L, opener: 155g / L, pH value: 10, t...

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Abstract

The invention discloses application of an alkaline cyanide-free copper plating process in a gravure plate industry, and belongs to the technical field of gravure plate production. The alkaline cyanide-free copper plating process is applied to gravure plate production, and comprises the following steps of (1) polishing and degreasing: polishing and cleaning the surface of a plate roller to be plated, and degreasing by using a degreaser; (2) water-washing: water-washing the degreased plate roller to be plated until the surface is clean without impurities; (3) spraying; and (4) carrying out cyanide-free copper plating: placing a gravure plate to be copper-plated into a copper plating groove, and carrying out copper plating, so that a prepared gravure plate plating layer crystallization is fine and smooth, the levelness is excellent, the appearance of the plate roller is more attractive, the pollution on a follow-up plating solution due to corrosives is further reduced, a plating layer hasno need to be polished manually, the plating applying of acid copper can be directly carried out, a polishing process before acid copper electroplating can be cancelled, manpower and material resources are saved, the emission of cleaning and polishing waste water is saved, the production cost of the gravure plate is reduced, and a favorable economic benefit is realized.

Description

technical field [0001] The invention relates to the technical field of gravure plate making, in particular to the application of an alkaline cyanide-free copper plating process in the gravure industry. Background technique [0002] Plate making is a general term for duplicating originals into printing plates. There are a series of plate-making methods such as arranging lead movable type into movable type, using movable type to form paper and casting it into a copy letterpress, and obtaining a negative through photographic or electronic color separation, and using the negative to make letterpress, lithography, and intaglio. The factors that affect the quality of the printing plate are the most in the plate making, mainly including the concentration of the developer, the temperature and time of the development, the circulation and agitation of the developer, and the degree of fatigue and decay of the developer. [0003] At present, not only the electronic engraving process is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38C25D7/00C25D5/34
CPCC25D3/38C25D5/34C25D7/00
Inventor 张建平
Owner SHANTOU KAIJIA MOLD
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