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One-component epoxy resin composition of imidazole curing accelerator containing intramolecular hydrogen bond and preparation method of composition

A curing accelerator and hydrogen-bonded imidazole technology, which is applied in the field of one-component epoxy resin composition and its preparation, can solve the problem of insufficient latent property, uneven curing of cured products, mechanical properties, thermal stability and dielectric properties drop and other issues, to achieve high glass transition temperature and thermal stability, good application prospects, and good room temperature storage stability

Inactive Publication Date: 2020-02-14
JIANGNAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned modified imidazole curing accelerators often have problems such as poor compatibility with the epoxy matrix resin, poor stability of the mixed system, insufficient latency, and the introduction of metal elements to increase conductivity, which directly leads to uneven curing of the cured product. The transformation temperature decreases, the mechanical properties, thermal stability and dielectric properties decrease, etc.

Method used

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  • One-component epoxy resin composition of imidazole curing accelerator containing intramolecular hydrogen bond and preparation method of composition
  • One-component epoxy resin composition of imidazole curing accelerator containing intramolecular hydrogen bond and preparation method of composition
  • One-component epoxy resin composition of imidazole curing accelerator containing intramolecular hydrogen bond and preparation method of composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] (1) Preparation of latent curing accelerator

[0040] First, add 150 mL of absolute ethanol to a three-neck flask, add 2.04 g (0.018 mol) of salicylaldehyde, and 2.08 g (0.020 mol) of sodium bisulfite, stir at room temperature for 4 hours, and set aside.

[0041] Add 2.16g (0.020mol) o-phenylenediamine to 75mL N,N-dimethylformamide (DMF), dissolve it completely by magnetic stirring, and add the DMF solution of o-phenylenediamine dropwise to In a three-necked flask, stir with magnetic force, and react for 4 hours. After the reaction, the product was poured into ice water, left to stand for 1h, suction filtered, rinsed with deionized water, and dried in an oven to obtain the target product 2-(2-hydroxyphenyl)-1H-benzimidazole (HPBI); route such as figure 1 shown.

[0042] Such as figure 2 Shown, the H NMR spectrum of 2-(2-hydroxyphenyl)-1H-benzimidazole (HPBI). The chemical shift of hydrogen on hydroxyl δ=13.18(br,2H), the chemical shift of hydrogen on carbon 4=8.03...

Embodiment 2

[0048] (1) Preparation of latent curing accelerator

[0049] The preparation method is the same as in Example 1.

[0050] (2) Preparation of one-component epoxy resin composition

[0051] 50g tetramethylbiphenyl type epoxy resin (YX4000, epoxy equivalent is 185g / eq), 30g curing agent novolac resin (hydroxyl equivalent is 106g / eq), 1.5g curing accelerator HPBI were melted together at 110°C. After mixing evenly, cool to room temperature to obtain a one-component epoxy resin composition.

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Abstract

The invention discloses a one-component epoxy resin composition of an imidazole curing accelerator containing an intramolecular hydrogen bond and a preparation method of the composition, and belongs to the technical field of epoxy resin latent curing accelerators. The one-component epoxy resin composition includes epoxy matrix resin, a curing agent and a curing accelerator, and the curing accelerator is a benzimidazole derivative having the intramolecular hydrogen bond. The benzimidazole derivative makes the one-component epoxy resin composition have good room-temperature storage stability; and at high temperature, the intramolecular hydrogen bond of the benzimidazole derivative is broken, the alkali catalytic activity is instantly released, the curing exothermic peak is narrower, so thatcross-linking curing of the epoxy resin composition system is rapidly catalyzed, the curing cross-linking reaction occurs rapidly at high temperature, and the obtained epoxy cured product has a higherglass transition temperature and thermal stability. The epoxy resin composition provided by the invention has good application prospects in the fields of epoxy adhesives, coatings, composite materials, copper clad laminates, electronic packaging materials and the like.

Description

technical field [0001] The invention belongs to the technical field of latent curing accelerators for epoxy resins, and in particular relates to a one-component epoxy resin composition containing an intramolecular hydrogen bond type imidazole curing accelerator and a preparation method thereof. Background technique [0002] Epoxy resin refers to a large class of compounds that contain two or more epoxy groups in one molecule and can form a three-dimensional crosslinked network cured product in the presence of appropriate chemical reagents. When the cross-linking reaction between the epoxy matrix resin and the curing agent is often due to the high activation energy, the reaction needs to be reacted at a very high temperature or even cannot be reacted. Therefore, the curing cross-linking reaction of the epoxy resin often requires the addition of a curing accelerator To increase the reaction speed and shorten the reaction time. There are many types of curing accelerators, incl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/68
CPCC08G59/686
Inventor 魏玮孙鑫李小杰刘晓亚
Owner JIANGNAN UNIV
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