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Metal substrate with high thermal conductivity

A metal substrate, high thermal conductivity technology, used in circuit substrate materials, metal layered products, coatings, etc., can solve problems such as poor dielectric properties of copper clad laminates, achieve good adhesion, improve thermal conductivity, and efficiently conduct heat. channel effect

Pending Publication Date: 2020-02-21
惠州市欣可达科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the dielectric properties of the copper clad laminates prepared by this method are not good.

Method used

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  • Metal substrate with high thermal conductivity

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Embodiment 1

[0021] see figure 1 , in Embodiment 1 of the present invention, a metal substrate with high thermal conductivity, including a metal layer 4, an Al 2 o 3 h 2 O(6) film 3, coated on Al 2 o 3 h 2 The thermal conductivity insulating layer 2 and the metal foil layer 1 on the O(6) film 3 have a thermal conductivity of 0.2-4W / (m·K).

[0022] Al 2 o 3 h 2 The molecular structure of the O(6) film 3 is highly symmetrical, with low polarity and excellent dielectric properties. The present invention selects Al 2 o 3 h 2 O(6) film 3, which enables coating on Al 2 o 3 h 2 The thermally conductive insulating layer 2 above the O(6) film 3 passes through the pores, and the thermally conductive resin of the insulating layer can enter the Al 2 o 3 h 2 In the pores of the O(6) film 3, it acts as a pin, so that the heat-conducting insulating layer 2 and the Al 2 o 3 h 2 O(6) film 3 has good adhesion.

[0023] In the high thermal conductivity metal substrate of the present inve...

Embodiment 2

[0033] The main difference between this embodiment 2 and embodiment 1 is that in the highly thermally conductive metal substrate of the present invention, the thermally conductive insulating layer 2 can be a cyanate ester resin system, an epoxy resin system, a PTFE system, a hydrocarbon resin system, a polyester Any one of the phenylene ether resin system or the polyimide system is preferably a cyanate resin system.

[0034] The metal substrate, Al 2 o 3 h 2 The thermally conductive insulating layer 2 on the O(6) film 3 can effectively pass through Al due to its better fluidity. 2 o 3 h 2 O(6) film 3, so as to make better adhesion between layers; the entire insulating medium layer does not contain glass fiber cloth with large thermal resistance and poor dielectric properties, so the thermal conductivity of the entire metal substrate is high and the dielectric properties are high. Good electrical properties; ensure that the thermally conductive substrate has good peel stre...

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Abstract

The invention discloses a metal substrate with high thermal conductivity, and relates to the technical field of metal substrates. The metal substrate comprises a metal layer, an Al2O3H2O(6) film, a heat-conducting insulating layer and a metal foil layer which are sequentially arranged from bottom to top, wherein the heat-conducting insulating layer is coated on the Al2O3H2O(6) film, and the heat conductivity coefficient of the Al2O3H2O(6) film is 0.2-4W / (m.K). The metal substrate is high in heat conductivity coefficient and good in dielectric property; the heat conduction substrate is ensuredto have good peeling strength, and heat can be transmitted from the middle to the outside, so that the establishment of an efficient heat conduction channel is facilitated, and thus the heat conductivity coefficient of the substrate is improved; and the heat conductivity coefficient, the dielectric constant and the dielectric loss can be adjusted by adjusting the ratio of the Al2O3H2O(6) film to the heat-conducting insulating layer.

Description

technical field [0001] The invention relates to the technical field of metal substrates, in particular to a metal substrate with high thermal conductivity. Background technique [0002] In recent years, with the high-performance and high-function development of LED, energy equipment and communication equipment, in order to be able to transmit and process large-capacity information at high speed, the operating signal tends to be more high-frequency, so the electronic circuit substrate is proposed Higher requirements, which include excellent dielectric properties, that is, low dielectric constant and low dielectric loss factor. Moreover, the "light, thin, short, and small" of electronic products has made circuit boards more and more integrated, with more and more components on board, and more and more heat emitted per unit area during work. To ensure the stability and reliability of electronic components, the heat dissipation requirements of electronic circuit substrates are ...

Claims

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Application Information

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IPC IPC(8): H05K1/05B32B15/20B32B15/04B32B9/04B32B9/00B32B7/12B32B33/00
CPCH05K1/053H05K1/056B32B15/20B32B15/04B32B9/041B32B9/00B32B7/12B32B33/00H05K2201/0183B32B2255/26B32B2307/302B32B2307/202
Inventor 赖涛
Owner 惠州市欣可达科技有限公司
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