Two-component organic silicon pouring sealant and application method thereof

Abstract

The invention discloses a two-component organic silicon pouring sealant and an application method thereof, the two-component organic silicon pouring sealant comprises a component A and a component B,the component A comprises hyperbranched organic silicon resin with an end group siloxane group, vinyl MQ resin and a first heat conduction material, and the component B comprises hydrogen-containing silicone oil, a silane coupling agent and a second heat conduction material; wherein the hyperbranched organic silicon resin with the end group siloxane group is prepared by reacting methyl ethyl vinylsiloxane and dimethyl allyl siloxane in a feeding molar ratio of (0.5-2): 1; the application method comprises the following steps: during application, weighing the component A and the component B according to the formula ratio, uniformly mixing and stirring, pouring on a device to be encapsulated and protected, reacting and curing. The two-component organic silicon pouring sealant provided by theinvention not only can ensure that the organic silicon pouring sealant has high thermal conductivity and lasting insulativity, but also avoids the phenomenon of particle sedimentation in the use or storage process, so that the quality of the pouring sealant between batches is kept uniform and stable, and meanwhile, the pouring sealant also has high and low temperature resistance, excellent mechanical properties and the like.

Description

Technical field [0001] The invention belongs to the technical field of insulating materials, and specifically relates to a two-component silicone potting glue and an application method thereof. It is mainly used for potting the ends of the stator channel steel of a wind generator, and is also suitable for high-power electronic components, Potting protection for module power supplies and circuit boards that require high heat dissipation and temperature resistance. Background technique [0002] Potting can give the motor and electronic devices integrity, so that internal components and circuits have good resistance to external shocks and vibrations, avoid direct exposure of internal components and circuits, and improve the waterproof, moisture-proof and insulating properties of electronic devices. After curing, epoxy encapsulant is brittle and has poor heat resistance. Compared with epoxy resin, silicone encapsulant is soft after curing, has good toughness and resistance to high an...

AI Technical Summary

Problems solved by technology

Epoxy resin potting adhesive is brittle after curing and has poor heat resistance. Compared with epoxy resin, silicone potting adhesive is soft after curing, has good toughness and high and low temperature resistance, and can more effectively eliminate internal stress. , in a relatively wide temperature range, the electronic device shows good resistance to external shock and vibration; at the same time, due to its excellent heat resistance, it is not easy to yellow during long-term use; but the commonly used Silicone potting compound has poor thermal conductivity, and cannot dissipate the heat generated by electronic devices in a timely manner, which may easily cause the internal temperature of electronic devices to be too high to damage or even cause danger.

[0003] At present, the method of improving the thermal conductivity of silicone potting adhesive is mainly to add thermal conductive material to silicone potting adhesive, but the dispersion of thermal conductive material in resin is poor, although the surface of thermal conductive material is modified in the prior art Then fill it into the silicone potting compound, but there is still a high probability of uneven dispersion in actual use, and particle settlement occurs during use or storage, which affects the thermal conductivity, mechanical properties and electrical properties of the product

At the same time, in order to obtain high thermal conductivity, the amount of thermal conductive material added is large, and the thermal conductive material is usually selected to be nano-sized. On the one hand, the fluidity of the silicone potting compound is poor whether it is at room temperature or under heating conditions, resulting in penetration. It is not conducive to the formation of an overall insulating structure without air gaps, and there will be partial discharge in the later stage; on the other hand, even after the surface modification of nanoparticles, there is still a high probability of Agglomeration occurs in the ground, which not only increases the cost of purchasing nano-sized thermal conductive materials in the early stage, but also cannot obtain high thermal conductivity of nano-sized materials in the later stage

Images