Two-component organic silicon pouring sealant and application method thereof

Abstract

The invention discloses a two-component organic silicon pouring sealant and an application method thereof, the two-component organic silicon pouring sealant comprises a component A and a component B,the component A comprises hyperbranched organic silicon resin with an end group siloxane group, vinyl MQ resin and a first heat conduction material, and the component B comprises hydrogen-containing silicone oil, a silane coupling agent and a second heat conduction material; wherein the hyperbranched organic silicon resin with the end group siloxane group is prepared by reacting methyl ethyl vinylsiloxane and dimethyl allyl siloxane in a feeding molar ratio of (0.5-2): 1; the application method comprises the following steps: during application, weighing the component A and the component B according to the formula ratio, uniformly mixing and stirring, pouring on a device to be encapsulated and protected, reacting and curing. The two-component organic silicon pouring sealant provided by theinvention not only can ensure that the organic silicon pouring sealant has high thermal conductivity and lasting insulativity, but also avoids the phenomenon of particle sedimentation in the use or storage process, so that the quality of the pouring sealant between batches is kept uniform and stable, and meanwhile, the pouring sealant also has high and low temperature resistance, excellent mechanical properties and the like.

Description

Technical field

[0001] The invention belongs to the technical field of insulating materials, and specifically relates to a two-component silicone potting glue and an application method thereof. It is mainly used for potting the ends of the stator channel steel of a wind generator, and is also suitable for high-power electronic components, Potting protection for module power supplies and circuit boards that require high heat dissipation and temperature resistance. Background technique

[0002] Potting can give the motor and electronic devices integrity, so that internal components and circuits have good resistance to external shocks and vibrations, avoid direct exposure of internal components and circuits, and improve the waterproof, moisture-proof and insulating properties of electronic devices. After curing, epoxy encapsulant is brittle and has poor heat resistance. Compared with epoxy resin, silicone encapsulant is soft after curing, has good toughness and resistance to high an...

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