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Not-easy-to-crystallize and easy-to-clean high-efficiency silica sol polishing solution and preparation method thereof

A polishing liquid and silica sol technology, applied in the field of polishing materials for ultra-precision surfaces, can solve the problems of difficult cleaning of workpieces, easy drying and crystallization, etc., and achieve the effects of reducing volatility, difficult drying and crystallization, and strong suspension performance.

Active Publication Date: 2020-03-06
宁波日晟新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above deficiencies in the prior art, the purpose of the present invention is to provide a high-efficiency silica sol polishing solution that is not easy to crystallize and easy to clean, so as to solve the technical problems that the traditional silica sol polishing solution is easy to dry and crystallize during use, and the workpiece is difficult to clean. Simultaneously, the polishing liquid of the present invention has strong suspension performance, long-term storage without delamination, easy to use and high polishing efficiency and other excellent performances

Method used

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  • Not-easy-to-crystallize and easy-to-clean high-efficiency silica sol polishing solution and preparation method thereof

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preparation example Construction

[0038] Correspondingly, as the preparation method of the above-mentioned high-efficiency silica sol polishing liquid that is not easy to crystallize and is easy to clean, the preparation method comprises the following steps:

[0039] S1: Weigh 5-15 parts by weight of a water-soluble carrier, add it to 60-100 parts by weight of deionized water, then add 20-50 parts by weight of a silicon oxide polishing agent, and stir and mix evenly;

[0040] S2: Add 3-8 parts by weight of a complexing agent, further stir evenly, and finally add 1-5 parts by weight of an oxidant, adjust the pH value to 8-9, and stir well to obtain the high-efficiency silica sol that is not easy to crystallize and easy to clean Polishing fluid.

[0041] The sulfonated melamine formaldehyde resin of the present invention has excellent wetting and dispersing properties, reduces the amount of deionized water added in the polishing solution, thereby ensuring that the silica sol crystallizes and absorbs the polishin...

Embodiment 1

[0046] The high-efficiency silica sol polishing solution that is not easy to crystallize and easy to clean in this embodiment is composed of the following raw materials in parts by weight: 30 parts by weight of a silicon oxide polishing agent, 10 parts by weight of a water-soluble carrier that reduces the volatility of the polishing solution , 5 parts by weight of a complexing agent for cleaning, 3 parts by weight of an oxidizing agent and 60 parts by weight of deionized water.

[0047] The silicon oxide polishing agent is added to the polishing solution in the form of nanocomposite particles with a core-shell structure. The core-shell nanocomposite particles are silicon dioxide in the core and sulfonated melamine formaldehyde resin in the shell.

[0048] The water-soluble carrier is a composition of glycerol and polymer polyol with a mass ratio of 3:1.

[0049] The nitrogen-containing organic small molecule complexing agent is nitroxide free radical piperidinol.

[0050] The...

Embodiment 2

[0052] The high-efficiency silica sol polishing solution that is not easy to crystallize and easy to clean in this embodiment is composed of the following raw materials in parts by weight: 20 parts by weight of a silicon oxide polishing agent, and 5 parts by weight of a water-soluble carrier that reduces the volatility of the polishing solution 3 parts by weight of complexing agent for cleaning, 1 part by weight of oxidant and 50 parts by weight of deionized water.

[0053] The silicon oxide polishing agent is added to the polishing solution in the form of nanocomposite particles with a core-shell structure. The core-shell nanocomposite particles are silicon dioxide in the core and sulfonated melamine formaldehyde resin in the shell.

[0054] The water-soluble carrier is a composition of diethylene glycol and polymer polyol with a mass ratio of 2.5:1.

[0055] The nitrogen-containing organic small molecule complexing agent is a composition of hydroxymethoxy 4-methylphenyl-nitr...

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Abstract

The present invention discloses a not-easy-to-crystallize and easy-to-clean high-efficiency silica sol polishing solution. The silica sol polishing solution is prepared from the following raw materials in parts by weight: 20-40 parts by weight of a silicon oxide polishing agent, 5-15 parts by weight of a water-soluble carrier for reducing volatility of a polishing solution, 3-8 parts by weight ofa complexing agent for assisting cleaning, 1-5 parts by weight of an oxidant and 50-80 parts by weight of deionized water. The polishing solution solves technical problems that the traditional silicasol polishing solution is easy to dry and crystallize in the using process, and workpieces are difficult to clean; and meanwhile, the polishing solution has excellent performances of strong suspensionperformance, no delamination after long-term storage, convenience in use, high polishing efficiency, etc. The present invention also discloses a preparation method of the not-easy-to-crystallize andeasy-to-clean high-efficiency silica sol polishing solution.

Description

technical field [0001] The invention relates to the technical field of polishing materials for ultra-precision surfaces, in particular to a high-efficiency silica sol polishing solution that is not easy to crystallize and easy to clean and a preparation method thereof. Background technique [0002] The development goal of modern manufacturing industry is the intelligent manufacturing of Industry 4.0. The crown of intelligent manufacturing is ultra-precision manufacturing, and the pearl of the crown of ultra-precision surface is the processing of ultra-precision and non-damaged surface. For example, the manufacture of ultra-large integrated circuit chips has entered the 7-nanometer node. In this ultra-precision manufacturing process, the characteristics of the device are at the nanometer level, which is close to the human neuron system. The fabrication of state-of-the-art VLSI chips cannot be accomplished without the assurance of ultra-precise surface processing. At present,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09G1/02
CPCC09G1/02
Inventor 孙韬
Owner 宁波日晟新材料有限公司