Preparation method of low-modulus and high-strength resin adhesive film

A high-strength, resin glue technology, applied in the direction of epoxy resin glue, adhesive, film/sheet adhesive, etc., can solve problems such as crack resistance, low impact resistance, poor impact resistance, and easy cracking , to achieve the effect of reducing tensile modulus, easy reaction steps, and improving mechanical strength

Inactive Publication Date: 2020-03-17
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the cured product of pure epoxy resin has a high cross-linked structure, and the cured material is brittle, has low crack resistance, impact resistance, and poor heat resistance, it cannot fully meet the requirements for high-performance materials in these fields. Therefore, it is necessary to modify the epoxy resin to enhance its toughness, thermal stability and electrical properties.
[0004] Epoxy resin adhesives are widely used. Although this adhesive material has many advantages, the connection density of a single epoxy resin is relatively high and the internal stress is relatively large. In this case, its impact resistance Relatively poor, prone to cracking

Method used

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  • Preparation method of low-modulus and high-strength resin adhesive film
  • Preparation method of low-modulus and high-strength resin adhesive film
  • Preparation method of low-modulus and high-strength resin adhesive film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This is achieved through the following steps:

[0032] Step a. Weigh 100g of ADEKA special epoxy resin and add it into the glass beaker, and add 3g of thermoplastic polyurethane elastomer component inside, the addition amount is 3% of the total mass of ADEKA special epoxy resin. Put the mixed system in an oil bath and raise the temperature to 180°C, and stir it with a timing electric stirrer for about 90 minutes until the thermoplastic polyurethane elastomer component is completely dissolved and dispersed to obtain a blend;

[0033] Step b, take 8g of ordinary bisphenol A type epoxy resin, the addition amount is 8% of the total mass of ADEKA special epoxy resin, adjust the temperature of the blend prepared in step a to 150 ° C, and weigh the ordinary Add bisphenol A epoxy resin to it, and stir with a timing electric mixer for about 90 minutes until the common bisphenol A epoxy resin components are completely dissolved and dispersed to obtain a clear and transparent blen...

Embodiment 2

[0038] Proportion: ADEKA special epoxy resin 100g; thermoplastic polyurethane elastomer 7g; ordinary bisphenol A epoxy resin 8g; dicyandiamide 4g; UR300 organic urea 2g.

[0039] The specific preparation method, curing method and mechanical property test of the resin film provided in this example are the same as in Example 1. The tensile strength, tensile modulus and elongation at break of the obtained resin film cured product are shown in Table 1.

Embodiment 3

[0041] Proportion: ADEKA special epoxy resin 100g; thermoplastic polyurethane elastomer 15g; ordinary bisphenol A epoxy resin 8g; dicyandiamide 4g; UR300 organic urea 2g.

[0042] The specific preparation method, curing method and mechanical property test of the resin film provided in this example are the same as in Example 1. The tensile strength, tensile modulus and elongation at break of the obtained resin film cured product are shown in Table 1.

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Abstract

The invention provides a preparation method of a low-modulus and high-strength resin adhesive film. The adhesive film comprises 100 g of ADEKA special epoxy resin, 3-30 g of a thermoplastic elastomer,8-10 g of a common epoxy resin, 4 g of a curing agent and 2 g of a promoter. The preparation method comprises the following steps: blending the thermoplastic elastomer with the ADEKA special epoxy resin at 180 DEG C, cooling the obtained mixture to 150-155 DEG C, mixing the epoxy resin, cooling the mixed resin to 60-70 DEG C, pre-curing the mixed resin with the curing agent, performing blending,and carrying out calendering molding on the carrier in order to prepare the adhesive film. The adhesive film prepared in the invention has the characteristics of high temperature resistance, low modulus, high strength and high toughness, and is mainly used between layers of a composite material laminated plate in the aerospace field to improve the bearing capacity of the laminated plate.

Description

technical field [0001] The invention belongs to the technical field of composite material research, and in particular relates to a method for preparing a low-modulus high-strength resin film. Background technique [0002] Polyurethane elastomer is a variety of polyurethane synthetic materials. Because its structure has two segments, soft and hard, it can be molecularly designed to endow the material with excellent properties such as high strength, good toughness, wear resistance, and oil resistance. It has both The high elasticity of rubber has the rigidity of plastic, so it is called "wear-resistant rubber". Due to its extremely excellent performance, it is widely used in many fields such as automobiles, construction, mining, aerospace, electronics, medical equipment, sports products, etc., and has become a synthetic material product with great development prospects. [0003] Because epoxy resin has the advantages of outstanding mechanical properties and thermal properties...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J175/04C09J7/10C09J7/30
CPCC08L2205/025C08L2205/03C08L2205/04C08L2207/04C09J163/00C09J7/10C09J7/30C08L75/04C08L63/00
Inventor 李书欣王金港冀运东曹东风
Owner WUHAN UNIV OF TECH
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