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High-thermal-conductivity boron nitride/epoxy resin composite material and preparation method and application thereof

A technology of epoxy resin and composite materials, which is applied in the field of electronic packaging materials, can solve the problem of low resistivity of composite materials, achieve the effects of improving interface matching and bonding strength, improving thermal conductivity, and improving thermal conductivity

Inactive Publication Date: 2020-03-27
CENT SOUTH UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resistivity of the composite material made by simply heating and mixing boron nitride and polypropylene by the above method is not high.

Method used

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  • High-thermal-conductivity boron nitride/epoxy resin composite material and preparation method and application thereof
  • High-thermal-conductivity boron nitride/epoxy resin composite material and preparation method and application thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0035] Step 1: Weigh 3g of the original boron nitride powder and add it to 600mL of a mixed solution of isopropanol and deionized water (volume ratio is 1:1), and perform peeling by ultrasonication in a water bath for 12 hours;

[0036] Step 2: Centrifuge the ultrasonically treated upper layer dispersion at a speed of 2000 rpm for 20 minutes to remove residual unstripped boron nitride, then vacuum filter the upper layer centrifugal liquid, and dry it at 100°C for 10 hours to obtain boron nitride Nanosheets;

[0037] Step 3: adding a silane coupling agent with a mass of 9% (0.18 g) of boron nitride nanosheets to 300 mL of ethanol aqueous solution, and magnetically stirring the mixed solution at 60° C. for 30 min to hydrolyze the silane coupling agent;

[0038] Step 4: Add 2 g of boron nitride nanosheet powder to the solution in step 3, and perform magnetic stirring at 70° C. for 10 h again to functionalize the boron nitride nanosheets;

[0039] Step 5: Filter the dispersion li...

Embodiment 2

[0047] Step 1: Weigh 3g of original boron nitride powder and add it to a mixed solution of 600ml of isopropanol and deionized water (volume ratio is 1:1), and perform peeling by ultrasonication in a water bath for 12 hours; the particle size of the original boron nitride powder is 1 ~2μm; ultrasonic power is 180W, ultrasonic time is 12h;

[0048] Step 2: Centrifuge the ultrasonically treated upper layer dispersion at a speed of 2000 rpm for 20 minutes to remove residual unstripped boron nitride, then vacuum filter the upper layer centrifugal liquid, and dry it at 100°C for 10 hours to obtain boron nitride Nanosheets; the planar size of the obtained boron nitride nanosheets is 50-500nm, and the average size of 100 samples is about 301nm; the thickness is 2-3nm;

[0049] Step 3: adding a silane coupling agent with a mass of 3% (0.06g) of boron nitride nanosheets to 100ml of ethanol aqueous solution, and magnetically stirring the mixed solution at 60° C. for 30 minutes to hydroly...

Embodiment 3

[0062] Step 1: Weigh 3g of original boron nitride powder and add it to 600ml of a mixed solution of isopropanol and deionized water (volume ratio is 1:1), and perform peeling by ultrasonication in a water bath for 12 hours;

[0063] Step 2: Centrifuge the ultrasonically treated upper layer dispersion at a speed of 2000 rpm for 20 minutes to remove residual unstripped boron nitride, then vacuum filter the upper layer centrifugal liquid, and dry it at 100°C for 10 hours to obtain boron nitride Nanosheets;

[0064] Step 3: adding 0.05% (0.001g) silane coupling agent of boron nitride nanosheets into 20 ml of ethanol aqueous solution, and stirring the mixed solution magnetically at 60° C. for 30 min to hydrolyze the silane coupling agent;

[0065] Step 4: Add 2 g of boron nitride nanosheet powder to the solution in step 3, and then perform magnetic stirring at 90° C. for 5 hours to functionalize the boron nitride nanosheets;

[0066] Step 5: Filter the dispersion obtained in Step ...

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Abstract

The invention provides a high-thermal-conductivity boron nitride / epoxy resin composite material and a preparation method and application thereof. The method comprises the steps that firstly, boron nitride powder is subjected to ultrasonic stripping, functionalized with a silane coupling agent solution and then dispersed in isopropanol and a silane functionalized boron nitride nanosheet solution isobtained; the nanosheet solution is mixed with an epoxy resin solution, the mixed solution is heated, stirred and cooled to obtain a mixture, then the mixture is spin-coated on a silicon wafer or a glass sheet and finally pre-curing, hot-pressing and curing are performed to obtain the high-thermal-conductivity boron nitride / epoxy resin composite material. The thermal conductivity of the compositematerial is about 5.86 W / mK, the dynamic thermodynamic property, the glass transition temperature and other properties are also improved, the heat dissipation performance of a power device can be effectively improved when the composite material is applied to the high-power device as a thermal interface material and the overall reliability of the device in use is also greatly improved.

Description

technical field [0001] The invention relates to the technical field of electronic packaging materials, in particular to a high thermal conductivity boron nitride / epoxy resin composite material and its preparation method and application. Background technique [0002] Due to the miniaturization and high performance requirements of electronic devices, the heat accumulation caused by high integration density and high power density will seriously affect the performance and life of electronic devices. As a thermal conduction path for heat to be exported from the heat source to the heat sink, thermal interface materials play a key role in the thermal management capabilities of electronic devices with their thermal conductivity and mechanical properties. Polymer-based composites are currently the most widely used microelectronic packaging materials due to their ease of processing and low cost. Usually polymers have low thermal conductivity (about 0.2W / mK), so it is necessary to add...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K9/06C08K3/38C08J5/18
CPCC08J5/18C08J2363/00C08K3/38C08K9/06C08K2003/385C08K2201/011C08L2203/206C08L63/00
Inventor 李军辉金忠刘湛刘小鹤彭启发
Owner CENT SOUTH UNIV
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