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One-component solvent-free adhesive for double-barrier retort material compounding and its preparation method and application

A one-component, adhesive technology for use in adhesives, adhesive types, polyurea/polyurethane adhesives, etc.

Active Publication Date: 2021-12-10
康达新材料(集团)股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] One of the technical problems solved by the present invention is to propose a single-component solvent-free adhesive for the compounding of double-barrier cooking materials to solve the problem of compounding between double-barrier cooking materials PET, PA, aluminum foil, RCPP, etc.
It is required that the compounded material has a good appearance without problems such as white spots and bubbles; at the same time, it can withstand cooking at 125°C for more than 40 minutes

Method used

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  • One-component solvent-free adhesive for double-barrier retort material compounding and its preparation method and application
  • One-component solvent-free adhesive for double-barrier retort material compounding and its preparation method and application

Examples

Experimental program
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Effect test

Embodiment 1

[0034] Put 200 parts of ethylene glycol, 150 parts of glycerol and 140 parts of 2-methyl-1,3 propanediol into the reaction kettle, add 700 parts of adipic acid while stirring, and heat to 120 ° C ~ 160 °C under nitrogen protection. ℃ for 4 hours, then raise the temperature to 200℃~250℃ for 5 hours, when the acid value is less than 35mgKOH / g, preferably less than 15mgKOH / g, start vacuuming, gradually increase the vacuum degree -0.1MPa, and finally cool down to obtain a hydroxyl value of 160mgKOH / g g of polyester polyol 1.

Embodiment 2

[0036] Heat 45 parts of polyoxypropylene diol with a molecular weight of 2000, 12 parts of polyoxypropylene triol with a molecular weight of 400, and 3 parts of bisphenol A modified diol with a molecular weight of 350 to 110-120°C for vacuum dehydration for 1.5h~ 2.5 hours, cool down to 60°C, add 38 parts of diphenylmethane diisocyanate, heat up to 110°C for 2 hours, add 1 part of curing speed modifier DMDEE, add 1 part of leveling agent BYK323 and discharge to obtain isocyanate-terminated polyurethane prepolymer P1.

Embodiment 3

[0038] 40 parts of polyester polyol 1 prepared in Example 1, 15 parts of polyoxypropylene diol with a molecular weight of 400, and 10 parts of bisphenol A modified diol with a molecular weight of 350 were heated to 110-120°C for vacuum dehydration for 1.5 h~2.5h, cool down to below 100°C, add 2 parts of aminosilane coupling agent, cool down to 60°C while stirring, add 50 parts of diphenylmethane diisocyanate, raise the temperature to 110°C for 2 hours, add 1 part of curing speed adjustment Agent N-ethylmorpholine and 2 parts of leveling agent BKY388 were discharged to obtain isocyanate-terminated polyurethane prepolymer P2.

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Abstract

The invention discloses a one-component solvent-free adhesive for compounding double-barrier cooking materials. The adhesive is a single-component end-blocked with isocyanate. , aluminum foil, RCPP, etc. between the compound. It is required that the compounded material has a good appearance without problems such as white spots and bubbles; at the same time, it can withstand cooking at 125°C for more than 40 minutes. The one-component solvent-free polyurethane adhesive is an isocyanate-terminated prepolymer prepared from isocyanate, general-purpose polyol, bisphenol A modified polyol and auxiliary agents. The invention also discloses the preparation method and application of the one-component solvent-free polyurethane adhesive. The temperature of lamination coating is 60℃~100℃, which should be adjusted according to the usage requirements of different materials. The invention has the advantages of less glue per unit area, low glue material consumption cost, good safety, no risk of fire and explosion, no explosion-proof measures for solvents, and good for environmental protection.

Description

technical field [0001] The invention relates to an adhesive suitable for compounding of double-barrier cooking materials, in particular to a single-component solvent-free adhesive for compounding of double-barrier cooking materials and its preparation method and application. Background technique [0002] With the increasing development of the commodity economy, the packaging industry is advancing rapidly at a pace exceeding the economic growth rate of the same period, especially the flexible packaging industry is developing rapidly in the direction of solvent-free. In addition to conventional general-purpose solvent-free adhesives and solvent-free adhesives for ordinary plastic / plastic cooking materials, the current application is relatively mature. The compounding of some double-barrier materials containing aluminum foil or aluminum-plated materials is also gradually developing in the direction of solvent-free. The biggest problem with conventional two-component solvent-fr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/08C09J175/06C08G18/66C08G18/48C08G18/42C08G18/32C08G18/28
CPCC09J175/08C09J175/06C08G18/4812C08G18/4829C08G18/4241C08G18/4825C08G18/3215C08G18/4018C08G18/6674C08G18/664C08G18/289
Inventor 赵有中卫艳玲李云华邹斌
Owner 康达新材料(集团)股份有限公司